Deposition apparatus

Patent metadata

Field	Value
Publication number	US-2016326630-A1
Application number	US-201615211233-A
Country	US
Kind code	A1
Filing date	Jul 15, 2016
Priority date	Mar 18, 2014
Publication date	Nov 10, 2016
Grant date	—

Abstract

This invention provides a deposition apparatus which forms a film on a substrate, comprising: a rotation unit configured to rotate a target about a rotating axis; a striker configured to generate an arc discharge; a driving unit configured to drive the striker so as to make a close state which the striker closes to a side surface around the rotating axis of the target to generate the arc discharge; and a control unit configured to control rotation of the target by the rotation unit so as to change a facing position on the side surface of the target facing the striker in the close state.

First claim

1 . A deposition apparatus which forms a film on a substrate, comprising:
a rotation unit configured to rotate a target about a rotating axis; a striker configured to generate an arc discharge; a driving unit configured to drive the striker so as to make a close state which the striker closes to a side surface around the rotating axis of the target to generate the arc discharge; and a control unit configured to control rotation of the target by the rotation unit so as to change a facing position on the side surface of the target facing the striker in the close state.

2 . The deposition apparatus according to claim 1 , further comprising a moving unit configured to move the target along the rotating axis,
wherein the control unit further controls movement of the target by the moving unit so as to change the facing position on the side surface of the target facing the striker in the close state.

3 . The deposition apparatus according to claim 2 , wherein the control unit controls the rotation of the target by the rotation unit and the movement of the target by the moving unit such that the target moves along the rotating axis after the target rotates once about the rotating axis.

4 . The deposition apparatus according to claim 2 , wherein the control unit controls the rotation of the target by the rotation unit and the movement of the target by the moving unit such that a locus on the side surface of the target at the facing position is formed into a spiral shape.

5 . The deposition apparatus according to claim 1 , wherein the control unit changes the facing position each time the arc discharge is generated.

6 . The deposition apparatus according to claim 1 , wherein the control unit changes the facing position each time a size of an arc spot generated in the target by the arc discharge becomes larger than a predetermined size.

7 . The deposition apparatus according to claim 1 , wherein the control unit changes the facing position such that a part of the arc spot generated in the target by the arc discharge overlaps.

8 . The deposition apparatus according to claim 1 , further comprising an anode arranged to face the target,
wherein the driving unit drives the striker such that a distance between the anode and the striker in the close state becomes constant.

9 . The deposition apparatus according to claim 1 , wherein the target has one of a columnar shape, a prismatic shape, a cylindrical shape, and a rectangular tube shape.

10 . A deposition apparatus which forms a film on a substrate, comprising:
a moving unit configured to move a target along an axis; a striker configured to generate an arc discharge; a driving unit configured to drive the striker so as to make a close state which the striker closes to a side surface around the axis of the target to generate the arc discharge; and a control unit configured to control movement of the target by the moving unit so as to change a facing position on the side surface of the target facing the striker in the close state.

Assignees

• Canon Anelva Corp

Inventors

• Atsumi Masahiro

Classifications

• H01J37/34

  operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34}) · CPC title

• H01J37/3417

  Arrangements · CPC title

• G11B5/8408

  protecting the magnetic layer · CPC title

• H01J37/32064

  Circuits specially adapted for controlling the arc discharge (for plasma torches H01H1/36) · CPC title

• C23C14/568

  Transferring the substrates through a series of coating stations (C23C14/562 takes precedence) · CPC title