Thermally stable polycrystalline diamond with enhanced attachment joint

US2016312540A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016312540-A1
Application numberUS-201315038718-A
CountryUS
Kind codeA1
Filing dateDec 23, 2013
Priority dateDec 23, 2013
Publication dateOct 27, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present disclosure relates to an industrial device, such as a drill bit including a thermally stable polycrystalline diamond (TSP) table coupled to a substrate via an attachment joint, with at least one attachment material located in the attachment joint. At least one of the attachment materials includes a metal or metal alloy and an additive material having a hardness higher than the metal or metal alloy or a coefficient of thermal expansion lower than that of the metal or metal alloy.

First claim

Opening claim text (preview).

1 . A thermally stable polycrystalline diamond (TSP) element comprising a TSP table coupled to a substrate at an attachment joint via at least one composite attachment material, wherein the at least one composite attachment material comprises a metal or metal alloy and further includes an additive material having a coefficient of thermal expansion (CTE) lower than that of the metal or metal alloy. 2 . The TSP element of claim 1 , wherein the composite attachment material comprises a braze alloy. 3 . The TSP element of claim 2 , wherein the braze alloy comprises an active braze alloy. 4 . The TSP element of claim 1 , wherein the additive material comprises tungsten, tungsten carbide, diamond grit, steel, or another material with a CTE lower than the CTE of the metal or metal alloy. 5 . The TSP element of claim 1 , further comprising at least one additional attachment material. 6 . The TSP element of claim 1 , wherein the at least one additional attachment material comprises at least one additional composite attachment material. 7 . The TSP element of claim 5 , wherein at least one of the composite attachment material and at least one of the additional attachment material both comprise a braze alloy. 8 . The TSP element of claim 5 , wherein the at least one of the composite attachment material and at least one of the additional attachment material together comprise an active braze alloy positioned adjacent to the TSP table and a non-active braze alloy positioned adjacent to the substrate. 9 . The TSP element of claim 1 , wherein the additive material further has a hardness greater than that of the metal or metal alloy. 10 . The TSP element of claim 1 , wherein the TSP element is located in an earth-boring drill bit. 11 . A thermally stable polycrystalline diamond (TSP) element comprising a TSP table coupled to a substrate at an attachment joint via at least one composite attachment material, wherein the at least one composite attachment material comprises a metal or metal alloy and further includes an additive material having a hardness greater than that of the metal or metal alloy. 12 . The TSP element of claim 11 , wherein the composite attachment material comprises a braze alloy. 13 . The TSP element of claim 12 , wherein the braze alloy comprises an active braze alloy. 14 . The TSP element of claim 11 , wherein the additive material comprises tungsten, tungsten carbide, diamond grit, steel, or another material with a hardness greater than the hardness of the metal or metal alloy. 15 . The TSP element of claim 11 , further comprising at least one additional attachment material. 16 . The TSP element of claim 11 , wherein the at least one additional attachment material comprises at least one additional composite attachment material. 17 . The TSP element of claim 15 , wherein at least one of the composite attachment material and at least one of the additional attachment material both comprise a braze alloy. 18 . The TSP element of claim 15 , wherein the at least one of the composite attachment material and at least one of the additional attachment material together comprise an active braze alloy positioned adjacent to the TSP table and a non-active braze alloy positioned adjacent to the substrate. 19 . The TSP element of claim 11 , wherein the TSP element is located in an earth-boring drill bit. 20 . A method of manufacturing a thermally stable polycrystalline diamond (TSP) element comprising forming an attachment joint between a TSP table and a substrate via at least one composite attachment material, wherein the at least one composite attachment material comprises a metal or metal alloy and further includes an additive material having a coefficient of thermal expansion (CTE) lower than that of the metal or metal alloy or an additive material having a hardness greater than that of the metal or metal alloy. 21 . The method of claim 20 , wherein forming an attachment joint comprises heating an active braze alloy to a temperature at which the active braze ally reacts with carbon on an adjacent surface of the TSP table. 22 . The method of claim 20 , further comprising forming the attachment joint via both at least one composite attachment material and at least one additional attachment material.

Assignees

Inventors

Classifications

  • with preformed cutting elements mounted on a distinct support, e.g. polycrystalline inserts · CPC title

  • Forming at the joining interface or in the joining layer specific reaction phases or zones, e.g. diffusion of reactive species from the interlayer to the substrate or from a substrate to the joining interface, carbide forming at the joining interface · CPC title

  • B23K1/19Primary

    taking account of the properties of the materials to be soldered · CPC title

  • based on noble metals, e.g. silver · CPC title

  • E21B10/55Primary

    with preformed cutting elements · CPC title

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What does patent US2016312540A1 cover?
The present disclosure relates to an industrial device, such as a drill bit including a thermally stable polycrystalline diamond (TSP) table coupled to a substrate via an attachment joint, with at least one attachment material located in the attachment joint. At least one of the attachment materials includes a metal or metal alloy and an additive material having a hardness higher than the metal…
Who is the assignee on this patent?
Halliburton Energy Services Inc
What technology area does this patent fall under?
Primary CPC classification B23K1/19. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Oct 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).