Components of an electronic device and methods for their assembly
US-2024431057-A1 · Dec 26, 2024 · US
US2016330852A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016330852-A1 |
| Application number | US-201615217605-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 22, 2016 |
| Priority date | May 29, 2012 |
| Publication date | Nov 10, 2016 |
| Grant date | — |
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Methods and structures for forming anodization layers that protect and cosmetically enhance metal surfaces are described. In some embodiments, methods involve forming an anodization layer on an underlying metal that permits an underlying metal surface to be viewable. In some embodiments, methods involve forming a first anodization layer and an adjacent second anodization layer on an angled surface, the interface between the two anodization layers being regular and uniform. Described are photomasking techniques and tools for providing sharply defined corners on anodized and texturized patterns on metal surfaces. Also described are techniques and tools for providing anodizing resistant components in the manufacture of electronic devices.
Opening claim text (preview).
What is claimed is: 1 . An electronic device, comprising: a housing having a first wall defining a first surface and a second wall defining a second surface, the first surface non-parallel to the second surface, wherein the first surface and second surface meet at a chamfered edge having a mirror reflective finish; a primary anodization layer disposed over the first surface and the second surface; and a secondary anodization layer disposed over the chamfered edge. 2 . The electronic device of claim 1 , wherein the first surface and the second surface are blasted surfaces. 3 . The electronic device of claim 1 , wherein the secondary anodization layer has a different pore density than the primary anodization layer. 4 . The electronic device of claim 1 , wherein secondary anodization layer has a different average pore size than the primary anodization layer. 5 . The electronic device of claim 1 , wherein the primary anodization layer includes a first anodization portion disposed over the first surface and a second anodization portion disposed over the second surface, wherein a first angle between the first anodization portion and the secondary anodization layer is about equal to a second angle between the second anodization portion and the secondary anodization layer. 6 . The electronic device of claim 1 , wherein a thickness of the primary anodization layer is about the same as a thickness of the secondary anodization layer. 7 . The electronic device of claim 1 , wherein the first surface and the second surface are characterized as having a greater roughness than the chamfered edge. 8 . The electronic device of claim 1 , wherein the housing includes multiple metal sections separated by plastic coupling members. 9 . An electronic device, comprising: a housing having two metal sections coupled with a plastic coupling member, wherein each of the metal sections includes: sidewall surfaces that meet at a beveled edge, the beveled edge having a mirror reflective surface, a first anodization layer disposed over the sidewall surfaces, and a second anodization layer disposed over the mirror reflective surface. 10 . The electronic device of claim 9 , wherein a thickness of the first anodization layer differs from a thickness of the second anodization layer by about 5 micrometers or less. 11 . The electronic device of claim 9 , wherein and sidewall surfaces are characterized as having a greater roughness than the mirror reflective surface. 12 . The electronic device of claim 9 , wherein the beveled edge includes a highlighted portion, the highlighted portion characterized as a polished surface portion of at least one of the sidewall surfaces. 13 . The electronic device of claim 9 , wherein the first anodization layer has a different pore density than the second anodization layer. 14 . A housing for an electronic device, the housing comprising: a first metal section positioned at a first side of the housing; a second metal section positioned at a second side of the housing; a third metal section positioned between the first metal section and the second metal section, wherein a first plastic coupling member couples the third metal section with the first metal section, and a second plastic coupling member couples the third metal section to the second metal section, wherein each of the first metal section, the second metal section and the third metal section includes: sidewall surfaces that meet at a beveled edge, the beveled edge having a mirror reflective surface, a first anodization layer disposed over the sidewall surfaces, and a second anodization layer disposed over the mirror reflective surface. 15 . The housing of claim 14 , wherein the beveled edge extends around a perimeter of the housing. 16 . The housing of claim 14 , wherein corners of the housing have a curved geometry. 17 . The housing of claim 16 , wherein beveled edge extends around the curved corners. 18 . The housing of claim 14 , wherein the first metal section, the second metal section and the third metal section are composed of aluminum alloy. 19 . The housing of claim 14 , wherein the first anodization layer has a different pore density than the second anodization layer. 20 . The housing of claim 14 , wherein the sidewall surfaces are characterized as having a greater roughness than the mirror reflective surface.
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