Insulated wire, coil, and electronic/electrical equipment

US2016307662A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016307662-A1
Application numberUS-201615192175-A
CountryUS
Kind codeA1
Filing dateJun 24, 2016
Priority dateDec 26, 2013
Publication dateOct 20, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An insulated wire, having a thermosetting resin covering (A), directly or by interposing an insulating layer (C), on a conductor having a rectangular cross-section, and a thermoplastic resin covering (B) on a periphery of the thermosetting resin covering (A), wherein the thermoplastic resin covering (B) has at least two layers of the thermoplastic resin layers, and the thermoplastic resin layers adjacent to each other are formed of thermoplastic resins different from each other, at least one layer of the thermoplastic resin layers is formed of polyether ether ketone or modified polyether ether ketone, and a total thickness of the thermoplastic resin layers is 60 to 120 μm, and a thickness of a thinnest thermoplastic resin layer is 5 to 20 μm; and a coil formed by winding processing the insulated wire and an electrical equipment having the coil.

First claim

Opening claim text (preview).

1 . An insulated wire, comprising a thermosetting resin covering (A), directly or by interposing an insulating layer (C), on a conductor having a rectangular cross-section, and a thermoplastic resin covering (B), as an extrusion covering, on a periphery of the thermosetting resin covering (A), wherein the thermoplastic resin covering (B) has at least two layers of the thermoplastic resin layers, and the thermoplastic resin layers adjacent to each other are formed of thermoplastic resins different from each other, at least one layer of the thermoplastic resin layers is formed of polyether ether ketone or modified polyether ether ketone, and a total thickness of the thermoplastic resin layers is 60 to 120 μm, and a thickness of a thinnest thermoplastic resin layer among the thermoplastic resin layers is 5 to 20 μm. 2 . The insulated wire according to claim 1 , wherein an outermost layer of the thermoplastic resin covering (B) is a thermoplastic layer formed of the polyether ether ketone or the modified polyether ether ketone. 3 . The insulated wire according to claim 1 , wherein the thermoplastic resin covering (B) is formed of two layers of the thermoplastic resin layers. 4 . The insulated wire according to claim 1 , wherein the thinnest thermoplastic resin layer is provided inside the thermoplastic resin layer formed of the polyether ether ketone or the modified polyether ether ketone. 5 . A coil formed by winding processing the insulated wire according to claim 1 . 6 . Electronic/electrical equipment, having the coil according to claim 5 .

Assignees

Inventors

Classifications

  • Insulation of windings · CPC title

  • Coating compositions based on polyethers obtained by reactions forming an ether link in the main chain (based on polyacetals C09D159/00; based on epoxy resins C09D163/00; based on polythioether-ethers C09D181/02; based on polyethersulfones C09D181/06); Coating compositions based on derivatives of such polymers · CPC title

  • H01B3/30Primary

    plastics; resins; waxes · CPC title

  • Polyethers · CPC title

  • Three or more layers · CPC title

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Frequently asked questions

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What does patent US2016307662A1 cover?
An insulated wire, having a thermosetting resin covering (A), directly or by interposing an insulating layer (C), on a conductor having a rectangular cross-section, and a thermoplastic resin covering (B) on a periphery of the thermosetting resin covering (A), wherein the thermoplastic resin covering (B) has at least two layers of the thermoplastic resin layers, and the thermoplastic resin layer…
Who is the assignee on this patent?
Furukawa Electric Co Ltd, Furukawa Magnet Wire Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01B3/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Oct 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).