Copper alloy sheet material, connector, and method of producing a copper alloy sheet material

US2016305002A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016305002-A1
Application numberUS-201615192256-A
CountryUS
Kind codeA1
Filing dateJun 24, 2016
Priority dateDec 27, 2013
Publication dateOct 20, 2016
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A copper alloy sheet material, having an alloy composition containing at least one of Ni and Co in an amount of 1.80 to 8.00 mass % in total, Si in an amount of 0.40 to 2.00 mass %, and at least one element selected from the group consisting of Sn, Zn, Ag, Mn, P, Mg, Cr, Zr, Fe, and Ti in an amount of 0.000 to 2.000 mass % in total, with the balance being copper and unavoidable impurities, wherein the orientation density of the {121}<111> orientation is 6 or less, and the orientation density of the {110}<001> orientation is 4 or more; and wherein the density of grains having the {110}<001> orientation is 0.40 grains/μm 2 or more; a connector using thereof; and a method of producing the copper alloy sheet material.

First claim

Opening claim text (preview).

1 . A copper alloy sheet material, having an alloy composition comprising at least one of Ni and Co in an amount of 1.80 to 8.00 mass % in total; Si in an amount of 0.40 to 2.00 mass %; and optionally at least one element selected from the group consisting of Sn, Zn, Ag, Mn, P, Mg, Cr, Zr, Fe, and Ti in an amount of 0.000 to 2.000 mass % in total, with the balance being copper and unavoidable impurities, wherein an orientation density of a {121}<111> orientation is 6 or less, an orientation density of a {110}<001> orientation is 4 or more, and wherein a density of grains having a {110}<001> orientation is 0.40 grains/μm 2 or more. 2 . The copper alloy sheet material as claimed in claim 1 , which contains the at least one element selected from the group consisting of Sn, Zn, Ag, Mn, P, Mg, Cr, Zr, Fe, and Ti in an amount of 0.005 to 2.000 mass % in total. 3 . The copper alloy sheet material as claimed in claim 1 , wherein a Vickers hardness is 280 or more. 4 . A connector formed to contain the copper alloy sheet material as claimed in claim 1 . 5 . A method of producing a copper alloy sheet material, comprising the steps of: melting and casting of raw materials having an alloying composition comprising at least one of Ni and Co in an amount of 1.80 to 8.00 mass % in total, Si in an amount of 0.40 to 2.00 mass %, and optionally at least one element selected from the group consisting of Sn, Zn, Ag, Mn, P, Mg, Cr, Zr, Fe, and Ti in an amount of 0.000 to 2.000 mass % in total, with the balance being copper and unavoidable impurities; intermediate cold-rolling with a working ratio of 20% to 70%; aging treatment of performing a heat treatment for 5 minutes to 10 hours at 300° C. to 440° C.; and final cold-rolling with a working ratio of 90% or more, in this order. 6 . The method of producing a copper alloy sheet material as claimed in claim 5 , wherein the copper alloy sheet material contains the at least one element selected from the group consisting of Sn, Zn, Ag, Mn, P, Mg, Cr, Zr, Fe, and Ti in an amount of 0.005 to 2.000 mass % in total. 7 . The method of producing a copper alloy sheet material as claimed in claim 5 , which carries out, in this order, the steps of: homogenization heat treatment of performing a heat treatment for one hour or more at 960° C. to 1,040° C.; and hot-working with a working ratio of 10% to 90% at a temperature range of 500° C. to 1,040° C. from the initiation to the end of the hot-working, between the melting and casting step and the intermediate cold-rolling step, and which carries out: no heat treatment at 480° C. or higher, after the hot-working step. 8 . The method of producing a copper alloy sheet material as claimed in claim 5 , which carries out a step of: stress-relief annealing of maintaining the copper alloy sheet material for 5 seconds to 2 hours at 200° C. to 430° C., after the final cold-rolling step.

Assignees

Inventors

Classifications

  • by melting {(C22C1/1036 takes precedence)} · CPC title

  • C22C9/06Primary

    with nickel or cobalt as the next major constituent · CPC title

  • with tin as the next major constituent · CPC title

  • Alloys based on copper · CPC title

  • C22F1/08Primary

    of copper or alloys based thereon · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2016305002A1 cover?
A copper alloy sheet material, having an alloy composition containing at least one of Ni and Co in an amount of 1.80 to 8.00 mass % in total, Si in an amount of 0.40 to 2.00 mass %, and at least one element selected from the group consisting of Sn, Zn, Ag, Mn, P, Mg, Cr, Zr, Fe, and Ti in an amount of 0.000 to 2.000 mass % in total, with the balance being copper and unavoidable impurities, wher…
Who is the assignee on this patent?
Furukawa Electric Co Ltd
What technology area does this patent fall under?
Primary CPC classification C22C9/06. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Oct 20 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).