Method for manufacturing circuit board, method for manufacturing light-emitting device,and light-emitting device

Patent metadata

Field	Value
Publication number	US-2016315134-A1
Application number	US-201615098444-A
Country	US
Kind code	A1
Filing date	Apr 14, 2016
Priority date	Apr 22, 2015
Publication date	Oct 27, 2016
Grant date	—

Abstract

A circuit board in which damage to an electrode is reduced or a light-emitting device in which damage to an electrode is reduced is manufactured. A method for manufacturing the circuit board or the light-emitting device includes the following steps: preparing a processing member including a circuit and a terminal electrode over a first substrate, a separation layer over the terminal electrode, a bonding layer over the separation layer, and a second substrate over the bonding layer; forming a groove in the processing member using a blade capable of cutting processing by being rotated; and removing part of the separation layer, part of the bonding layer, and part of the second substrate to expose part of the terminal electrode.

First claim

What is claimed is:

1 . A method for manufacturing a circuit board, comprising the steps of:
forming a processing member comprising a circuit and a terminal electrode over a first substrate, a separation layer over the terminal electrode, a bonding layer over the separation layer, and a second substrate over the bonding layer; forming a groove in the processing member by rotating a blade; and removing part of the separation layer, part of the bonding layer, and part of the second substrate to expose part of the terminal electrode.

2 . The method for manufacturing a circuit board, according to claim 1 ,
wherein the groove comprises a first groove and a second groove that have different depths.

3 . The method for manufacturing a circuit board, according to claim 2 ,
wherein the part of the separation layer, the part of the bonding layer, and the part of the second substrate are positioned in a region surrounded by the first groove and the second groove.

4 . The method for manufacturing a circuit board, according to claim 1 ,
wherein the second substrate is flexible.

5 . The method for manufacturing a circuit board, according to claim 2 ,
wherein at least part of the first groove and at least part of the second groove overlap with the separation layer.

6 . The method for manufacturing a circuit board, according to claim 2 ,
wherein the second groove is deeper than the first groove.

7 . The method for manufacturing a circuit board, according to claim 2 ,
wherein the first groove is formed in the second substrate, and wherein the second groove is formed in the second substrate, the bonding layer, and the separation layer.

8 . The method for manufacturing a circuit board, according to claim 3 ,
wherein a top shape of the region surrounded by the first groove and the second groove has a plurality of corners, and wherein at least one of the plurality of corners has a round shape.

9 . A method for manufacturing a circuit board, comprising the steps of:
forming a processing member comprising a circuit and a terminal electrode over a first substrate, a separation layer over the terminal electrode, a bonding layer over the separation layer, and a second substrate over the bonding layer; forming a first groove and a second groove that have different depths in the processing member by rotating a blade; and removing part of the separation layer, part of the bonding layer, and part of the second substrate that are positioned in a region surrounded by the first groove and the second groove to expose the terminal electrode, wherein the second substrate is flexible.

10 . The method for manufacturing a circuit board, according to claim 9 ,
wherein at least part of the first groove and at least part of the second groove overlap with the separation layer.

11 . The method for manufacturing a circuit board, according to claim 9 ,
wherein the second groove is deeper than the first groove.

12 . The method for manufacturing a circuit board, according to claim 9 ,
wherein the first groove is formed in the second substrate, and wherein the second groove is formed in the second substrate, the bonding layer, and the separation layer.

13 . The method for manufacturing a circuit board, according to claim 9 ,
wherein a top shape of the region surrounded by the first groove and the second groove has a plurality of corners, and wherein at least one of the plurality of corners has a round shape.

14 . A method for manufacturing a light-emitting device, comprising the steps of:
providing a first peeling layer over a first surface of a first substrate; providing a first insulating layer over the first peeling layer; providing a terminal electrode over the first insulating layer; providing a second insulating layer over the first insulating layer and the terminal electrode; removing part of the second insulating layer to provide an opening; providing a light-emitting element and a separation layer over the second insulating layer; providing a second peeling layer over a second surface of a second substrate; providing a third insulating layer over the second peeling layer; overlapping the first substrate and the second substrate with a bonding layer interposed between the first substrate and the second substrate so that the first surface faces the second surface; separating the first substrate from the first insulating layer together with the first peeling layer; providing a third substrate so that the third substrate overlaps with the first insulating layer; separating the second substrate from the third insulating layer together with the second peeling layer; providing a fourth substrate so that the fourth substrate overlaps with the third insulating layer; forming a first groove in the fourth substrate and a second groove in the fourth substrate, the third insulating layer, the bonding layer, and the separation layer by rotating a blade; and removing part of the separation layer, part of the bonding layer, and part of the second substrate that are positioned in a region surrounded by the first groove and the second groove to expose the terminal electrode, wherein at least part of the first groove and at least part of the second groove overlap with part of the separation layer, and wherein the second groove is deeper than the first groove.

15 . The method for manufacturing a light-emitting device, according to claim 14 ,
wherein the fourth substrate is flexible.

16 . The method for manufacturing a light-emitting device, according to claim 14 ,
wherein a top shape of the region surrounded by the first groove and the second groove is a rectangle, and wherein at least one corner of the rectangle has a round shape.

17 . A method for manufacturing an electronic device comprising the circuit board, comprising the step of providing the circuit board in a housing,
wherein the circuit board is manufactured by the method for manufacturing a circuit board, according to claim 1 , and wherein the electronic device comprises at least one of an antenna, a battery, a speaker, a microphone, and an operation button.

18 . A method for manufacturing an electronic device comprising the circuit board, comprising the step of providing the circuit board in a housing,
wherein the circuit board is manufactured by the method for manufacturing a circuit board, according to claim 9 , and wherein the electronic device comprises at least one of an antenna, a battery, a speaker, a microphone, and an operation button.

19 . A method for manufacturing an electronic device comprising the light-emitting device, comprising the step of providing the light-emitting device in a housing,
wherein the light-emitting device is manufactured by the method for manufacturing a light-emitting device, according to claim 14 , and wherein the electronic device comprises at least one of an antenna, a battery, a speaker, a microphone, and an operation button.

Assignees

• Semiconductor Energy Lab

Inventors

• Nishido Yusuke
• Sakuishi Tatsuya

Classifications

• Y02E10/549

  Organic PV cells · CPC title

• H05K1/11

  Printed elements for providing electric connections to or between printed circuits · CPC title

• H05K3/0052

  Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards · CPC title

• H05K3/361

  Assembling flexible printed circuits with other printed circuits · CPC title

• H05K2203/0228

  Cutting, sawing, milling or shearing · CPC title