Apparatus and method for material processing using a transparent contact element

Patent metadata

Field	Value
Publication number	US-2016303684-A1
Application number	US-201615052538-A
Country	US
Kind code	A1
Filing date	Feb 24, 2016
Priority date	Sep 29, 2006
Publication date	Oct 20, 2016
Grant date	—

Abstract

A method of preparing an apparatus for material processing by generating optical breakthroughs in an object. The apparatus includes a variable focus adjustment device. A contact element is mounted to the apparatus, the contact element has a curved contact surface having a previously known shape. The position of the contact surface is determined prior to processing the object, by focusing measurement laser radiation near or on the surface by the variable focus adjustment device, and the focus position is adjusted in a measurement surface intersecting the expected position of the contact surface. Radiation from the focus of the measurement laser radiation is confocally detected. The position of points of intersection between the measurement surface and the contact surface is determined from the confocally detected radiation to determine the position of the contact surface from the position of the points of intersection and the previously known shape of the contact surface.

First claim

1 .- 20 . (canceled)

21 . A method of material processing by producing optical breakthroughs in or on an object, the method comprising:
using a treatment apparatus comprising a laser source emitting pulsed processing laser radiation of femtosecond pulse length and a variable focus adjustment device for focusing the pulsed processing laser radiation along an optical axis to the object and for adjusting the focus in three dimensions based on a first coordinate system relating to a position of an element of the treatment apparatus; describing a geometry of the object in a second coordinate system relating to a position of the object wherein the first coordinate system and the second coordinate system differ; detecting a position of the object by controlling the variable focus adjustment device to focus measurement laser radiation to the object; determining an offset between the first coordinate system and the second coordinate system, and producing optical breakthroughs by focusing the pulsed processing laser radiation to different locations in or on the object by using the apparatus, wherein the variable focus adjustment device is controlled based on the first coordinate system and the offset.

22 . The method as claimed in claim 21 , wherein a surface of the object or a surface being in fixed geometrical relationship thereto is detected to detect the position of the object, which surface is a detected surface.

23 . The method as claimed in claim 22 , wherein the shape of the detected surface and an expected position of the detected surface are known previously and the position of the detected surface is detected by adjusting the focus of the measurement laser radiation in a measurement surface which intersects the expected position, and further by:
a) detecting radiation scattered back or reflected back from a focus of the measurement laser radiation; b) determining a position of points of intersection between the measurement surface and the detected surface from the detected radiation and a setting of the variable focus adjustment device; c) if a pre-determined number of points of intersection has not been found, repeating the steps (a) and (b) with modified measurement surfaces until the pre-determined number of points of intersection has been found, and d) determining the position of the detected surface from the positions of the points of intersection and the shape of the detected surface.

24 . The method as claimed in claim 23 , wherein in step (c) the measurement surface is modified by shifting the measurement surface used before in steps (a) and (b).

25 . The method as claimed in claim 21 , wherein a tilt between the first coordinate system and the second coordinate system is determined also by measuring a tilt of the object relative to the optical axis.

26 . The method as claimed in claim 21 , wherein the focus position is shifted along a path curve which is located in the measurement surface.

27 . The method as claimed in claim 23 , wherein the measurement surface is cylinder-symmetric to the optical axis.

28 . The method as claimed in claim 23 , wherein the measurement surface has the shape of a cylinder shell or of a circular disk.

29 . The method as claimed in claim 21 , wherein the measurement radiation is pulsed with a pulse energy not exceeding 300 nJ.

30 . The method as claimed in claim 26 , wherein the focus position is shifted along a path curve which is located in the measurement surface, has a maximum extent D, a pulse energy EPULS and a pulse frequency f for which
f< 20 Hz *(( D/EPULS )*(1 μJ/1 mm)) 4
holds true.

31 . The method as claimed in claim 26 , wherein a path curve is used which is located in the measurement surface and has a maximum extent D of between 1 μm and 15 mm.

32 . The method as claimed in claim 21 , wherein the measurement laser radiation is generated by switching pulsed laser radiation source a mode of reduced pulse energy or by arranging or activating an energy attenuator downstream the pulsed laser radiation source.

33 . The method as claimed in claim 21 , wherein the object is coupled to the apparatus by a contact element, which is transparent for the processing laser radiation, said contact element having a contact face to be placed onto the object and, located opposite and in known geometrical relation to the contact face, an entry face for receiving the processing laser radiation, both faces having a known shape, wherein the known shapes are defined in the second coordinate system relating to the contact glass and the position of the object is detected by detecting the position of the contact or entry face.

34 . The method as claimed in claim 33 , wherein the contact or entry face constitutes a detected surface and is detected by controlling the variable focus adjustment device to focus measurement laser radiation near or on the detected surface, an energy density of the focused measurement laser radiation being too low to produce an optical breakthrough, and by detecting measurement laser radiation scattered back or reflected,

35 . The method as claimed in claim 33 , wherein the position of the contact or entry face is detected after the contact element has been coupled to apparatus, but before the contact face is placed onto the object.

36 . The method as claimed claim 35 , wherein the contact face is covered during irradiation of the measurement laser radiation.

37 . The method as claimed in claim 35 , wherein the contact face is covered in a contactless manner.

38 . The method as claimed in claim 21 , wherein the object has a curved surface and the position of a vertex of the surface is determined and stored as a reference point.

39 . The method as claimed in claim 33 , wherein the contact or entry face has a curved surface and a shape of the surface is previously known to belong to a group of several different shapes, each known with respect to its exact geometry, and further comprising determining the position of a surface edge and, based on the relative position of the edge and of a vertex, determining the shape from the group of shapes which the surface has.

40 . A treatment apparatus for material processing of an object having a geometry described in a second coordinate system relating to a position of the object, the apparatus comprising:
a laser source emitting pulsed processing laser radiation of femtosecond pulse length and a variable focus adjustment device for focusing the pulsed processing laser radiation along an optical axis to the object and for adjusting the focus in three dimensions based on a first coordinate system relating to a position of an element of the treatment apparatus, wherein the laser source and the variable focus adjustment device are adapted such that optical breakthroughs form at the focus within the object and wherein the first coordinate system and the second coordinate system differ; a measurement laser radiation source emitting measurement laser radiation to the variable focus adjustment device for focusing the measurement processing laser radiation along the optical axis to the object and for adjusting the focus in three dimensions based on the first coordinate system; a detector device detecting measurement laser radiation scattered back or reflected back from the object and providing measurement signals; a control device controlling the laser source, the measurement laser radiation source, and the variable focus adjustment device, wherein the control device determines an

Assignees

• Zeiss Carl Meditec Ag

Inventors

• Bischoff Mark
• Stobrawa Gregor

Classifications

• B23K26/032

  using optical means · CPC title

• B23K26/0624

  using ultrashort pulses, i.e. pulses of 1 ns or less · CPC title

• B23K26/046 Primary

  Automatically focusing the laser beam · CPC title

• B23K2203/32

  Operations & Transport · mapped topic

• B23K26/042

  Automatically aligning the laser beam · CPC title