Method for producing substrates

US2016332280A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016332280-A1
Application numberUS-201615153327-A
CountryUS
Kind codeA1
Filing dateMay 12, 2016
Priority dateMay 13, 2015
Publication dateNov 17, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Proposed herein is a method for producing substrates, particularly those of synthetic quartz glass, while saving the substrate surface from killer defects without resorting to any large-scale apparatus and precision polishing plate, thereby reducing defectives and improving yields more than in production with conventional facilities. The method for producing substrates by polishing, includes steps of placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate, bringing an upper polishing plate into contact with the surface of the substrate stocks, with the surface of the substrate stocks being coated with an impact-absorbing liquid and the lower polishing plate being rotated, and rotating the upper and lower polishing plates, with the surface of the substrate stocks being accompanied by a polishing slurry.

First claim

Opening claim text (preview).

1 . A method for producing substrates by polishing, comprising the steps of: placing substrate stocks individually in work holes formed in a carrier on a lower polishing plate, bringing an upper polishing plate into contact with the surface of said substrate stocks, with the surface of said substrate stocks being coated with an impact-absorbing liquid and said lower polishing plate being rotated, and rotating said upper and lower polishing plates, with the surface of said substrate stocks being accompanied by a polishing slurry. 2 . The method for producing substrates of claim 1 , wherein said upper polishing plate is brought into contact with the surface of said substrate stocks, with said lower polishing plate rotating at 1 rpm to 4 rpm. 3 . The method for producing substrates of claim 1 , wherein said impact-absorbing liquid is an aqueous solution containing at least one species selected from glycols, polyacrylic acid and derivatives thereof, poly(meth)acrylic acid and derivatives thereof, diethanolamine, and triethanolamine. 4 . The method for producing substrates of claim 1 , wherein said impact-absorbing liquid has a viscosity of 10 mPa·s to 100 mPa·s at 20° C. 5 . The method for producing substrates of claim 1 , wherein said upper polishing plate is lowered at a rate of 5 mm/second to 20 mm/second until it comes into contact with the surface of substrate stocks. 6 . The method for producing substrates of claim 1 , wherein said polishing slurry is an aqueous dispersion containing at least one species of abrasive grains selected from the group consisting of alumina abrasive grains, silicon carbide abrasive grains, and zirconium oxide abrasive gains. 7 . The method for producing substrates of claim 1 , wherein said substrate stocks have a thickness of 0.1 mm to 7 mm before polishing. 8 . The method for producing substrates of claim 1 , wherein said substrate stocks are synthetic quartz glass. 9 . The method for producing substrates of claim 1 , wherein said polishing step corresponds to a lapping step.

Assignees

Inventors

Classifications

  • Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition (of general applicability for machine tools B23Q11/00; in general F16P) · CPC title

  • Accessories · CPC title

  • operating processes therefor · CPC title

  • for grinding thin, brittle parts, e.g. semiconductors, wafers (grinding edges of thin, brittle parts B24B9/065) · CPC title

  • B24B49/16Primary

    taking regard of the load · CPC title

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What does patent US2016332280A1 cover?
Proposed herein is a method for producing substrates, particularly those of synthetic quartz glass, while saving the substrate surface from killer defects without resorting to any large-scale apparatus and precision polishing plate, thereby reducing defectives and improving yields more than in production with conventional facilities. The method for producing substrates by polishing, inclu…
Who is the assignee on this patent?
Shinetsu Chemical Co
What technology area does this patent fall under?
Primary CPC classification B24B49/16. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Nov 17 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).