Selectively Removing Titanium Nitride Hard Mask and Etch Residue Removal

US2016293479A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016293479-A1
Application numberUS-201615077374-A
CountryUS
Kind codeA1
Filing dateMar 22, 2016
Priority dateMar 31, 2015
Publication dateOct 6, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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Abstract

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Formulations for stripping titanium nitride hard mask and removing titanium nitride etch residue comprise an amine salt buffer, a non-ambient oxidizer, and the remaining being liquid carrier includes water and non-water liquid carrier selected from the group consisting of dimethyl sulfone, lactic acid, glycol, and a polar aprotic solvent including but not limited to sulfolanes, sulfoxides, nitriles, formamides and pyrrolidones. The formulations have a pH <4, preferably <3, more preferably <2.5. The aqueous formulations having water as liquid carrier and semi-aqueous formulation having water and non-polar aprotic solvent(s) further contain acidic fluoride. The formulations offer high titanium nitride etch rates while provide excellent compatibility towards W, AlN, AlO, and low k dielectric materials. The formulations may comprise weakly coordinating anions, corrosion inhibitors, and surfactants. Systems and processes use the formulations for stripping titanium nitride hard mask and removing titanium nitride etch residue.

First claim

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1 . A composition for selectively removing titanium nitride (TiN or TiNxOy; where x=0 to 1.3 and y=0 to 2) from a semiconductor device comprising titanium nitride and a second material; the composition comprising: an amine salt buffer; a non-ambient oxidizer; and liquid carrier; wherein the composition comprises no hydrogen peroxide; the composition has a pH<4; the second material is selected from the group consisting of Cu, W, aluminum nitride (AlNx with x=0.5 to 1), aluminum oxide(AlOx with x=1 to 1.5), low-k dielectric material, and combinations thereof; and the composition offers a removal selectivity of TiN or TiNxOy vs. the second material >1:1. 2 . The composition of claim 1 , wherein the amine salt buffer is present in the range of 0.5 to 10 wt % and is selected from the group consisting of: ammonium chloride; ammonium bisulfate; ammonium phosphates; ammonium oxalate; ammonium perfluorosulfonates; ammonium tetrafluoroborate; ammonium hexafluorotitanate; ammonium hexafluorosilicate; ammonium salts of organic acid selected from ammonium citrate, ammonium acetate, ammonium lactate; and combinations thereof; wherein the ammonium having a form of N(R 1 R 2 R 3 R 4 ) + ; wherein R 1 ,R 2 , R 3 ,R 4 is independently selected from the group consisting of H, CH 3 , C 2 H 5 , and C 3 H 7 . 3 . The composition of claim 1 , wherein the non-ambient oxidizer is present in the range of 0.2 to 3 wt % and is selected from the group consisting of salt of persulfate selected from the group consisting of sodium persulfate, ammonium persulfate, and combinations thereof; salt of iodate, salt of periodate, Cl(I, III or V) compounds, Br(I, III or V) compounds, and combinations thereof. 4 . The composition of claim 1 , wherein the liquid carrier is water; and the composition further comprises <4000 ppm of an acidic fluoride selected from the group consisting of ammonium bifluoride, alkylammonium bifluoride, aqueous hydrogen fluoride, fluorosilicic acid, fluoroboric acid, acid of hydrated fluoroaluminate, and combinations thereof. 5 . The composition of claim 4 , wherein the amine salt buffer is selected from the group consisting of ammonium chloride, ammonium bisulfate and combinations thereof; the non-ambient oxidizer is selected from the group consisting of ammonium persulfate, sodium persulfate, and combinations thereof; and the acidic fluoride is selected from the group consisting of ammonium bifluoride, hydrofluoric acid, and combinations thereof. 6 . The composition of claim 1 , wherein the composition is a semi-aqueous composition having liquid carrier comprising water and at least one non-water liquid carrier selected from the group consisting of dimethyl sulfone, lactic acid, glycol, a polar aprotic solvent selected from the group consisting of sulfolanes, sulfoxides, nitriles, formamides and pyrrolidones, and combinations thereof; and the composition further comprises <4000ppm of an acidic fluoride selected from the group consisting of ammonium bifluoride, alkylammonium bifluoride, aqueous hydrogen fluoride, fluorosilicic acid, fluoroboric acid, acid of hydrated fluoroaluminate, and combinations thereof. 7 . The composition of claim 6 , wherein the amine salt buffer is selected from the group consisting of ammonium chloride, ammonium bisulfate and combinations thereof; the non-ambient oxidizer is selected from the group consisting of ammonium persulfate, sodium persulfate, and combinations thereof; and the acidic fluoride is selected from the group consisting of ammonium bifluoride, hydrofluoric acid, and combinations thereof. 