Flexible electronic module and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2016295689-A1
Application number	US-201514983594-A
Country	US
Kind code	A1
Filing date	Dec 30, 2015
Priority date	Mar 31, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

A flexible electronic module including a patterned flexible substrate, a stretchable material layer, and at least one electronic device is provided. The patterned flexible substrate includes at least one distributed region, and the stretchable material layer connects the distributed region. The electronic device is disposed on at least one of the patterned flexible substrate and the stretchable material layer. A manufacturing method of the flexible electronic module is also provided.

First claim

What is claimed is:

1 . A flexible electronic module, comprising:
a patterned flexible substrate, comprising at least one distributed region; a stretchable material layer, connected with the distributed region; and at least one electronic device, disposed on at least one of the patterned flexible substrate and the stretchable material layer, the at least one electronic device comprising a stretchable conductive wire.

2 . The flexible electronic module according to claim 1 , wherein a ratio of a Young's modulus of the patterned flexible substrate to a Young's modulus of the stretchable material layer is greater than or equal to 10.

3 . The flexible electronic module according to claim 1 , wherein at least part of the at least one distributed region comprises a plurality of island structures separately from each other.

4 . The flexible electronic module according to claim 1 , wherein at least part of the at least one distributed region comprises a plurality of bump structures, a recess is between every two adjacent bump structures of the patterned flexible substrate, and the every two adjacent bump structures are connected together through a bottom of the recess.

5 . The flexible electronic module according to claim 1 , further comprising:
a covering layer, wherein the patterned flexible substrate is disposed between the stretchable material layer and the covering layer, and a material of the covering layer comprises a stretchable material.

6 . The flexible electronic module according to claim 1 , further comprising:
a de-bonding layer, disposed on the patterned flexible substrate.

7 . The flexible electronic module according to claim 6 , wherein the de-bonding layer is further disposed on the stretchable material layer.

8 . The flexible electronic module according to claim 6 , wherein an adhesive force between the stretchable material layer and the patterned flexible substrate is greater than an adhesive force between the patterned flexible substrate and the de-bonding layer.

9 . The flexible electronic module according to claim 1 , wherein the at least one electronic device comprises a plurality of first electrodes, the stretchable material layer is distributed between the first electrodes, and the patterned flexible substrate, the stretchable material layer and the at least one electronic device form a flexible printed circuit (FPC).

10 . The flexible electronic module according to claim 9 , further comprising:
a flexible electronic device, comprising a plurality of second electrodes, the second electrodes being respectively electrically connected with the first electrodes through an anisotropic conductive film, or respectively through a plurality of anisotropic conductive films.

11 . The flexible electronic module according to claim 10 , wherein the flexible electronic device comprises:
another patterned flexible substrate, comprising at least another distributed region, wherein the second electrodes are disposed on the another distributed region; and another stretchable material layer, connected with the another distributed region and disposed between the second electrodes.

12 . A manufacturing method of a flexible electronic module, comprising:
forming a flexible substrate; patterning the flexible substrate to form at least one distributed region; forming a stretchable material layer connected with the distributed region; and forming at least one electronic device on at least one of the flexible substrate and the stretchable material layer.

13 . The manufacturing method according to claim 12 , wherein the step of forming the at least one electronic device on at least one of the flexible substrate and the stretchable material layer comprises:
forming a conductive layer before patterning the flexible substrate; and patterning the conductive layer to form the at least one electronic device.

14 . The manufacturing method according to claim 13 , wherein the step of patterning the flexible substrate comprises:
forming a patterned mask layer covering the electronic device on the flexible substrate; and etching, digging or imprinting part of the flexible substrate which is exposed from the patterned mask layer by using the patterned mask layer as a barrier layer to form the distributed region.

15 . The manufacturing method according to claim 14 , wherein the step of forming the stretchable material layer connected with the distributed region comprises:
forming the stretchable material layer on the flexible substrate, filling the stretchable material layer in a gap of the distributed region, and covering the electronic device with the stretchable material layer.

16 . The manufacturing method according to claim 12 , wherein the step of forming the at least one electronic device on at least one of the flexible substrate and the stretchable material layer comprises:
forming a conductive layer on the stretchable material layer; and patterning the conductive layer to form the at least one electronic device.

17 . The manufacturing method according to claim 16 , further comprising:
imprinting the stretchable material layer by using a bump mold to form a pattern on the stretchable material layer.

18 . The manufacturing method according to claim 12 , further comprising:
forming a de-bonding layer on a rigid carrier before forming the flexible substrate, wherein the step of forming the flexible substrate comprises fondling the flexible substrate on the de-bonding layer, and an adhesive force between the de-bonding layer and the flexible substrate is greater than an adhesive force between the de-bonding layer and the rigid carrier.

19 . The manufacturing method according to claim 18 , wherein the flexible substrate covers an edge of the de-bonding layer, and the manufacturing method further comprises:
cutting off a part of the flexible substrate covering the edge of the de-bonding layer, and separating the rigid carrier from the de-bonding layer.

20 . The manufacturing method according to claim 18 , wherein an adhesive force between the stretchable material layer and the flexible substrate is greater than the adhesive force between the flexible substrate and the de-bonding layer.

21 . The manufacturing method according to claim 18 , further comprising:
forming a modification layer on the de-bonding layer, wherein the flexible substrate is formed on the modification layer, and the modification layer is disposed between the flexible substrate and the de-bonding layer.

22 . The manufacturing method according to claim 12 , further comprising:
forming a sacrificial layer on a rigid carrier before forming the flexible substrate, wherein the step of forming the flexible substrate comprises forming the flexible substrate on the sacrificial layer; and after the steps of patterning the flexible substrate, forming the stretchable material and forming the electronic device, irradiating the sacrificial layer by using a laser to separating the flexible substrate from the rigid carrier.

23 . The manufacturing method according to claim 12 , wherein a ratio of a Young's modulus of the flexible substrate to a Young's modulus of the stretchable material layer is greater than or equal to 10.

24 . The manufacturing method according to claim 12 , further comprising:
forming a covering layer on the patterned flexible substrate, wherein the flexible substrate is disposed between the stretc

Assignees

• Ind Tech Res Inst

Inventors

• Chang Chih-Chia
• Yang Ming-Huan
• Lee Cheng-Chung
• Ho Jia-Chong
• Tsai Chen-Chu
• Chuang Kun-Lin

Classifications

• H05K2201/0191

  wherein the thickness of the dielectric plays an important role · CPC title

• H05K2201/0187

  with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties · CPC title

• H05K3/284

  for encapsulating mounted components (H05K1/185 takes precedence) · CPC title

• H05K3/007

  Manufacture or processing of a substrate for a printed circuit board supported by a temporary or sacrificial carrier (H05K1/187, H05K3/20 and H05K3/4682 take precedence) · CPC title

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title