Electrical wiring member production method, electrical wiring member forming material, electrical wiring member, electrical wiring board production method, electrical wiring board forming material, electrical wiring board, vibrator, electronic apparatus, and moving object

Patent metadata

Field	Value
Publication number	US-2016309585-A1
Application number	US-201615098679-A
Country	US
Kind code	A1
Filing date	Apr 14, 2016
Priority date	Apr 20, 2015
Publication date	Oct 20, 2016
Grant date	—

Abstract

A method for producing an electrical wiring member includes press-molding a composition containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle and a surface insulating layer covering the metal particle and containing a glass material as a main material, thereby obtaining a powder-compacted layer and irradiating the powder-compacted layer with an energy beam, thereby causing the irradiated regions to exhibit electrical conductivity.

First claim

What is claimed is:

1 . An electrical wiring member production method, which is a method for producing an electrical wiring member including an electrical wiring, comprising:
molding a composition containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle having electrical conductivity and a surface insulating layer located on the surface of the metal particle and containing a glass material as a main material, thereby obtaining a molded body; and irradiating the molded body with an energy beam, thereby forming the electrical wiring in the irradiated region.

2 . The electrical wiring member production method according to claim 1 , wherein the metal particles with an insulating layer are produced by attaching the glass material to the surface of each metal particle.

3 . The electrical wiring member production method according to claim 1 , wherein the molded body is obtained by pressurizing a mixture of the metal particles with an insulating layer and the resin material.

4 . The electrical wiring member production method according to claim 1 , wherein the metal particles are produced by a water atomization method or a spinning water atomization method.

5 . The electrical wiring member production method according to claim 1 , wherein the resin material contains an epoxy-based resin.

6 . An electrical wiring member forming material, which is a material comprising:
metal particles with an insulating layer, each of which is constituted by a metal particle having electrical conductivity and a surface insulating layer located on the surface of the metal particle and containing a glass material as a main material; and a resin material, and molded into a predetermined shape, wherein by irradiating a portion of the material with an energy beam, electrical conductivity is exhibited in the irradiated region so as to be able to form an electrical wiring.

7 . An electrical wiring member, comprising:
an insulating region containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle having electrical conductivity and a surface insulating layer located on the surface of the metal particle and containing a glass material as a main material; and an electrical wiring containing a particle-bonded body in which metal particles having electrical conductivity are bonded to each other, wherein the insulating region and the electrical wiring are integrally formed.

8 . An electrical wiring board production method, which is a method for producing an electrical wiring board having a substrate and an electrical wiring member provided on one surface side of the substrate and including an electrical wiring, comprising:
molding a composition containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle having electrical conductivity and a surface insulating layer located on the surface of the metal particle and containing a glass material as a main material, thereby obtaining a molded body on the substrate; and irradiating the molded body with an energy beam to form the electrical wiring in the irradiated region, thereby obtaining the electrical wiring member.

9 . An electrical wiring board forming material, which is a material comprising:
a substrate; and a molded body provided on one surface side of the substrate and containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle having electrical conductivity and a surface insulating layer located on the surface of the metal particle and containing a glass material as a main material, and capable of forming an electrical wiring by irradiating a portion of the molded body with an energy beam so as to exhibit electrical conductivity in the irradiated region.

10 . An electrical wiring board, comprising:
a substrate; and an electrical wiring member provided on one surface side of the substrate and including an insulating region containing a resin material and metal particles with an insulating layer, each of which is constituted by a metal particle having electrical conductivity and a surface insulating layer located on the surface of the metal particle and containing a glass material as a main material, and an electrical wiring containing a particle-bonded body in which metal particles having electrical conductivity are bonded to each other, wherein the insulating region and the electrical wiring are integrally formed in the electrical wiring member.

11 . A vibrator, comprising:
a package including the electrical wiring member according to claim 7 and a lid member bonded to the electrical wiring member or the electrical wiring board; and a vibrating reed housed in the package.

12 . A vibrator, comprising:
a package including the electrical wiring board according to claim 10 and a lid member bonded to the electrical wiring member or the electrical wiring board; and a vibrating reed housed in the package.

13 . An electronic apparatus comprising the electrical wiring member according to claim 7 .

14 . An electronic apparatus comprising the electrical wiring board according to claim 10 .

15 . A moving object comprising the electrical wiring member according to claim 7 .

16 . A moving object comprising the electrical wiring board according to claim 10 .

Assignees

• Seiko Epson Corp

Inventors

• Nakamura Hidefumi
• Kawasaki Taku

Classifications

• B22F1/16

  Metallic particles coated with a non-metal (coated with lubricating or binding agents or with organic material B22F1/10) · CPC title

• B22F1/10

  Metallic powder containing lubricating or binding agents; Metallic powder containing organic material · CPC title

• H01B19/00 Primary

  Apparatus or processes specially adapted for manufacturing insulators or insulating bodies {(manufacture of porcelain for electric insulation C04B33/26)} · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H01B1/22

  the conductive material comprising metals or alloys · CPC title