Laser drilling method and laser drilling system

Patent metadata

Field	Value
Publication number	US-2016304386-A1
Application number	US-201414437027-A
Country	US
Kind code	A1
Filing date	Sep 30, 2014
Priority date	Jan 10, 2014
Publication date	Oct 20, 2016
Grant date	—

Abstract

The present disclosure provides a laser drilling method and a laser drilling system. The laser drilling method includes a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled, to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO 2 laser beam, aligning the CO 2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.

First claim

What is claimed is:

1 . A laser drilling method comprising:
a hole-boundary formation step of outputting a pulse laser beam and scanning a substrate to be drilled to form a boundary cutting groove of a preformed hole; a material-in-hole heating step of outputting a CO 2 laser beam, aligning the CO 2 laser beam with the preformed hole, and heating a substrate material of the preformed hole for a predetermined period of time; and a hole formation step of cooling the substrate material of the preformed hole, to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.

2 . The laser drilling method according to claim 1 , wherein in the hole-boundary formation step of outputting the pulse laser beam and scanning the substrate to be drilled, the pulse laser beam is angled at a predetermined angle relative to a line normal to the substrate to be drilled.

3 . The laser drilling method according to claim 1 , wherein during the execution of the step of outputting the pulse laser beam and scanning the substrate to be drilled, the step of outputting the CO 2 laser beam and heating the substrate material of the preformed hole for the predetermined period of time, and the step of cooling the substrate material of the preformed hole, the method further comprises:
a powder discharging step of discharging, at a surface of the substrate to be drilled, a powder generated during a cutting procedure by blowing air to or in-taking air from the boundary cutting groove via a nozzle.

4 . The laser drilling method according to claim 3 , wherein in the step of blowing air to or in-taking air from the boundary cutting groove, a plurality of nozzles is arranged at a regular interval around the boundary cutting groove.

5 . The laser drilling method according to claim 1 , further comprising:
a hole detection step of outputting a pulse laser beam, aligning the pulse laser beam with the preformed hole, judging whether or not there is a spark caused when the substrate material is being burnt from the preformed hole, if yes, determining that the substrate material has not fallen off from the substrate, and if no, determining that the substrate material has fallen off from the substrate.

6 . The laser drilling method according to claim 5 , wherein after one preformed hole is formed by the hole-boundary formation step, the material-in-hole heating step and the hole formation step, the hole detection step is performed on the preformed hole.

7 . The laser drilling method according to claim 5 , wherein when determining that the substrate material has not fallen off from the substrate, the method further comprises:
outputting a pulse laser beam and scanning the boundary cutting groove again; outputting a CO 2 laser beam, aligning the CO 2 laser beam with the preformed hole, and heating the substrate material of the preformed hole again for a predetermined period of time; and cooling the substrate material of the preformed hole again.

8 . The laser drilling method according to claim 1 , wherein in the material-in-hole heating step, the CO 2 laser beam is aligned with a center of the preformed hole.

9 . The laser drilling method according to claim 1 , wherein the hole formation step of cooling the substrate material of the preformed hole comprises feeding a low-temperature gas or liquid to the substrate material of the preformed hole.

10 . The laser drilling method according to claim 9 , wherein the low-temperature gas is nitrogen.

11 . The laser drilling method according to claim 10 , wherein in the hole formation step, the powder generated in the cutting procedure is discharged by means of a pressure of nitrogen.

12 . The laser drilling method according to claim 2 , wherein the predetermined angle is within a range of +45° to −45°.

13 . The laser drilling method according to claim 12 , wherein the predetermined angle is within a range of −15° to −30°.

14 . A laser drilling system comprising:
a pulse laser outputting mechanism configured to output a pulse laser beam and scan a substrate to be drilled to form a boundary cutting groove of a preformed hole; a CO 2 laser outputting mechanism configured to output a CO 2 laser beam, align the CO 2 laser beam with a center of the preformed hole, and heat a substrate material of the preformed hole for a predetermined period of time; and a cooling mechanism configured to cool the substrate material of the preformed hole to deform the substrate material and enable the substrate material to fall off from the substrate to be drilled.

15 . The laser drilling system according to claim 14 , further comprising:
an air injection mechanism which includes an air-duct arranged along one of two opposite surfaces of the substrate to be drilled, and a nozzle arranged on the air-duct, and which is configured to blow air to or in-take air from the boundary cutting groove via the nozzle, to discharge a powder generated during a cutting procedure.

16 . The laser drilling system according to claim 14 , wherein the pulse laser outputting mechanism is further configured to, after the substrate material of the preformed hole is cooled by the cooling mechanism, output a pulse laser beam and align the pulse laser beam with the preformed hole, to detect whether or not the substrate material has fallen off from the substrate to be drilled.

17 . The laser drilling system according to claim 16 , further comprising a detection mechanism configured to, after the substrate material of the preformed hole is cooled by the cooling mechanism and the pulse laser beam from the pulse laser outputting mechanism is aligned with the preformed hole, judge whether or not there is a spark from the preformed hole, if yes, determine that the substrate material has not fallen off from the substrate to be drilled, and if no, determine that the substrate material has fallen off from the substrate to be drilled.

18 . The laser drilling system according to claim 17 , wherein the detection mechanism comprises a CCD camera.

19 . The laser drilling system according to claim 15 , wherein the pulse laser outputting mechanism, the CO 2 laser outputting mechanism, the cooling mechanism and the air blowing mechanism are integrated onto a working table, and controlled by a controller on the working table, respectively.

Assignees

• Boe Technology Group Co Ltd
• Hefei Xinsheng Optoelectronics Technology Co Ltd

Inventors

• Dong Dai
• Gong Weigang
• Huang Yang
• Tao Sheng

Classifications

• C03B33/091 Primary

  using at least one focussed radiation beam, e.g. laser beam (C03B33/0955 takes precedence) · CPC title

• B23K26/0622

  by shaping pulses · CPC title

• B23K2103/00

  Materials to be soldered, welded or cut · CPC title

• B23K2103/42

  Plastics other than composite materials · CPC title

• B23K26/032

  using optical means · CPC title