Image capturing device with an image sensor and a thermal infrared sensor as well as motor vehicle with an image capturing device

Patent metadata

Field	Value
Publication number	US-2016309098-A1
Application number	US-201415102909-A
Country	US
Kind code	A1
Filing date	Oct 28, 2014
Priority date	Dec 12, 2013
Publication date	Oct 20, 2016
Grant date	—

Abstract

The invention relates to an image capturing device ( 1 ) for a motor vehicle, including an image sensor ( 2 ) formed for capturing light in the visible spectral range and for providing photographic image data, and including a thermal infrared sensor ( 3 ) formed for capturing thermal radiation in the far infrared range and for providing thermographic image data, wherein the image sensor ( 2 ) and the thermal infrared sensor ( 3 ) are integrated in a common chip package ( 4 ).

First claim

1 . An image capturing device for a motor vehicle, comprising:
an image sensor, which is formed for capturing light in the visible spectral range and for providing photographic image data; and a thermal infrared sensor, which is formed for capturing thermal radiation in the far infrared range and for providing thermographic image data, wherein the image sensor and the thermal infrared sensor are integrated in a common chip package .

2 . The image capturing device according to claim 1 , wherein the common chip package is a CSP or a TSV package.

3 . The image capturing device according to claim 1 , wherein the image sensor and the thermal infrared sensor are disposed on a common substrate within the chip package.

4 . The image capturing device according to claim 3 , wherein the image sensor and the thermal infrared sensor have respective capturing sides, via which the visible light and the thermal radiation are captured, respectively, and which face the common substrate, wherein the common substrate is formed of a material, which is transparent to both the visible light and the thermal radiation.

5 . The image capturing device according to claim 3 , wherein electrical contact pads are provided on the common substrate, to which the image sensor and the thermal infrared sensor are electrically coupled for transmitting the respective image data.

6 . The image capturing device according to claim 1 , wherein at least one micro lens for the image sensor and/or the thermal infrared sensor is integrated in the chip package.

7 . The image capturing device according to claim 6 , wherein both for the image sensor and for the thermal infrared sensor, at least one micro lens is respectively integrated in the chip package.

8 . The image capturing device according to claim 1 , wherein the image sensor is formed as a CMOS image sensor or CCD image sensor.

9 . A motor vehicle with an image capturing device according to claim 1 .

10 . The image capturing device according to claim 6 , wherein the at least one micro lens is a wafer level optics (WLO).

Assignees

• Connaught Electronics Ltd
• Connaught Electronics Ltd

Inventors

• Montandon Ian Barry
• Denny Patrick Eoghan

Classifications

• B60R11/04 Primary

  Mounting of cameras operative during drive; Arrangement of controls thereof relative to the vehicle · CPC title

• H04N23/45

  for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images · CPC title

• H04N23/11

  for generating image signals from visible and infrared light wavelengths · CPC title

• H10F39/811

  Interconnections · CPC title

• H10F39/182

  Colour image sensors · CPC title