8 . The composition of claim 1 , wherein the composition is a semi-aqueous composition having liquid carrier consisting of water and a polar aprotic solvent selected from the group consisting of sulfolane, sulfoxide, nitrile, formamide, pyrrolidone, and combinations thereof. 9 . The composition of claim 8 , wherein the amine salt buffer is selected from the group consisting of ammonium chloride, ammonium bisulfate and combinations thereof; and the non-ambient oxidizer is selected from the group consisting of ammonium persulfate, sodium persulfate, and combinations thereof. 10 . The composition of claim 1 further comprises at least one selected from the group consisting of a weakly coordinating anion is present in the range of 1 to 10 wt % and is selected from the group consisting of: p-toluenesulfonate (C 7 H 8 SO 3 − ), sulfate (SO 4 2− ), nitrate(NO 3 − ), triflate(CF 3 SO 3 − ), perfluorosulfonates (R f SO 3 − ; where R f is a perfluoroalkylgroup from C1 to C4), perfluorosulfonimides; ((R f ) 2 NSO 2 − ; where R f is a perfluoroalkylgroup from C1 to C4), hexafluorosilicate(SiF 6 2− ), hexafluorotitanate (TiF 6 2− ), tetrafluoroborate(BF 4 − ), hexafluorophosphate (PF 6 − ), hexafluoroantimonate (SbF 6 − ), perfluoroalkylaluminates((RfO) 4 Al; R f is a perfluoroalkyl group), and combinations thereof; and a corrosion inhibitor in the range of <2000 ppm selected from the group consisting of benzotriazole or substituated benzotriazole, polyethyleneimine, catechol, cysteine and cystine derivative, glycine, thiourea and thiobiuret, siloxane, aluminum chloride, aluminum fluoride, imidazole, triazole, boric acid, and combinations thereof. 11 . The composition of claim 1 , wherein the pH of the composition is <3; the composition offers a removal selectivity of TiN or TiNxOy vs. the second material >5:1. 12 . A system for selectively removing titanium nitride (TiN or TiNxOy, where x=0 to 1.3 and y=0 to 2) from a surface of a microelectronic device, comprising: the semiconductor device comprising TiN or TiNxOy and a second material, a composition for selectively removing the TiN or TiNxOy from the semiconductor device comprising: 0.5 to10 wt % of amine salt buffer selected from the group consisting of: ammonium chloride; ammonium bisulfate; ammonium phosphates; ammonium oxalate; ammonium perfluorosulfonates; ammonium tetrafluoroborate; ammonium hexafluorotitanate; ammonium hexafluorosilicate; ammonium salts of organic acid selected from ammonium citrate, ammonium acetate, ammonium lactate; and combinations thereof; wherein the ammonium having a form of N(R 1 R 2 R 3 R 4 ) + ; and R 1 ,R 2 , R 3 ,R 4 is independently selected from the group consisting of H, CH 3 , C 2 H 5 , and C 3 H 7 ; 0.2 to 3 wt % non-ambient oxidizer selected from the group consisting of salts of persulfates, salts of iodate, salts of periodate, Cl(I,III or V) compounds, Br(I, III or V) compounds, and combinations thereof; and liquid carrier; wherein the composition comprises no hydrogen peroxide; the composition has a pH<4; the second material is selected from the group consisting of Cu, W, aluminum nitride (AlNx with x=0.5 to 1), aluminum oxide(AlOx with x=1 to 1.5), low-k dielectric material, and combinations thereof; and the composition offers a removal selectivity of TiN or TiNxOy vs. the second material >1:1. 13 . The system of claim 12 , wherein the liquid carrier in the composition is water; and the composition further comprises <4000ppm of an acidic fluoride selected from the group consisting of ammonium bifluoride, alkylammonium bifluoride, aqueous hydrogen fluoride, fluorosilicic acid, fluoroboric acid, acid of hydrated fluoroaluminate, and combinations thereof. 14 . The system of claim 14 , wherein the amine salt buffer is selected from the group consisting of ammonium chloride, ammonium bisulfate and combinations thereof; the non-ambient oxidizer is selected from the group consisting of ammonium persulfate, sodium persulfate, and combinations thereof; and the acidic fluor

Assignees

Inventors

Classifications

  • using masks for insulating materials · CPC title

  • H10P50/667Primary

    by liquid etching only · CPC title

  • H10W20/081Primary

    by forming openings in the dielectric parts · CPC title

  • by chemical means · CPC title

  • Electricity · mapped topic

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What does patent US2016293479A1 cover?
Formulations for stripping titanium nitride hard mask and removing titanium nitride etch residue comprise an amine salt buffer, a non-ambient oxidizer, and the remaining being liquid carrier includes water and non-water liquid carrier selected from the group consisting of dimethyl sulfone, lactic acid, glycol, and a polar aprotic solvent including but not limited to sulfolanes, sulfoxides, nitr…
Who is the assignee on this patent?
Air Prod & Chem
What technology area does this patent fall under?
Primary CPC classification H10P50/667. Mapped technology areas include Electricity.
When was this patent published?
Publication date Thu Oct 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).