System and method for neural interface with modular active electronics

Patent metadata

Field	Value
Publication number	US-2016296130-A1
Application number	US-201514684673-A
Country	US
Kind code	A1
Filing date	Apr 13, 2015
Priority date	Apr 13, 2015
Publication date	Oct 13, 2016
Grant date	—

Abstract

A modular, high density electrical system is disclosed which makes use of an interface component, which is well suited to being placed in contact with an anatomy of either a human or an animal, and which may be releasably coupled to an electronics module subsystem. The interface component has a plurality of electrically conductive interconnect pads that may be releasably secured by a member to a plurality of electrically conductive pads of the electronics module subsystem. The electronics module subsystem may have a substrate which supports both an electronics circuit and the interconnect pads.

First claim

What is claimed is:

1 . A modular, high density system comprising:
a interface component having:
a flexible substrate;
a plurality of independent, electrically conductive elements disposed on the substrate in communication with a plurality of electrically conductive interconnect pads, also disposed on the substrate;
an electronics module subsystem independent of the interface component, including:
a substrate;
an electronics circuit supported on the substrate;
a plurality of electrically conductive pads in electrical communication with the electronics circuit;
the interface component being of dimensions enabling a portion thereof having the electrically conductive interconnect pads to be positioned in electrical contact with the electrically conductive pads; and
a member for releasably holding the electrically conductive interconnect pads in contact with the electrically conductive pads of the electronics module subsystem.

2 . The system of claim 1 , wherein the system forms at least one of:
a data acquisition system for recording at least one of electrical signals; or a system for supplying electrical stimulation signals.

3 . The system of claim 1 , further comprising an interconnector assembly configured to be sandwiched between the electrically conductive pads and the electrically conductive interconnect pads, to assist in forming electrically conductive connections between the electrically conductive pads and the electrically conductive interconnect pads.

4 . The system of claim 3 , wherein the interconnector assembly includes:
an insulating material being at least one of flexible and slightly compressible, and forming a generally planar member having opposing generally planar surfaces; and a plurality of electrically conductive wires embedded in the insulating material such that portions of each of the wires are exposed on the opposing generally planar surfaces, and thus able to make electrically conductive contact with the electrically conductive interconnect pads and the electrically conductive pads.

5 . The system of claim 4 , wherein the density of the plurality of electrically conductive wires is greater than the density of the electrically conductive interconnect pads.

6 . The system of claim 5 , wherein alignment of the interconnector assembly with the electrically conductive pads and the electrically conductive interconnect pads is not critical because of a dense packaging of the electrically conductive wires, and since none one of the electrically conductive wires, when compressed, can bridge a gap between adjacent ones of the electrically conductive interconnect pads.

7 . The system of claim 1 , wherein the flexible substrate is formed from at least one of a flexible polymer or silicon.

8 . The system of claim 1 , wherein the electrically conductive elements are formed in a first region of the substrate of the neural interface component, and the electrically conductive interconnect pads are formed in a second region of the substrate of the neural interface component.

9 . The system of claim 8 , further comprising a plurality of circuit traces connecting the electrically conductive elements and the electrically conductive interconnect pads.

10 . The system of claim 1 , wherein the system includes at least one of the following features:
the electronics circuit comprises a hermetically sealed subsystem; the electronics module subsystem further includes a connector for enabling an external electrical communications cable to be coupled in communication with the electronics circuit; or the electronics circuit includes at least one antenna for at least one of wireless data transmission or reception; the electronics circuit includes at least one antenna for enabling wireless power telemetry.

11 . The system of claim 1 , wherein the electronics module subsystem is constructed of biocompatible materials suitable for extended contact with a skin layer or implanted into tissue of at least one of a human or an animal.

12 . A modular, high density electrical data acquisition system comprising:
a neural interface component having:
a flexible substrate;
a plurality of independent, electrically conductive elements disposed on the substrate within a first region of the flexible substrate;
a plurality of electrically conductive traces formed on the flexible substrate, and in communication with the electrically conductive elements;
a plurality of electrically conductive interconnect pads formed in an array on the substrate within a second region, and being in communication with the plurality of electrically conductive traces;
an electronics module subsystem independent of the neural interface component, including:
a substrate;
an electronics circuit supported on the substrate;
a plurality of electrically conductive pads supported on the substrate and being in electrical communication with the electronics circuit, with the plurality of electrically conductive pads being configured in accordance with the array of the electrically conductive interconnect pads;
an independent interconnect subassembly configured to be positioned between the neural interface component and the electronics module subsystem, and to facilitate non-permanent electrically conductive connections between the array of electrically conductive interconnect pads and the electrically conductive pads when the second region of the neural interface component is aligned over the electrically conductive pads; and a member for assisting in clamping the second region of the neural interface component and the independent interconnect subassembly adjacent the substrate of the electronics module subsystem.

13 . The system of claim 12 , wherein the independent interconnect subassembly comprises:
a non-electrically conductive substrate forming a planar component having opposing generally planar surfaces; a plurality of electrically conductive wires embedded in the non-electrically conductive substrate such that the electrically conductive wires are exposed at both of the opposing generally planar surfaces, and operate to assist in making electrically conductive connections between the electrically conductive interconnect pads and the electrically conductive pads.

14 . The system of claim 12 , wherein the substrate of the neural interface component is formed from at least one of a flexible polymer or silicon.

15 . The system of claim 12 , wherein the system includes at least one of the following features:
the member for assisting in clamping the electrically conductive interconnect forms an independent component; the member for assisting in clamping comprises at least one of a mechanical, chemical or magnetic feature; or the member cooperates with an O-ring to seal a portion of the system from moisture ingress.

16 . The system of claim 12 , wherein the electronic circuit of the electronics module subsystem comprises a hermetically sealed subsystem.

17 . The system of claim 12 , wherein the electronic circuit includes at least one of:
a processor; multiplexer; an amplifier; a battery; a filtering circuit; a memory; a circuit for generating electrical stimulation signals for application to the anatomy; and a wireless communications subsystem.

18 . The system of claim 12 , wherein the substrate of the electronics module subsystem further comprises an electrical connector in communication with the electronics circuit for receiving an external electrical communications cable.

19 . A method for

Assignees

• L Livermore Nat Security Llc

Inventors

• Shah Kedar G
• Felix Sarah H
• Pannu Satinderpall S
• Tolosa Vanessa
• Tooker Angela C

Classifications

• A61N1/37211 Primary

  Means for communicating with stimulators · CPC title

• A61N1/0551

  Spinal or peripheral nerve electrodes · CPC title

• A61B5/6877

  Nerve · CPC title

• A61N1/3787

  from an external energy source · CPC title

• A61B5/0002

  Remote monitoring of patients using telemetry, e.g. transmission of vital signals via a communication network (endoradiosondes A61B5/07) · CPC title