Chemically amplified positive resist composition and resist pattern forming process
US-12164231-B2 · Dec 10, 2024 · US
US2016306278A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016306278-A1 |
| Application number | US-201615087637-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 31, 2016 |
| Priority date | Apr 20, 2015 |
| Publication date | Oct 20, 2016 |
| Grant date | — |
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A chemical for photolithography to uniformly form a thick film to a desired thickness while enhancing a liquid transfer property by lowering the viscosity of a composition for photolithography, and a resist composition including the same. The chemical includes a solvent having a saturated vapor pressure and viscosity within predetermined ranges, and a resin is formed as a film having a thickness of 5 μm or more through spin coating.
Opening claim text (preview).
What is claimed is: 1 . A chemical for photolithography coated through spin coating, comprising a resin ingredient having a mass-average molecular weight (Mw) of 2000 to 50000 and an organic solvent having a saturated vapor pressure of 1 kPa or more (1 atm, 20° C.) and a viscosity of 1.1 cP (1 atm, 20° C.) or less. 2 . The chemical according to claim 1 , wherein a thickness of a film coated through the spin coating is 5 μm or more and 20 μm or less. 3 . The chemical according to claim 1 or 2 , wherein a viscosity of the chemical is 130 cP (1 atm, 20° C.) or less. 4 . The chemical according to claim 1 or 2 , wherein the organic solvent is selected from the group consisting of an aromatic solvent, halogenated aromatic solvent, ketone-based solvent and ester based solvent. 5 . The chemical according to claim 4 , wherein the organic solvent is an ester-based solvent. 6 . The chemical according to claim 5 , wherein the organic solvent is butyl acetate. 7 . The chemical according to claim 1 or 2 , wherein the resin ingredient is a polyhydroxystyrene resin, and the chemical is exposed to KrF excimer laser beams. 8 . A photolithographed film formed to a thickness of 5 μm or more and 20 μm or less by coating the chemical for photolithography according to claim 1 or 2 on a substrate. 9 . A resist composition coated through spin coating, comprising: a resin ingredient having a mass-average molecular weight (Mw) of 2000 to 50000; an organic solvent having a saturated vapor pressure of 1 kPa or more (1 atm, 20° C.) and a viscosity of 1.1 cP (1 atm, 20° C.) or less; and an acid generator. 10 . The resist composition according to claim 9 , wherein a thickness of a film coated through the spin coating is 5 μm or more and 20 μm or less. 11 . The resist composition according to claim 9 or 10 , wherein a viscosity of the composition is 130 cP (1 atm, 20° C.) or less. 12 . The resist composition according to claim 9 or 10 , wherein the organic solvent is selected from the group consisting of an aromatic solvent, halogenated aromatic solvent, ketone-based solvent and ester-based solvent. 13 . The resist composition according to claim 12 , wherein the organic solvent is an ester-based solvent. 14 . The resist composition according to claim 13 , wherein the organic solvent is butyl acetate. 15 . The resist composition according to claim 9 or 10 , wherein the resin ingredient is a polyhydroxystyrene resin, and the composition is exposed to KrF excimer laser beams. 16 . A resist film formed to a thickness of 5 μm or more and 20 μm or less by coating the resist composition according to claim 9 or 10 on a substrate.
Macromolecular compounds which are photodegradable, e.g. positive electron resists (G03F7/075 takes precedence; macromolecular quinonediazides G03F7/023) · CPC title
Coating on a rotating support, e.g. using a whirler or a spinner · CPC title
characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents · CPC title
Exposure; Apparatus therefor (photographic printing apparatus for making copies G03B27/00) · CPC title
Photosensitive materials (G03F7/12, G03F7/14 take precedence) · CPC title
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