Pyridinium-based compound, epoxy resin composition comprising same, and apparatus manufactured using same

Patent metadata

Field	Value
Publication number	US-2016333136-A1
Application number	US-201415111337-A
Country	US
Kind code	A1
Filing date	May 9, 2014
Priority date	Jan 14, 2014
Publication date	Nov 17, 2016
Grant date	—

Abstract

The present invention relates to a pyridinium-based compound of chemical formula 1, an epoxy resin composition comprising the same, and an apparatus manufactured by using the same.

First claim

1 . A pyridinium-based compound represented by Formula 1:

(wherein, in Formula 1, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are each independently hydrogen, a hydroxyl group, an amino group (—NH 2 ), a nitro group (—NO 2 ), a cyano group (—CN), a C 1 to C 10 alkyl group, a C 6 to C 20 aryl group, a C 1 to C 10 alkoxy group, a C 3 to C 10 cycloalkyl group, R—C(═O)—* (where R is a C 1 to C 10 alkyl group, and * is a binding site between elements), or R′—SO 2 —* (where * is a binding site between elements, and R′ is a C 1 to C 10 alkyl group or C 6 to C 20 aryl group);
R 11 and R 12 are each independently hydrogen, a C 1 to C 10 alkyl group, a C 6 to C 20 aryl group, or a hydroxyl group; and
X is *—NR a R b (where R a and R b are each independently hydrogen, a C 1 to C 10 alkyl group, a C 6 to C 20 aryl group, a C 1 to C 10 alkoxy group, a C 6 to C 20 aryloxy group, or a C 7 to C 20 arylalkyl group, and * is a binding site between elements) or *—OR c (where R c is hydrogen, a C 1 to C 10 alkyl group, a C 6 to C 20 aryl group, a C 1 to C 10 alkoxy group, a C 6 to C 20 aryloxy group, or a C 7 to C 20 arylalkyl group, and * is a binding site between elements).

2 . The pyridinium-based compound according to claim 1 , wherein the pyridinium-based compound is represented by any one of Formulas 7 to 12:

3 . A curing catalyst represented by Formula 1:

(wherein, in Formula 1, R 1 , R 2 , R 3 , R 4 , R 5 , R 6 , R 7 , R 8 , R 9 , and R 10 are each independently hydrogen, a hydroxyl group, an amino group (—NH 2 ), a nitro group (—NO 2 ), a cyano group (—CN), a C 1 to C 10 alkyl group, a C 6 to C 20 aryl group, a C 1 to C 10 alkoxy group, a C 3 to C 10 cycloalkyl group, R—C(═O)—* (where R is a C 1 to C 10 alkyl group, and * is a binding site between elements), or R′—SO 2 —* (where * is a binding site between elements, and R′ is a C 1 to C 10 alkyl group or C 6 to C 20 aryl group);
R 11 and R 12 are each independently hydrogen, a C 1 to C 10 alkyl group, a C 6 to C 20 aryl group, or a hydroxyl group; and
X is *—NR a R b (where R a and R b are each independently hydrogen, a C 1 to C 10 alkyl group, a C 6 to C 20 aryl group, a C 1 to C 10 alkoxy group, a C 6 to C 20 aryloxy group, or a C 7 to C 20 arylalkyl group, and * is a binding site between elements) or *—OR c (where R c is hydrogen, a C 1 to C 10 alkyl group, a C 6 to C 20 aryl group, a C 1 to C 10 alkoxy group, a C 6 to C 20 aryloxy group, or a C 7 to C 20 arylalkyl group, and * is a binding site between elements).

4 . An epoxy resin composition, comprising:
an epoxy resin, a curing agent, and a curing catalyst, wherein the curing catalyst includes the pyridinium-based compound according to claim 1 .

5 . The epoxy resin composition according to claim 4 , wherein the epoxy resin includes an epoxy resin having two or more epoxy groups and one or more hydroxyl groups per molecule.

6 . The epoxy resin composition according to claim 4 , wherein the curing agent includes a phenol resin.

7 . The epoxy resin composition according to claim 4 , wherein the pyridinium-based compound is present in an amount of about 0.01 wt % to about 5 wt % in the epoxy resin composition.

8 . The epoxy resin composition according to claim 4 , wherein the pyridinium-based compound is present in an amount of about 10 wt % to about 100 wt % in the curing catalyst.

9 . The epoxy resin composition according to claim 4 , further comprising an inorganic filler.

10 . The epoxy resin composition according to claim 9 , comprising: about 2 wt % to about 17 wt % of the epoxy resin; about 0.5 wt % to about 13 wt % of the curing agent; about 70 wt % to about 95 wt % of the inorganic filler fillers; and about 0.01 wt % to about 5 wt % of the curing catalyst.

11 . An epoxy resin composition for encapsulating a semiconductor device comprising the epoxy resin composition according to claim 4 .

12 . An apparatus manufactured using the epoxy resin composition according to claim 4 .

Assignees

• Samsung Sdi Co Ltd

Inventors

• Lee Dong Hwan
• Kim Min Gyum
• Kim Jung Seob
• Cheon Jin Min
• Cheon Hwan Sung
• Han Seung

Classifications

• B01J31/02

  containing organic compounds or metal hydrides · CPC title

• C07D213/84 Primary

  Nitriles · CPC title

• C08G59/621

  Phenols · CPC title

• C07D213/30

  Oxygen atoms · CPC title

• C07D213/26

  Radicals substituted by halogen atoms or nitro radicals · CPC title