Composition for forming passivation film, including resin having carbon-carbon multiple bond

Patent metadata

Field	Value
Publication number	US-2016311979-A1
Application number	US-201615202133-A
Country	US
Kind code	A1
Filing date	Jul 5, 2016
Priority date	Feb 9, 2012
Publication date	Oct 27, 2016
Grant date	—

Abstract

There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i):
T 0 -O  Formula (i)

(where T 0 is a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer:

The polymer may contain a unit structure of Formula (1):
L 1 -O-T 1 -O  Formula (1)

First claim

1 . A composition for forming a passivation film, comprising:
a polymer containing a unit structure of Formula (1):
L 1 -O-T 1 -O  Formula (1)

where
L 1 is a divalent group of Formula (3) or a divalent group of Formula (4):

where
R 1 , R 2 , and R 3 are independently a C 1-10 alkyl group, a C 1-4 fluoroalkyl group, a hydroxy group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxy group, a group containing a tertiary-carbon structure, a cyclic alkyl group, or a combination of these,
L 2 is a sulfonyl group, a carbonyl group, an ester group, an amido group, a sulfinyl group, or a sulfonamido group, and
each of n1, n2, and n3 is an integer of 0 to 4; and

T 1 is a fluoroalkylene group, a cyclic alkylene group, an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group, and that contains, at a terminal or in a side chain or the main chain, at least one group containing a structure of Formula (2-A), a structure of Formula (2-B), or both structures:

wherein
when Formula (2-A) and Formula (2-B) exist at a terminal or in a side chain of the polymer, they are the following monovalent groups: —C≡CH, —CH═CH 2 , respectively, and
when Formula (2-A) and Formula (2-B) exist in the main chain of the polymer, they are a divalent group or a tetravalent group, respectively.

2 . The composition for forming a passivation film according to claim 1 , wherein
the arylene group is a phenylene group, a naphthylene group, or an anthrylene group.

3 . The composition for forming a passivation film according to claim 1 , wherein
the polymer is a homopolymer having one type of unit structure.

4 . The composition for forming a passivation film according to claim 1 , wherein
the polymer is a copolymer having at least two types of unit structures.

5 . The composition for forming a passivation film according to claim 1 , comprising:
a polymer containing a unit structure of Formula (1) where T 1 is a group of Formula (5) below, a unit structure of Formula (1) where T 1 is a group of Formula (6) below, or a combination of these unit structures:

where
each of R 4 , R 5 , and R 6 is a C 1-10 alkyl group, a C 1-4 fluoroalkyl group, a hydroxy group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxy group, a group having a tertiary carbon atom, a cycloalkyl group, or a combination of any of these groups;
T 2 is a fluoroalkylene group, a cycloalkylene group, or a combination of these groups; and
each of n4, n5, and n6 is an integer of 0 to 4.

6 . The composition for forming a passivation film according to claim 1 , wherein
in Formula (3), R 1 is a group containing at least a cyano group, and n1 is an integer of 1 to 4.

7 . The composition for forming a passivation film according to claim 1 , wherein
in Formula (4), L 2 is a sulfonyl group or a carbonyl group.

8 . The composition for forming a passivation film according to claim 1 , further comprising:
a polymer containing a unit structure of Formula (7):
L 3 O-T 3 -O  Formula (7)

where L 3 is Formula (3) or Formula (4):

where R 1 , R 2 , R 3 , L 2 , n1, n2, and n3 are the same as defined above; and T 3 is an alkylene group, a sulfonyl group, a carbonyl group, a C 6-30 arylene group optionally having a substituent, or a combination of any of these groups.

9 . The composition for forming a passivation film according to claim 1 , wherein
the arylene group is a naphthylene group, or an anthrylene group.

10 . The composition for forming a passivation film according to claim 8 , wherein
T 3 is a group of Formula (8):

where
each of R 7 and R 8 is a C 1-10 alkyl group, a C 1-4 fluoroalkyl group, a hydroxy group, an allyl group, an allyloxy group, an amino group, a cyano group, a nitro group, an acyl group, an acyloxy group, a carboxy group, a group having a tertiary carbon atom, a cycloalkyl group, or a combination of any of these groups;
each of n7 and n8 is an integer of 0 to 4; and
T 4 is an alkylene group, a sulfonyl group, a carbonyl group, a C 6-30 arylene group optionally having a substituent, or a combination of any of these groups.

11 . The composition for forming a passivation film according to claim 1 , wherein
the group having a tertiary carbon atom is a tertiary butyl group.

12 . The composition for forming a passivation film according to claim 1 , wherein
a weight-average molecular weight of the polymer is from 500 to 5,000,000.

13 . The composition for forming a passivation film according to claim 1 , further comprising a solvent.

14 . A passivation film obtained by applying the composition for forming a passivation film as claimed in claim 1 to a substrate, and baking the substrate.

15 . The passivation film according to claim 14 , wherein
the passivation film is used as a film protecting an IC circuit formed on a wafer.

16 . The passivation film according to claim 14 , wherein
the passivation film is used as a film protecting an electrode formed on a rear surface of a wafer.

Assignees

• Nissan Chemical Ind Ltd

Inventors

• Tamura Mamoru
• Ogino Hiroshi
• Enomoto Tomoyuki

Classifications

• C08G75/20 Primary

  Polysulfones · CPC title

• C09D161/16

  of ketones with phenols · CPC title

• C09D171/12 Primary

  Polyphenylene oxides · CPC title

• C08G65/48

  Polymers modified by chemical after-treatment · CPC title

• C08G8/02

  of ketones · CPC title