Method of Forming a Trench Using Epitaxial Lateral Overgrowth

Patent metadata

Field	Value
Publication number	US-2016308028-A1
Application number	US-201615187232-A
Country	US
Kind code	A1
Filing date	Jun 20, 2016
Priority date	Feb 6, 2014
Publication date	Oct 20, 2016
Grant date	—

Abstract

In one aspect, a method of forming a trench in a semiconductor material includes forming a first dielectric layer on a semiconductor substrate. The first dielectric layer includes first openings. An epitaxial layer is grown on the semiconductor substrate by an epitaxial lateral overgrowth process. The first openings are filled by the epitaxial layer and the epitaxial layer is grown onto adjacent portions of the first dielectric layer so that part of the first dielectric layer is uncovered by the epitaxial layer and a gap forms between opposing sidewalls of the epitaxial layer over the part of the first dielectric layer that is uncovered by the epitaxial layer. The gap defines a first trench in the epitaxial layer that extends to the first dielectric layer.

First claim

What is claimed is:

1 . A method of forming a trench in a semiconductor material, the method comprising:
forming a first dielectric layer on a semiconductor substrate, the first dielectric layer comprising first openings; and growing an epitaxial layer on the semiconductor substrate by an epitaxial lateral overgrowth process, wherein the first openings are filled by the epitaxial layer and the epitaxial layer grows onto adjacent portions of the first dielectric layer so that part of the first dielectric layer is uncovered by the epitaxial layer and a gap forms between opposing sidewalls of the epitaxial layer over the part of the first dielectric layer that is uncovered by the epitaxial layer, the gap defining a first trench in the epitaxial layer that extends to the first dielectric layer.

2 . The method of claim 1 , further comprising:
forming a second dielectric layer along the opposing sidewalls of the epitaxial layer; and forming a conductive electrode in the first trench such that the first dielectric layer electrically insulates the conductive electrode from the semiconductor substrate and the second dielectric layer electrically insulates the conductive electrode from the epitaxial layer.

3 . The method of claim 2 , further comprising:
forming a third dielectric layer over the conductive electrode and over an apex in an outer surface of the epitaxial layer adjacent the first trench; thinning the third dielectric layer to expose the apex and surrounding portions of the epitaxial layer; and etching the epitaxial layer at the exposed apex and surrounding portions of the epitaxial layer to form a second trench in the epitaxial layer spaced apart from the first trench.

4 . The method of claim 1 , wherein forming the first dielectric layer comprises:
oxidizing the semiconductor substrate to form a layer of oxide on a first surface of the semiconductor substrate; masking the layer of oxide so that portions of the layer of oxide are unprotected by the mask; etching the unprotected portions of the layer of oxide to the first surface of the semiconductor substrate to form the first dielectric layer with the first openings.

5 . The method of claim 4 , further comprising:
re-oxidizing the semiconductor substrate to form oxide regions in the first openings; and etching the oxide regions such that the first openings extend into the semiconductor substrate beyond the first surface.

6 . The method of claim 1 , further comprising:
forming second openings in the first dielectric layer after growing the epitaxial layer, the second openings aligned with the gap in the epitaxial layer and extending through the first dielectric layer to the semiconductor substrate so as to expose portions of the semiconductor substrate under the second openings; and etching the exposed portions of the semiconductor substrate under the second openings to form a second trench having opposing sidewalls and a bottom arranged in the semiconductor substrate.

7 . The method of claim 6 , further comprising:
removing the epitaxial layer filling the first openings in the first dielectric layer so as to expose portions of the semiconductor substrate under the first openings; and etching the semiconductor substrate under the first openings to form a third trench having opposing sidewalls and a trench bottom arranged in the semiconductor substrate.

8 . The method of claim 7 , wherein the second and third trenches are formed at the same time.

9 . The method of claim 8 , wherein the second and third trenches are formed by a single etching process.

10 . The method of claim 6 , wherein the epitaxial lateral overgrowth process comprises a number of epitaxial cycles, wherein a width of the first openings, a width of the dielectric layer between adjacent ones of the first openings and the number of epitaxial cycles are selected such that an aspect ratio of the second trench is at least 10:1, wherein the aspect ratio is a ratio of a depth of the second trench to a width of the second trench.

Assignees

• Infineon Technologies Austria Ag

Inventors

• Joshi Ravi
• Baumgartl Johannes
• Poelzl Martin
• Kuenle Matthias
• Steinbrenner Juergen
• Haghofer Andreas
• Gruber Christoph
• Ehrentraut Georg

Classifications

• H10P50/695

  characterised by the process involved to create the mask, e.g. lift-off masks or sidewalls or to modify the mask · CPC title

• H10P50/642 Primary

  Chemical etching · CPC title

• H10P50/283

  by chemical means · CPC title

• H10P50/73

  using masks for insulating materials · CPC title

• H10P14/6306

  of the semiconductor materials · CPC title