Electronic control unit and method of manufacturing the same
US-9320178-B2 · Apr 19, 2016 · US
Electronic unit
US2016295681A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016295681-A1 |
| Application number | US-201615090195-A |
| Country | US |
| Kind code | A1 |
| Filing date | Apr 4, 2016 |
| Priority date | Apr 6, 2015 |
| Publication date | Oct 6, 2016 |
| Grant date | — |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substrate to detect temperature. The first interconnection is provided in a high-temperature region in which the heating component is mounted on the substrate, and is connected to the strut of the heat sink. The second interconnection is provided in a detection region in which the temperature sensor is mounted on the substrate, and is provided separately from the first interconnection. The second interconnection is connected to the strut of the heat sink and the temperature sensor.
First claim
Opening claim text (preview).
What is claimed is: 1 . An electronic unit, comprising: a heat sink that includes a strut; a substrate that is fixed to the strut of the heat sink; a heating component that is mounted on the substrate to generate heat upon energization of the heating component; a temperature sensor that is mounted on the substrate to detect temperature; a first interconnection that is provided in a high-temperature region in which the heating component is mounted on the substrate and that is connected to the strut of the heat sink; and a second interconnection that is provided in a detection region in which the temperature sensor is mounted on the substrate and that is provided separately from the first interconnection, wherein the second interconnection is connected to the strut of the heat sink and the temperature sensor. 2 . The electronic unit according to claim 1 , further comprising a slit that is formed between the first interconnection and the second interconnection wherein: resin, from which the substrate is formed, is provided in between the slit; and the slit is provided at a position corresponding to the strut of the heat sink. 3 . The electronic unit according to claim 1 , wherein: the substrate is a multilayer substrate; and the first interconnection and the second interconnection are separated from each other on a surface layer of the substrate and in an inner layer of the substrate. 4 . The electronic unit according to claim 1 , wherein: the first interconnection is electrically connected to the heating component; the second interconnection is electrically connected to the temperature sensor; and the first interconnection and the second interconnection are electrically connected to each other via the strut of the heat sink. 5 . The electronic unit according to claim 1 , further comprising a screw for fixing together the strut of the heat sink and the substrate. 6 . The electronic unit according to claim 1 , further comprising a third interconnection that is provided in a meandering manner on a surface layer of the substrate or through an inner layer of the substrate, wherein the third interconnection electrically connects together a terminal of the temperature sensor and the first interconnection. 7 . The electronic unit according to claim 1 , wherein: the strut is one of a plurality of struts; the second interconnection is connected to a first one of the plurality of struts; and the first interconnection is connected to the first one of the plurality of struts as well as to a second one of the plurality of struts which is located at a different position from the first one of the plurality of struts.
Assignees
Inventors
Classifications
- H05K1/0203Primary
Cooling of mounted components (H05K1/0272 takes precedence) · CPC title
by using a temperature sensor · CPC title
Screws · CPC title
- H05K3/0061Primary
onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title
using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US2016295681A1 cover?
- An electronic unit includes a heat sink, a substrate, a heating component, a temperature sensor, a first interconnection, and a second interconnection. The heat sink includes a strut. The substrate is fixed to the strut of the heat sink. The heating component is mounted on the substrate to generate heat upon energization of the heating component. The temperature sensor is mounted on the substra…
- Who is the assignee on this patent?
- Denso Corp
- What technology area does this patent fall under?
- Primary CPC classification H05K1/0203. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Thu Oct 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).