Low-emissivity coating film, method for manufacturing same, and functional construction material for window and doors including same

Patent metadata

Field	Value
Publication number	US-2016298384-A1
Application number	US-201415100637-A
Country	US
Kind code	A1
Filing date	Dec 11, 2014
Priority date	Dec 12, 2013
Publication date	Oct 13, 2016
Grant date	—

Abstract

The present invention relates to a low-emissivity coating film comprising: a base; a low-emissivity coating layer; and an uppermost coating layer, wherein the uppermost coating layer has a multilayer structure sequentially including, from the low-emissivity coating layer, a metal layer, a metal oxide layer and a silicon-based composite metal oxynitride layer.

First claim

1 . A low-emissivity coating film comprising:
a base; a low-emissivity coating layer; and an uppermost coating layer, wherein the uppermost coating layer has a multilayer structure sequentially including, from the low-emissivity coating layer, a metal layer, a metal oxide layer and a silicon-based composite metal oxynitride layer.

2 . The low-emissivity coating film of claim 1 , wherein the metal layer includes at least one selected from silicon, aluminum, titanium, zirconium, silicon-based composite metal, titanium-based composite metal, zirconium-based composite metal, and combinations thereof.

3 . The low-emissivity coating film of claim 1 , wherein the metal oxide layer includes at least one selected from silicon oxide, aluminum oxide, titanium oxide, zirconium oxide, silicon-based composite metal oxide, titanium-based composite metal oxide, zirconium-based composite metal oxide, and combinations thereof.

4 . The low-emissivity coating film of claim 1 , wherein the low-emissivity coating layer has a multilayer structure sequentially including, from the substrate, a first dielectric layer, a first low-emissivity protection layer, a low-emissivity layer, a second low-emissivity protection layer, and a second dielectric layer.

5 . The low-emissivity coating film of claim 4 , wherein the first dielectric layer or the second dielectric layer includes at least one selected from the group consisting of titanium oxide, tin zinc oxide, zinc oxide, zinc aluminum oxide, tin oxide, bismuth oxide, silicon nitride, silicon aluminum nitride, silicon tin nitride, and combinations thereof, or includes the at least one doped with at least one element selected from the group consisting of bismuth (Bi), boron (B), aluminum (Al), silicon (Si), magnesium (Mg), antimony (Sb), beryllium (Be), and combinations thereof.

6 . The low-emissivity coating film of claim 4 , wherein the first low-emissivity protection layer or the second low-emissivity protection layer includes at least one selected from the group consisting of nickel (Ni), chromium (Cr), nickel (Ni)-chromium (Cr) alloy, titanium (Ti) and combinations thereof.

7 . The low-emissivity coating film of claim 4 , wherein the low-emissivity layer includes at least one selected from the group consisting of silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), ion-doped metal oxides, and combinations thereof.

8 . The process according to claim 7 , wherein the polylactic acid resin in the form of pellet or powder is introduced into the extruder.

9 . The low-emissivity coating film of claim 1 , wherein the metal oxide layer has a thickness of 0.5 nm to 5 nm.

10 . The low-emissivity coating film of claim 1 , wherein the silicon-based composite metal oxynitride layer has a thickness of 2 nm to 20 nm.

11 . A method for manufacturing a low-emissivity coating film comprising:
(a) preparing a low-emissivity coating layer stacked on at least one surface of a base; (b) forming a metal layer by depositing a metal on the low-emissivity coating layer; and (c) forming a metal oxide layer on the metal layer, and forming a silicon-based composite metal oxynitride layer by depositing silicon-based composite metal oxynitride.

12 . The method of claim 11 , wherein the metal layer in (b) includes at least one selected from silicon, aluminum, titanium, zirconium, silicon-based composite metal, titanium-based composite metal, zirconium-based composite metal, and combinations thereof.

13 . The method of claim 11 , wherein the metal oxide layer in (c) includes at least one selected from silicon oxide, aluminum oxide, titanium oxide, zirconium oxide, silicon-based composite metal oxide, titanium-based composite metal oxide, zirconium-based composite metal oxide, and combinations thereof.

14 . The method of claim 11 , wherein the forming of the metal oxide layer in (c) is performed by partially oxidizing a surface of the metal layer through a post oxidation process of the surface of the metal layer.

15 . The method of claim 14 , wherein the post oxidation process is performed by using at least one reactive gas selected from the group consisting of oxygen (O2), nitrogen (N2) and argon (Ar).

16 . The method of claim 14 , wherein the partially oxidizing of the surface of the metal layer and the depositing of the silicon-based composite metal oxynitride in (c) are continuously performed in-situ.

17 . A functional construction material for window and doors comprising the low-emissivity coating film of claim 1 .

Assignees

• Lg Hausys Ltd

Inventors

• You Hyun-Woo
• Jun Youn-Ki
• Kwon Dae-Hoon

Classifications

• E06B3/00

  Window sashes, door leaves, or like elements for closing {wall or like} openings; Layout of fixed or moving closures, e.g. windows {in wall or like openings}; Features of rigidly-mounted outer frames relating to the mounting of wing frames (E06B5/00 takes precedence; shutters or the like E06B9/00; glass panes C03) · CPC title

• C03C17/3626

  one layer at least containing a nitride, oxynitride, boronitride or carbonitride · CPC title

• C23C16/06

  characterised by the deposition of metallic material · CPC title

• C03C17/3644

  the metal being silver · CPC title

• C09D7/40 Primary

  Additives · CPC title