Glass Composition, Component, and Method for Producing a Component

Patent metadata

Field	Value
Publication number	US-2016304391-A1
Application number	US-201415102988-A
Country	US
Kind code	A1
Filing date	Dec 15, 2014
Priority date	Dec 19, 2013
Publication date	Oct 20, 2016
Grant date	—

Abstract

A glass composition, a device and a method for producing the device are disclosed. In an embodiment, the glass composition includes a tellurium oxide in a proportion of at least 65 mol. % and at most 90 mol. %, R 1 O in a proportion between 0 mol. % and 20 mol. %, wherein R 1 is selected from Mg, Ca, Sr, Ba, Zn, Mn and combinations thereof and at least one M 1 2O in a proportion between 5 mol. % and 25 mol. %, wherein M 1 is selected from Li, Na, K and combinations thereof. The glass component further includes at least one R 2 2 O 3 in a proportion between 1 mol. % and 3 mol. %, wherein R 2 is selected from Al, Ga, In, Bi, Sc, Y, La, rare earths and combinations thereof, and M 2 O 2 in a proportion between 0 mol. % and 2 mol. %, wherein M 2 is selected from Ti, Zr, Hf and combinations thereof.

First claim

1 - 15 . (canceled)

16 . A glass composition comprising:
at least one tellurium oxide in a proportion of at least 65 mol. % and at most 90 mol. %; R 1 O in a proportion between 0 mol. % and 20 mol. %, wherein R 1 is selected from Mg, Ca, Sr, Ba, Zn, Mn and combinations thereof; at least one M 1 2 O in a proportion between 5 mol. % and 25 mol. %, wherein M 1 is selected from Li, Na, K and combinations thereof; at least one R 2 2 O 3 in a proportion between 1 mol. % and 3 mol. %, wherein R 2 is selected from Al, Ga, In, Bi, Sc, Y, La, rare earths and combinations thereof; M 2 O 2 in a proportion between 0 mol. % and 2 mol.%, wherein M 2 is selected from Ti, Zr, Hf and combinations thereof; and R 3 2 O 5 in a proportion between 0 mol. % and 6 mol. %, wherein R 3 is selected from Nb and/or Ta.

17 . The glass composition according to claim 16 , wherein the glass composition consists essentially of tellurium oxide, M 1 2 O, R 1 O and R 2 2 O 3 ,
wherein tellurium oxide is in a proportion of at least 65 mol. % and at most 90 mol. % present, wherein R 1 O is in a proportion between 0 mol. % and 20 mol. % present, wherein R 1 is selected from Mg, Ca, Sr, Ba, Zn, Mn and combinations thereof, wherein M 1 2 O is in a proportion between 10 mol. % and 12 mol. % present, wherein M 1 is selected from Li, Na, K and combinations thereof, wherein R 2 2 O 3 is in a proportion between 1.5 mol. % and 2 mol. % present, wherein R 2 is selected from Al, Ga, In, Bi, Sc, Y, La, rare earths and combinations thereof.

18 . The glass composition according to claim 16 , wherein the tellurium oxide is TeO 2 and comprises a proportion of at least 67 mol. % and at most 69 mol. %.

19 . The glass composition according to claim 16 , wherein R 1 O has a proportion of between 14 mol. % and 18 mol. %.

20 . The Glass composition according to claim 16 , wherein M 1 2 O has a proportion of between 8 mol. % and 14 mol. %.

21 . The glass composition according to claim 16 , wherein the glass composition is free of boron trioxide, germanium oxide, phosphates, halides, P 2 O 5 , silicon dioxide and silicates.

22 . The glass composition according to claim 16 , wherein R 2 is selected from the group consisting of Al, La, Y and Bi, and wherein R 2 2 O 3 comprises a proportion between 1.5 mol. % and 2.5 mol. %.

23 . The glass composition according to claim 16 , wherein the glass composition consists essentially of tellurium oxide, M 1 2 O, R 2 2 O 3 , and wherein R 2 2 O 3 comprises a proportion between 1.5 mol. % and 2 mol. %.

24 . The glass composition according to claim 16 , wherein the glass composition has a glass transition temperature of less than 320° C. and has a dilatometric softening temperature of less than 400° C.

25 . The glass composition according to claim 16 , wherein the glass composition is radiation-permeable so that at least 90% of an incident electromagnetic radiation from a wavelength range of 380 nm to 800 nm is transmitted.

26 . A device comprising:
a first mounting element with a mounting surface; the glass composition according to claim 16 ; and a second mounting element, wherein the glass composition is arranged between the mounting surface of the first mounting element and the second mounting element, wherein the glass composition is formed as an adhesive layer, and wherein the glass composition connects the mounting surface of the first mounting element and the second mounting element to one another.

27 . The device according to claim 26 , wherein each of the first mounting element and the second mounting element is selected from a semiconductor chip, a ceramic, a silicate glass, a metal, a conversion ceramic, a lens or combinations thereof, and wherein the mounting element and/or the second mounting element include a functional oxidic coating.

28 . The device according to claim 26 , wherein the first mounting element is a semiconductor chip and the second mounting element is a transparent silicate glass, a converting ceramic or a transmitting ceramic.

29 . The device according to claim 26 , wherein the first mounting element is a ceramic or a metal and the second mounting element is a ceramic.

30 . A method for producing a device according to claim 26 , the method comprising:
providing the first mounting element comprising a mounting surface; applying the glass composition directly to the mounting surface; applying the second mounting element to the glass composition; and heating the device to at most 400° C. so that a bond is produced between the mounting surface of the first mounting element and the glass composition and the second mounting element.

31 . The method according to claim 30 , wherein applying the glass composition to the mounting surface of the first mounting element comprises applying the glass composition as a powder or preproduced body.

Assignees

• Osram Gmbh

Inventors

• Eberhardt Angela
• Wille Christina
• Rüssel Christian
• Müller Matthias

Classifications

• H10W72/351

  Materials of die-attach connectors · CPC title

• H10W72/325

  Die-attach connectors having a filler embedded in a matrix · CPC title

• C03C3/122 Primary

  containing oxides of As, Sb, Bi, Mo, W, V, Te as glass formers · CPC title

• C03C2205/00

  Compositions applicable for the manufacture of vitreous enamels or glazes · CPC title

• C03C3/125

  containing aluminium as glass former · CPC title