Conductive micro-channel structure

US2016311704A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016311704-A1
Application numberUS-201514695148-A
CountryUS
Kind codeA1
Filing dateApr 24, 2015
Priority dateApr 24, 2015
Publication dateOct 27, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A conductive micro-channel structure includes a layer having layer edges and an electrode having first and second portions formed in or under the layer. One or more fluid micro-channels are formed in the layer, expose the first portion of the electrode, and extend to a layer edge to form a fluid port. A conductor micro-channel includes a solid conductor in the conductor micro-channel. The solid conductor is electrically conductive, is electrically connected to the second portion of the electrode, and extends from the second portion to a layer edge to form a conductor port.

First claim

Opening claim text (preview).

1 . A conductive micro-channel structure, comprising: a layer having layer edges; an electrode having first and second portions formed in or under the layer; one or more fluid micro-channels formed in the layer and exposing the first portion of the electrode, the fluid micro-channel extending to a layer edge to form a fluid port; and a conductor micro-channel including a solid conductor in the conductor micro-channel, the solid conductor electrically conductive, electrically connected to the second portion of the electrode, and extending from the second portion to a layer edge to form a conductor port. 2 . The micro-channel electrode structure of claim 1 , wherein the layer has a layer bottom, the fluid micro-channel has a fluid micro-channel bottom forming the bottom of the fluid micro-channel and a fluid micro-channel top forming the top of the fluid micro-channel, and the fluid micro-channel bottom and the electrode micro-channel bottom are substantially the same distance from the layer bottom. 3 . The micro-channel electrode structure of claim 1 , wherein the fluid micro-channel and the conductor micro-channel extend to the same layer edge. 4 . The micro-channel electrode structure of claim 1 , wherein the solid conductor passes under the fluid micro-channel or under the electrode. 5 . The micro-channel electrode structure of claim 1 , wherein the layer has first and second edges, the fluid micro-channel extends to the first edge and the conductor micro-channel extends to the second edge. 6 . The micro-channel electrode structure of claim 1 , further including a plurality of electrodes having first and second portions formed in or under the layer, a corresponding plurality of fluid micro-channels formed in the layer, each fluid micro-channel exposing the first portion of an electrode, and a plurality of conductor micro-channels, the conductor micro-channels each including a solid conductor electrically connected to the second portions of the electrodes that extends from the second portion to an edge of the layer. 7 . The micro-channel electrode structure of claim 1 , wherein the solid conductors are electrically connected. 8 . The micro-channel electrode structure of claim 1 , further including an electrical power source connected to the solid conductor. 9 . The micro-channel electrode structure of claim 1 , wherein one conductor micro-channel is electrically connected to the second portions of two or more electrodes. 10 . The micro-channel electrode structure of claim 1 , wherein the solid conductor includes a metal. 11 . The micro-channel electrode structure of claim 1 , wherein the solid conductor includes a cured conductive ink. 12 . The micro-channel electrode structure of claim 1 , wherein the solid conductor includes a plurality of electrically conductive particles. 13 . The micro-channel electrode structure of claim 1 , further including a plurality of layers according to claim 1 . 14 . The micro-channel electrode structure of claim 13 , wherein the plurality of layers forms a solid having faces that each correspond to a common edge of the layers. 15 . The micro-channel electrode structure of claim 13 , wherein the fluid micro-channels in the layers extend to a face and the solid conductors extend to the same face. 16 . The micro-channel electrode structure of claim 13 , wherein the fluid micro-channels in the layers extend to a face and the solid conductors extend to a different face. 17 . The micro-channel electrode structure of claim 1 , wherein the fluid micro-channels in the layers each extend to an input layer edge and to an output layer edge. 18 . The micro-channel electrode structure of claim 1 , wherein the fluid micro-channels are adapted to convey a fluid. 19 . The micro-channel electrode structure of claim 1 , wherein at least a portion of the fluid micro-channels are only partially filled with the solid conductor. 20 . A three-dimensional micro-channel structure, comprising: a plurality of layers arranged in a stack, each layer having one or more separate micro-channels having first, second, and third ports spatially aligned in the stack so that the first, second, or third ports each form one or more first, second, or third contiguous areas, respectively, that do not include other ports, and wherein each of the contiguous areas includes at least one port from each of two or more layers in the stack; and one or more pipes having an open side that each covers only a contiguous area.

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What does patent US2016311704A1 cover?
A conductive micro-channel structure includes a layer having layer edges and an electrode having first and second portions formed in or under the layer. One or more fluid micro-channels are formed in the layer, expose the first portion of the electrode, and extend to a layer edge to form a fluid port. A conductor micro-channel includes a solid conductor in the conductor micro-channel. The solid…
Who is the assignee on this patent?
Eastman Kodak Co
What technology area does this patent fall under?
Primary CPC classification C02F1/4604. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Oct 27 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).