Single-package phased array module with interleaved sub-arrays

Patent metadata

Field	Value
Publication number	US-2016308287-A1
Application number	US-201615197531-A
Country	US
Kind code	A1
Filing date	Jun 29, 2016
Priority date	Mar 13, 2013
Publication date	Oct 20, 2016
Grant date	—

Abstract

Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.

First claim

What is claimed is:

1 . An apparatus comprising:
an antenna substrate having a surface that is substantially planar; a first array of one or more antenna elements disposed on the surface and configured to communicate wirelessly over a wireless network, wherein the first array is configured to steer a signal beam over a first range of angles relative to the surface and the one or more antenna elements of the first array are microstrip antennas; and a second array of one or more antenna elements disposed on the surface and configured to communicate wirelessly over the wireless network, wherein the second array is configured to steer the signal beam over a second range of angles relative to the surface that is different from the first range of angles and the one or more antenna elements of the second array are Vivaldi radiators or bent patches.

2 . The apparatus of claim 1 , further comprising a switch module coupled to the first and second arrays and configured to separately activate the first and second arrays over the respective first and second ranges of angles.

3 . The apparatus of claim 1 , wherein the wireless network is a millimeter-wave (mm-wave) network.

4 . The apparatus of claim 3 , further comprising:
a radio frequency (RF) module coupled to the antenna substrate and configured to modulate a data signal on to a mm-wave frequency for transmission over the mm-wave network.

5 . The apparatus of claim 1 , wherein the one or more antenna elements of the first array have a first angle of maximum radiation relative to the surface, and wherein the one or more antenna elements of the second array have a second angle of maximum radiation relative to the surface that is different from the first angle of maximum radiation.

6 . The apparatus of claim 5 , wherein the apparatus further comprises a dielectric layer disposed on top of the first and second arrays, the dielectric layer forming lenses over respective antenna elements of the first and second arrays to provide the respective first angle of maximum radiation or second angle of maximum radiation.

7 . The apparatus of claim 5 , wherein the first array of one or more antenna elements is disposed on a middle portion of the surface and the second array of one or more antenna elements is disposed on a peripheral portion of the surface.

8 . The apparatus of claim 1 , wherein the one or more antenna elements of the first and second arrays are formed in one or more metal layers on the antenna substrate.

9 . The apparatus of claim 1 , wherein the one or more antenna elements of the second array are Vivaldi radiators.

10 . The apparatus of claim 1 , wherein the one or more antenna elements of the second array are bent patches.

11 . The apparatus of claim 1 , further comprising a third array of one or more antenna elements disposed on the surface, wherein the third array is configured to steer the signal beam over a third range of angles that is different from the first and second ranges of angles.

12 . A method comprising:
forming a first array of one or more antenna elements on a surface of an antenna substrate that is substantially planar, wherein the one or more antenna elements of the first array are microstrip antennas and the first array is configured to communicate wirelessly over a wireless network, and wherein the first array is configured to steer a signal beam over a first range of angles relative to the surface; and forming a second array of one or more antenna elements on the surface, wherein the one or more antenna elements of the second array are Vivaldi radiators or bent patches and the second array is configured to communicate wirelessly over the wireless network, and wherein the second array is configured to steer the signal beam over a second range of angles relative to the surface that is different from the first range of angles.

13 . The method of claim 12 , further comprising:
coupling a switch module to the antenna substrate, the switch module configured to separately activate the first and second arrays of antenna elements over the respective first and second ranges of angles.

14 . The method of claim 12 , wherein the wireless network is a millimeter-wave (mm-wave) network.

15 . The method of claim 14 , wherein the surface is a first surface and the method further comprises:
mounting a radio frequency (RF) module to a second surface of the antenna substrate opposite the first surface, the RF module configured to modulate a data signal on to a mm-wave frequency for transmission over the mm-wave network.

16 . The method of claim 12 , wherein the one or more antenna elements of the first array have a first angle of maximum radiation relative to the surface, and wherein the one or more antenna elements of the second array have a second angle of maximum radiation relative to the surface that is different from the first angle of maximum radiation.

17 . The method of claim 16 , further comprising forming a dielectric layer on top of the first and second arrays, the dielectric layer including lenses over respective antenna elements of the first and second arrays to provide the respective first angle of maximum radiation or second angle of maximum radiation.

18 . The method of claim 12 , wherein the forming the one or more antenna elements of the first array or second array includes forming one or more metal layers on the surface of the substrate.

19 . A system comprising:
an antenna substrate having a surface that is substantially planar; a first array of one or more antenna elements disposed on the surface, wherein the one or more antenna elements of the first array are microstrip antennas and the first array is configured to steer a signal beam over a first range of angles relative to the surface; a second array of one or more antenna elements disposed on the surface, wherein the one or more antenna elements of the second array are Vivaldi radiators or bent patches and the second array is configured to steer the signal beam over a second range of angles relative to the surface that is different from the first range of angles; a radio frequency (RF) module coupled to the antenna substrate and configured to modulate a data signal for transmission over a millimeter-wave (mm-wave) network; and a switch module coupled to the antenna substrate and configured to separately activate the first and second arrays of antenna elements to transmit the data signal over the mm-wave network.

20 . The system of claim 19 , wherein the one or more antenna elements of the first array have a first angle of maximum radiation relative to the surface, and wherein the one or more antenna elements of the second array have a second angle of maximum radiation relative to the surface that is different from the first angle of maximum radiation.

21 . The system of claim 20 , further comprising a dielectric layer disposed on top of the first and second arrays, the dielectric layer forming lenses over respective antenna elements of the first and second arrays to provide the respective first angle of maximum radiation or second angle of maximum radiation.

22 . The system of claim 19 , further comprising a baseband module mounted on the antenna substrate and configured to provide the data signal to the RF module.

23 . The system of claim 19 , wherein the RF module is configured to receive the data signal from a baseband module that is remotely disposed from the antenna substrate.

Assignees

• Intel Corp

Inventors

• Kamgaing Telesphor
• Elsherbini Adel A

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W44/248

  for antennas · CPC title

• Y10T29/49016

  Antenna or wave energy "plumbing" making · CPC title

• H01Q1/50

  Structural association of antennas with earthing switches, lead-in devices or lightning protectors · CPC title

• H01Q15/08

  formed of solid dielectric material · CPC title