Package for light emitting apparatus and light emitting apparatus including the same

Patent metadata

Field	Value
Publication number	US-2016308104-A1
Application number	US-201615194530-A
Country	US
Kind code	A1
Filing date	Jun 27, 2016
Priority date	Jun 28, 2013
Publication date	Oct 20, 2016
Grant date	—

Abstract

A light emitting apparatus includes a package and a first light emitting device. The package has a package bottom surface and defining recessed portion having a recessed portion bottom surface therein. The package includes a first leadframe, a second leadframe and resin portion. Each of the first and second leadframes has a leadframe upper surface which is partially exposed at the recessed portion bottom surface and a leadframe bottom surface exposed at the package bottom surface. The first light emitting device is mounted in the recessed portion. The first and second leadframes are spaced apart each other via an separation area having a bending portion and a liner portion connected to the bending portion and extended substantially straight along a boundary line between the first leadframe main body and the first leadframe extension portion at the package bottom surface.

First claim

What is claimed is:

1 . A light emitting apparatus comprising:
a package having a package bottom surface and defining recessed portion having a recessed portion bottom surface therein, said package comprising a first leadframe, a second leadframe and resin portion, each of said first and second leadframes having
a leadframe upper surface which is partially exposed at said recessed portion bottom surface and
a leadframe bottom surface exposed at said package bottom surface; and
a first light emitting device that is mounted in said recessed portion, wherein said first leadframe has a first leadframe main portion and a first leadframe extension portion which has narrower width than that of said first leadframe main portion, both of said first leadframe main portion and first leadframe extension portion being at least partially exposed at said package bottom surface, wherein a first recessed part is formed at said first leadframe bottom surface and embedded with said resin portion to separate a first exposed bottom area of said first leadframe main portion and a second exposed bottom area of said first leadframe extension portion, and wherein said first and second leadframes are spaced apart each other via an separation area having a bending portion and a liner portion connected to said bending portion and extended substantially straight along a boundary line between said first leadframe main body and said first leadframe extension portion at said package bottom surface.

2 . The light emitting apparatus according to claim 1 ,
wherein said separation area has at least one bending point, and wherein said at least one bending point is positioned at proximity of said first recessed part.

3 . The light emitting apparatus according to claim 1 , wherein said first recessed part is at least partially formed at said recessed portion bottom surface which is partially opposed to said first leadframe upper surface exposed at said recessed portion bottom surface.

4 . The light emitting apparatus according to claim 1 , wherein said first light emitting device is mounted on an upper surface of said first leadframe main portion.

5 . The light emitting apparatus according to claim 1 ,
wherein said first leadframe forms a second recessed part at an upper surface thereof, and wherein a part of said resin portion is filled in said second recessed part.

6 . The light emitting apparatus according to claim 5 , wherein said second recessed part is formed on said first leadframe extension portion.

7 . The light emitting apparatus according to claim 1 , wherein said first leadframe extension portion extends from said first leadframe main portion toward said second leadframe with a width reduced from said first leadframe main portion.

8 . The light emitting apparatus according to claim 4 , further comprising a second light emitting device mounted on an upper surface of a main portion of said second leadframe.

9 . The light emitting apparatus according to claim 1 ,
wherein said package has a longitudinal direction and transverse direction perpendicular to said longitudinal direction as viewed in plan view, wherein said first and second leadframes are arranged on the both sides in said longitudinal direction, and wherein said light emitting apparatus further comprises a third leadframe arranged between said first and second leadframes.

10 . The light emitting apparatus according to claim 9 ,
wherein said first leadframe extension portion extends from said first leadframe main portion toward said second leadframe with a width reduced from the first leadframe main portion, wherein said first extension portion faces said third leadframe in said transverse direction as viewed in plan view.

11 . The light emitting apparatus according to claim 9 ,
wherein said first light emitting device is mounted on an upper surface of said first leadframe main portion, and wherein said first light emitting device is connected to an upper surface of said third leadframe through wire lines.

12 . The light emitting apparatus according to claim 9 , wherein said third leadframe is arranged substantially in the center of said longitudinal direction.

13 . The light emitting apparatus according to claim 1 , wherein bottom surfaces of said first and second leadframes together with a bottom surface of said resin portion serve as said package bottom surface.

14 . The light emitting apparatus according to claim 1 , wherein said first and second leadframes are not subjected substantial bending.

15 . The light emitting apparatus according to claim 1 , wherein an exposed area of said first and second leadframes exposed from said resin portion at a bottom surface of the light emitting apparatus is substantially symmetry.

16 . The light emitting apparatus according to claim 1 , wherein an exposed area of said first and second leadframes exposed from resin portion at a bottom surface of the light emitting apparatus is divided as four parts.

17 . The light emitting apparatus according to claim 1 , further comprising a protection device mounted on an upper surface of said first extension portion.

18 . The light emitting apparatus according to claim 1 , wherein said first and second leadframes together with said resin portion are substantially on the same plain at the side surfaces of said package.

19 . The light emitting apparatus according to claim 1 , wherein said first and second leadframes are substantially on the same plain with said resin portion at four parts.

20 . The light emitting apparatus according to claim 19 ,
wherein said package has a longitudinal direction and transverse direction perpendicular to said longitudinal direction as viewed in plan view, wherein said first and second leadframes are arranged on the both sides in said longitudinal direction, wherein said light emitting apparatus further comprises a third leadframe arranged between said first and second leadframes, and wherein said four parts comprises:
one part of said first leadframe;
one part of said second leadframe; and
two parts of said third leadframe.

21 . The light emitting apparatus according to claim 1 , wherein said separation area is etched portion.

Assignees

• Nichia Corp

Inventors

• Sasaoka Shimpei
• Nakabayashi Takuya

Classifications

• H10W90/756

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/07554

  changes in dispositions · CPC title

• H10W72/07553

  changes in shapes · CPC title

• H10W72/5525

  comprising copper [Cu] · CPC title