Welding structural member and welding method
US-2016368080-A1 · Dec 22, 2016 · US
US2016322158A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016322158-A1 |
| Application number | US-201615205809-A |
| Country | US |
| Kind code | A1 |
| Filing date | Jul 8, 2016 |
| Priority date | Oct 31, 2011 |
| Publication date | Nov 3, 2016 |
| Grant date | — |
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A heavy-current transformer, in particular for a power source in order to provide a welding current of a resistance welding device, with at least one primary winding and at least one secondary winding with center tapping, and a transformer element, a contact plate and a secondary winding for such a heavy-current transformer as well as a method for the manufacturing thereof, reduce losses and improve efficiency by providing at least four contacts to form a multi-point contacting, the contacts being formed by four contact faces within which the at least one primary winding and the at least one secondary winding are arranged in a series/parallel connection.
Opening claim text (preview).
What is claimed is: 1 . A method for manufacturing a heavy-current transformer ( 12 ) comprising at least one primary winding ( 13 ) and at least one secondary winding ( 14 ) with surfaces ( 47 ) for contacting, wherein at first inner surfaces ( 47 ) of the at least one secondary winding ( 14 ) are connected with an I-beam ( 25 ) of electrically conductive material of the heavy-current transformer ( 12 ) with a first soldering material at a first, higher melting temperature (T S1 ), and subsequently at least one contact plate ( 29 ) of electrically conductive material is soldered with exterior surfaces ( 47 ) of the at least one secondary winding ( 14 ) with a second soldering material at a second melting temperature (T S2 ) that is lower as compared to the first melting temperature (T S1 ). 2 . The method according to claim 1 , wherein a circuit board ( 35 ) is connected with the at least one contact plate ( 29 ) with the first soldering material at the first, higher melting temperature (T S1 ). 3 . The method according to claim 2 , wherein after connecting the at least one contact plate ( 29 ) with the circuit board ( 35 ), circuit elements ( 24 ) are connected with the circuit board ( 35 ) and/or the contact plate ( 29 ), in particular with protrusions ( 36 ) on the contact plate ( 29 ), by using the first soldering material at the first, higher melting temperature (T S1 ). 4 . The method according to claim 3 , wherein the circuit elements ( 24 ), in particular the connections or the housings of the circuit elements ( 24 ), are connected with the surfaces ( 47 ) of the at least one secondary winding ( 14 ) with the second soldering material at the second, lower melting temperature (T S2 ). 5 . The method according to claim 1 , wherein a first soldering material at a first melting temperature between 220° C. and 300° C., in particular 260° C., and a second soldering material at a second melting temperature between 120° C. and 220° C., in particular 180° C., is used.
by metal fusion · CPC title
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