Pattern Measurement Device and Computer Program

Patent metadata

Field	Value
Publication number	US-2016307730-A1
Application number	US-201415100518-A
Country	US
Kind code	A1
Filing date	Dec 1, 2014
Priority date	Dec 5, 2013
Publication date	Oct 20, 2016
Grant date	—

Abstract

The present invention is: a pattern measurement device that, regardless of increased fineness, deviation, or the like of a pattern, accurately and stably performs measurement on the basis of edge identification or pattern or edge judgment; and a computer program. The pattern measurement device classifies pattern sites (G 1 , G 2 , G 3 , G 4 ), which are repeatedly arrayed at a specific interval, in accordance with the position of the pattern sites, and executes a pattern edge type identification, a pattern type identification, or a measurement of the dimensions between predetermined pattern sites on the basis of an association between the classified pattern sites and information pertaining to the pattern edge type or information pertaining to the pattern type. The computer program causes a computer to execute the abovementioned process.

First claim

1 . A pattern measurement device comprising:
a computation device that measures a measurement target pattern by using a waveform signal obtained by scanning a pattern with a charged particle beam, wherein the computation device classifies pattern sites which are repeatedly arrayed at a specific interval, in accordance with positions of the pattern sites, on the basis of the waveform signal, and executes a pattern edge type identification, a pattern type identification, or measurement of dimensions between predetermined pattern sites, on the basis of association between the classified pattern site, and information pertaining to a pattern edge type, or information pertaining to a pattern type.

2 . The pattern measurement device according to claim 1 , wherein
the computation device divides coordinate values of the pattern sites by an interval between the predetermined patterns, so as to classify the pattern sites.

3 . The pattern measurement device according to claim 1 , wherein
the computation device classifies the pattern sites by grouping pattern sites having the same remainder which is obtained by dividing the coordinate values of the pattern sites by an interval between the predetermined patterns.

4 . The pattern measurement device according to claim 1 , wherein
the computation device further classifies the classified pattern sites on the basis of features of the pattern sites in the waveform signal.

5 . The pattern measurement device according to claim 1 , wherein
the computation device distinguishes between a region in which patterns are repeatedly arrayed at the specific interval, and other regions.

6 . The pattern measurement device according to claim 1 , wherein
the computation device judges whether each pattern included in a region in which patterns are repeatedly arrayed at the specific interval has one peak or two peaks, by using the number of performed exposure for forming the patterns included in the region.

7 . The pattern measurement device according to claim 6 , wherein
the computation device judges a space included in the region, on the basis of judgement of whether each of the patterns has one peak or two peaks.

8 . The pattern measurement device according to claim 1 , wherein
the computation device detects a boundary position between a repetition portion and a not-repeated portion, and causes the detected portion to correspond to each site in multi-patterning.

9 . The pattern measurement device according to claim 1 , wherein
the computation device further classifies groups obtained by classifying positions of line candidates or edges on the basis of a predetermined gap, on the basis of a line feature quantity.

10 . The pattern measurement device according to claim 9 , wherein
a portion at which a portion corresponding to the line candidate or the edge overlaps two quadratic differential profiles is set as the line feature quantity.

11 . The pattern measurement device according to claim 9 , wherein
a portion at which a portion corresponding to the line candidate or the edge overlaps two smoothed profiles is set as the line feature quantity.

12 . The pattern measurement device according to claim 1 , wherein
the computation device compares the number of line candidates or edges in a repetition portion, to the assumed number of lines, and judges the pattern edge type or the pattern type based on a feature quantity between the line candidates or edges from the line candidates, or edges.

13 . The pattern measurement device according to claim 12 , wherein
an area of a quadratic differential profile of portions between the line candidates or portions between the edges is set as the feature quantity.

14 . The pattern measurement device according to claim 12 , wherein
the sum of heights of an upper side peak and a lower side peak in a primary differentiation of a portion between the line candidates or a portion between the edges is set as the feature quantity.

15 . A computer program of causing a computer to measure a measurement target pattern by using a waveform signal obtained by scanning the pattern with a charged particle beam,
wherein the program causes the computer to classify pattern sites which are repeatedly arrayed at a specific interval, on the basis of the waveform signal in accordance with positions of the pattern sites, and to execute a pattern edge type identification, a pattern type identification, or measurement of dimensions between predetermined pattern sites, on the basis of association between the classified pattern site, and information pertaining to a pattern edge type, or information pertaining to a pattern type.

Assignees

• Hitachi High Tech Corp

Inventors

• Namai Hitoshi
• Yamazaki Tomoaki

Classifications

• H01J2237/2817

  Pattern inspection · CPC title

• H01J37/28 Primary

  with scanning beams {(H01J37/268, H01J37/292, H01J37/2955 take precedence)} · CPC title

• H01J2237/24578

  Spatial variables, e.g. position, distance · CPC title

• G01B15/00

  Measuring arrangements characterised by the use of electromagnetic waves or particle radiation, e.g. by the use of microwaves, X-rays, gamma rays or electrons (characterised by the use of optical techniques G01B9/00, G01B11/00) · CPC title