Image pickup device

Patent metadata

Field	Value
Publication number	US-2016293650-A1
Application number	US-201415024146-A
Country	US
Kind code	A1
Filing date	Nov 20, 2014
Priority date	Nov 26, 2013
Publication date	Oct 6, 2016
Grant date	—

Abstract

[Object] To provide an image pickup device that has excellent durability and is capable of thinning an image pickup optical system without lowering image pickup performance.
[Solving Means] An image pickup device according to the present technique includes an on-chip lens, a low-refractive-index layer, and an infrared absorption layer. The on-chip km is formed of a high-refractive-index material. The low-refractive-index layer is formed flat on the on-chip lens and formed of a low-refractive-index material. The infrared absorption layer is formed of an infrared absorption material and laminated as a higher layer than the low-refractive-index layer, the infrared absorption, material including are infrared absorption, pigment and a binder resin, the binder resin, being a synthetic resin constituted of a siloxane skeleton alone or a synthetic resin constituted of a siloxane skeleton part and a partial skeleton having a low reaction activity in an oxygen part.

First claim

1 . An image pickup device, comprising:
an on-chip lens formed of a high-refractive-index material; a low-refractive-index layer that is formed fiat on the on-chip lens and formed of a low-refractive-index material; and an infrared absorption layer that is formed of an infrared absorption material and laminated as a higher layer than the low-refractive-index layer, the infrared absorption material including an infrared absorption pigment and a hinder resin, the binder resin being a synthetic resin constituted of a siloxane skeleton alone or a synthetic resin constituted of a siloxane skeleton part and a partial-skeleton, having a low reaction activity in an oxygen part.

2 . The image pickup device according to claim 1 ,
wherein the infrared absorption material has a heat yellowing temperature of 180° C. or more.

3 . The image pickup device according to claim 1 ,
wherein the infrared absorption pigment has a maximum absorption, wavelength of 600 nm or more and 1200 nm or less and a molar absorption coefficient of 1000 L/mol·cm or more.

4 . The image pickup device according to claim 1 ,
wherein the infrared absorption pigment includes an anion part that has a larger size or formula weight or is more difficult to be oxidized than perchlorate ions and a cation part that has a larger size or formula weight or is more difficult to be oxidized than ammonium ions.

5 . The image pickup device according to claim 1 , further comprising
a protection layer that is laminated on tire infrared absorption layer and shields oxygen and moisture or suppresses a physical damage.

6 . The image pickup device according to claim 1 , further comprising
a bandpass layer that is laminated as a higher layer than the low-refractive-index layer and is constituted of a multilayer film formed of a high-refractive-index material and a low-refractive-index material.

7 . The image pickup device according to claim 1 , further comprising
an antireflection layer that is laminated as a top layer and prevents reflection of tight entering from an upper layer side and a lower layer side.

8 . The image pickup device according to claim 1 , further comprising
a color filter layer that is laminated as a lower layer than the on-chip lens.

9 . The image pickup device according to claim 1 , further comprising a support substrate that supports the infrared absorption layer.

10 . The image pickup device according to claim 1 , further comprising
an adhesive layer that is formed of an adhesive material and is laminated on the low-refractive-index layer.

11 . An image pickup device, comprising:
an on-chip lens formed of a high-refractive-index material; a low-refractive-index layer that is formed fiat on the on-chip lens and formed of a low-refractive-index material; and an infrared absorption layer that is formed of an infrared absorption material and laminated as a higher layer than the low-refractive-index layer, the infrared absorption material including art infrared absorption pigment in a form of fine particles having a minor axis of 1 nm or more and a major axis of 50 nm or less.

12 . The image pickup device according to claim 11 ,
wherein the infrared absorption material includes at least one of a binder resin and an additive.

13 . The image pickup device according to claim 11 ,
wherein the infrared absorption pigment has, a maximum absorption wavelength of 600 nm or more and 1200 nm or less and a molar absorption coefficient of 1000 L/mol·cm or more.

14 . The image pickup device according to claim 11 ,
wherein the infrared absorption pigment includes an anion part that has a larger size or formula weight or is more difficult to be oxidized than perchlorate tons and a cation part that has a larger size or formula weight or is more difficult to be oxidized than ammonium ions.

15 . The image pickup device according to claim 11 , further comprising
a protection layer that is laminated on the infrared absorption layer and shields oxygen and moisture or suppresses a physical damage.

16 . The image pickup device according to claim 11 , further comprising
a bandpass layer that, is laminated as a higher layer than the low-refractive-index layer and is constituted of a multilayer film formed of a high-refractive-index material and a low-refractive-index material.

17 . The image pickup device according to claim 11 , further comprising
an antireflection layer that is laminated as a top layer and prevents reflection of light entering from an upper layer side and a lower layer side.

18 . The image pickup device according to claim 11 , further comprising
a color filter layer that is laminated as a lower layer than the on-chip lens.

19 . The image pickup device according to claim 11 , further comprising
a support substrate that supports the infrared absorption layer.

20 . The image pickup device according to claim 11 , further comprising
an adhesive layer that is formed of an adhesive material and is laminated on the low-refractive-index layer.

Assignees

• Sony Corp

Inventors

• Kimura Nozomi
• Imaizumi Shinji

Classifications

• H10F39/8053

  Colour filters · CPC title

• H10F39/806

  Optical elements or arrangements associated with the image sensors · CPC title

• H10F39/805

  Coatings · CPC title

• H10F39/024

  of coatings or optical elements · CPC title

• H10F30/10

  the devices being sensitive to infrared radiation, visible or ultraviolet radiation, and having no potential barriers, e.g. photoresistors · CPC title