Substrate Processing System and Ceramic Coating Method Therefor

Patent metadata

Field	Value
Publication number	US-2016307740-A1
Application number	US-201615092965-A
Country	US
Kind code	A1
Filing date	Apr 7, 2016
Priority date	Apr 20, 2015
Publication date	Oct 20, 2016
Grant date	—

Abstract

A substrate processing system and a method of coating a ceramic layer therewith are provided. The system may include a chamber and a ceramic layer on an inner surface of the chamber. The ceramic layer may include yttrium oxyfluoride (Y x O y F z ), where x=1, y=1, 2, and z=1, 2.

First claim

1 . A substrate processing system, comprising:
a chamber; and a ceramic layer on an inner s face of the chamber, wherein the ceramic layer comprises yttrium oxyfluoride (Y x O y F z ), wherein x=1, y=1, 2, and z=1, 2.

2 . The system of claim 1 , wherein the inner surface of the chamber is formed of an aluminum-containing material,
wherein the system further comprises a buffer layer provided between the inner surface of the chamber and the ceramic layer.

3 . The system of claim 2 , wherein the buffer layer has a thermal expansion coefficient that is higher than a thermal expansion coefficient of the inner surface of the chamber and lower than a thermal expansion coefficient of the ceramic layer

4 . The system of claim 2 , wherein the buffer layer comprises aluminum yttrium oxyfluoride (Al v Y x O y F x ), wherein v=1, 2, x=1, y=1, 2, and z=1, 2.

5 . The system of claim 2 , wherein the buffer layer comprises a mixture of aluminum fluoride and yttrium oxide.

6 . The system of claim 2 , wherein the buffer layer comprises:
a first buffer layer on the inner surface, the first buffer layer comprising aluminum yttrium fluoride; a second buffer layer on the first buffer layer; a third buffer layer on the second buffer layer; and a fourth buffer layer on the third buffer layer.

7 . The system of claim 6 , wherein the second buffer layer comprises a mixture of aluminum fluoride and yttrium oxide.

8 . The system of claim 6 , wherein the third buffer layer comprises aluminum yttrium oxyfluoride.

9 . The system of claim 6 , wherein the fourth buffer layer comprises yttrium fluoride.

10 . The system of claim 6 . wherein the ceramic layer has a thermal expansion coefficient that is higher than a thermal expansion coefficient of the fourth buffer layer, the fourth buffer layer has a thermal expansion coefficient that is higher than a thermal expansion coefficient of the third butler layer, the third buffer layer has a thermal expansion coefficient that is higher than a thermal expansion coefficient of the second buffer layer, the second buffer layer has a thermal expansion coefficient that is higher than the thermal expansion coefficient of the first buffer layer, and the first buffer layer has a higher thermal expansion coefficient than the thermal coefficient of the inner surface of the chamber.

11 . The system of claim 6 , wherein an aluminum content in the first buffer layer is greater than an aluminum content in the second buffer layer, the aluminum content in the second buffer layer is greater than an aluminum content in the third buffer layer, and the aluminum content in the third buffer layer is greater than an aluminum content in the fourth buffer layer.

12 . The system of claim 1 , wherein the chamber comprises:
a lower housing, on which a substrate is loaded; and an upper housing provided on the lower housing and configured to supply a reaction gas onto the substrate.

13 . The system of claim 12 , wherein the lower housing comprises:
a chuck configured to receive the substrate; and a wall liner configured to be fastened to the upper housing to enclose the chuck, wherein the yttrium oxyfluoride is coated on the wall liner.

14 - 20 . (canceled)

Assignees

• Samsung Electronics Co Ltd

Inventors

• Kim Jungmin
• Bang Jin Young
• Oh Sejin
• Kang Taekyun
• Park Myoung Soo
• Sung Dougyong

Classifications

• H10P72/0462

  characterised by the construction of the processing chambers, e.g. modular processing chambers · CPC title

• H10P72/72

  using electrostatic chucks · CPC title

• H01J37/32495 Primary

  Means for protecting the vessel against plasma · CPC title

• H01J37/32477

  characterised by the means for protecting vessels or internal parts, e.g. coatings · CPC title

• H01J37/321

  the radio frequency energy being inductively coupled to the plasma · CPC title