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Stacked ultrasound vibration device, manufacturing method for stacked ultrasound vibration device, and ultrasound medical apparatus
US2016332004A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016332004-A1 |
| Application number | US-201615218337-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 25, 2016 |
| Priority date | Jan 27, 2014 |
| Publication date | Nov 17, 2016 |
| Grant date | — |
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Abstract
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A stacked ultrasound vibration device includes a stacked piezoelectric body unit in which a plurality of piezoelectric bodies and a plurality of electrode layers are stacked and integrated, a first bonding material that bonds the plurality of piezoelectric bodies and melts at a first bonding temperature lower than a half of a Curie temperature of the plurality of piezoelectric bodies, and a second bonding material that bonds the stacked piezoelectric body unit and the two mass materials and melts at a second bonding temperature lower than the first bonding temperature and higher than a maximum temperature during driving.
First claim
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What is claimed is: 1 . A stacked ultrasound vibration device that comprises a plurality of piezoelectric bodies and mass material, the stacked ultrasound vibration device comprising: a stacked piezoelectric body unit in which the plurality of piezoelectric bodies and a plurality of electrode layers are stacked and integrated; a first bonding material that bonds the plurality of piezoelectric bodies and melts at a first bonding temperature lower than a half of a Curie temperat…
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Operations & Transport · mapped topic
- A61N7/00Primary
Human Necessities · mapped topic
Human Necessities · mapped topic
Human Necessities · mapped topic
Operations & Transport · mapped topic
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- What does patent US2016332004A1 cover?
- A stacked ultrasound vibration device includes a stacked piezoelectric body unit in which a plurality of piezoelectric bodies and a plurality of electrode layers are stacked and integrated, a first bonding material that bonds the plurality of piezoelectric bodies and melts at a first bonding temperature lower than a half of a Curie temperature of the plurality of piezoelectric bodies, and a sec…
- Who is the assignee on this patent?
- Olympus Corp
- What technology area does this patent fall under?
- Primary CPC classification A61N7/00. Mapped technology areas include Human Necessities.
- When was this patent published?
- Publication date Thu Nov 17 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).