Dielectric thick film ink

Patent metadata

Field	Value
Publication number	US-2016297977-A1
Application number	US-201514680200-A
Country	US
Kind code	A1
Filing date	Apr 7, 2015
Priority date	Apr 7, 2015
Publication date	Oct 13, 2016
Grant date	—

Abstract

A thermally conductive thick film dielectric ink for an electronic device includes a mixture of an organic medium, a glass binder, and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

First claim

What is claimed is:

1 . A thermally conductive thick film dielectric ink for an electronic device, the thick film dielectric ink comprising a mixture of:
an organic medium; a glass binder; and a technical ceramic powder having ceramic particles dispersed throughout the thick film dielectric ink mixture.

2 . The thermally conductive thick film dielectric ink of claim 1 , wherein the technical ceramic powder is present in an amount from about 4.0% to about 22.0% by weight of the thick film dielectric ink.

3 . The thermally conductive thick film dielectric ink of claim 2 , wherein the technical ceramic powder is aluminum nitride, silicon carbide, beryllium oxide, boron nitride, or silicon nitride.

4 . The thermally conductive thick film dielectric ink of claim 1 , wherein the organic medium is present in an amount from about 14.0 to about 32.0% by weight of the thick film dielectric ink.

5 . The thermally conductive thick film dielectric ink of claim 4 , wherein the organic medium comprises 2,2,4-trimethyl-1,3-pentanediol, Diethylene Glycol Dibutyl Ether, Dodecyl Alcohol, Tridecyl Alcohol, and Ethyl Cellulose.

6 . The thermally conductive thick film dielectric ink of claim 5 , wherein the 2,2,4-trimethyl-1,3-pentanediol is present in an amount from about 81.0% to about 82.0% by weight of the organic medium, the Diethylene Glycol Dibutyl Ether is present in an amount from about 7.0% to about 11.0% by weight of the organic medium, the Dodecyl Alcohol is present in an amount about 2.0% by weight of the organic medium, the, Tridecyl Alcohol is present in an amount from about 1.0% to about 4.0% by weight of the organic medium, and the Ethyl Cellulose is present in an amount from about 3.0 to about 6.5% by weight of the organic medium.

7 . The thermally conductive thick film dielectric ink of claim 1 , wherein the glass binder is present in an amount from about 48.0% to about 82.0% by weight of the thick film dielectric ink.

8 . The thermally conductive thick film dielectric ink of claim 7 , wherein the glass binder comprises lead(II) oxide, silicon dioxide, boron trioxide, and aluminum oxide.

9 . The thermally conductive thick film dielectric ink of claim 8 , wherein the lead(II) oxide is present in an amount from about 65.0% to about 67.5% by weight of the glass binder, the silicon dioxide is present in an amount from about 21.5% to about 22.5% by weight of the glass binder, the boron trioxide is present in an amount from about 8.0% to about 9.0% by weight of the glass binder, and the aluminum oxide is present in an amount from about 2.0% to about 3.0% by weight of the glass binder.

10 . A power inverter for hybrid vehicles comprising:
a metal layer forming a circuit on which electronic components are disposed; a substrate forming a heat sink; and a thick film dielectric ink layer according to claim 1 , wherein the thick film thermally conductive dielectric ink layer is interposed between the metal layer and the substrate.

11 . An electronic device comprising:
a metal layer forming a circuit on which electronic components are disposed; a substrate forming a heat sink; and a thick film dielectric ink layer interposed between the metal layer and the substrate, wherein the thick film dielectric ink layer is thermally conductive.

12 . The electronic device of claim 11 , wherein the thick film thermally conductive dielectric ink comprises an organic medium, a glass binder, and a technical ceramic power.

13 . The electronic device of claim 12 , wherein the technical ceramic powder is present in an amount from about 4.0% to about 22.0% by weight of the thick film dielectric ink.

14 . The electronic device of claim 13 , wherein the technical ceramic powder is aluminum nitride, silicon carbide, beryllium oxide, boron nitride, or silicon nitride.

15 . The electronic device of claim 11 , wherein the organic medium is present in an amount from about 14.0 to about 32.0% by weight of the thick film dielectric ink and comprises 2,2,4-trimethyl-1,3-pentanediol, Diethylene Glycol Dibutyl Ether, Dodecyl Alcohol, Tridecyl Alcohol, and Ethyl Cellulose.

16 . The electronic device of claim 11 , wherein the glass binder is present in an amount from about 48.0% to about 82.0% by weight of the thick film dielectric ink and comprises lead(II) oxide, silicon dioxide, boron trioxide, and aluminum oxide.

17 . The electronic device of claim 11 , wherein the substrate is a conductive metallic substrate containing aluminum, copper, or stainless steel, or alternatively, the substrate is a ceramic substrate containing alumina, silicon nitride, silicon carbide, or aluminum nitride.

18 . The electronic device of claim 11 , wherein the electronic device is an electronic power module.

19 . A method of making an electronic device, the method comprising the steps of:
depositing a thick film thermally conductive dielectric ink overlying a substrate, wherein the thick film thermally conductive dielectric ink comprises a mixture of:
an organic medium;
a glass binder; and
a technical ceramic powder;
firing the thick film thermally conductive dielectric ink to form a bond to the substrate; and depositing a thick film conductive ink trace onto the thick film thermally conductive dielectric ink.

20 . The method of making an electronic device according to claim 19 , wherein the technical ceramic powder is aluminum nitride, silicon carbide, beryllium oxide, boron nitride, or silicon nitride, and is present in an amount from about 4.0% to about 22.0% by weight of the thick film dielectric ink, and wherein the organic medium is present in an amount from about 14.0 to about 32.0% by weight of the thick film dielectric ink and comprises 2,2,4-trimethyl-1,3-pentanediol, Diethylene Glycol Dibutyl Ether, Dodecyl Alcohol, Tridecyl Alcohol, and Ethyl Cellulose, and wherein the glass binder is present in an amount from about 48.0% to about 82.0% by weight of the thick film dielectric ink and comprises lead(II) oxide, silicon dioxide, boron trioxide, and aluminum oxide.

Assignees

• Gm Global Tech Operations Llc

Inventors

• Albaugh Lisa M
• Smith David A
• Guse Timothy J

Classifications

• H01B3/08

  quartz; glass; glass wool; slag wool; vitreous enamels · CPC title

• H01B3/12

  ceramics · CPC title

• C09D11/03 Primary

  characterised by features other than the chemical nature of the binder · CPC title

• C09K5/10

  Liquid materials · CPC title

• C09D11/52

  Electrically conductive inks · CPC title