Device And Method For Substrate Heating During Transport

Patent metadata

Field	Value
Publication number	US-2016293458-A1
Application number	US-201514679526-A
Country	US
Kind code	A1
Filing date	Apr 6, 2015
Priority date	Apr 6, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

A system for heating substrates while being transported between processing chambers is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed in the transfer chamber. The LEDs may be GaN LEDs, which emit light at a wavelength which is readily absorbed by silicon, thus efficiently and quickly heating the substrate. A controller is in communication with the LEDs. The LEDs may be independently controllable, so that the LEDs that are disposed above the substrate as it is moved from one processing chamber to another are illuminated. In other words, the illumination of the LEDs and the movements of the substrate handling robot may be synchronized by the controller.

First claim

What is claimed is:

1 . A substrate handling and heating system, comprising:
a chamber housing, defining a chamber; a substrate handling robot disposed in the chamber; and a LED array, comprising a plurality of LEDs, disposed within the chamber, wherein the LED array is disposed between a top surface of the chamber housing and the substrate handling robot; wherein illumination of the LEDs in the LED array is dependent upon a path of a substrate traveling through the chamber.

2 . The substrate handling and heating system of claim 1 , wherein the chamber is a transfer chamber.

3 . The substrate handling and heating system of claim 2 , further comprising a plurality of processing chambers in communication with the transfer chamber, wherein the path of the substrate is from one of the plurality of processing chambers to another of the plurality of processing chambers.

4 . The substrate handling and heating system of claim 3 , wherein at least one of the plurality of processing chambers comprises a load lock.

5 . The substrate handling and heating system of claim 1 , wherein only a portion of the LEDs in the LED array is illuminated at a particular time.

6 . The substrate handling and heating system of claim 1 , wherein the LEDs in the LED array disposed above the substrate are illuminated as the substrate travels through the chamber.

7 . The substrate handling and heating system of claim 1 , wherein the LEDs emit light at a wavelength absorbed by the substrate.

8 . The substrate handling and heating system of claim 7 , wherein the wavelength is between 0.4 and 1.0 μm.

9 . A substrate handling and heating system, comprising:
a transfer chamber housing, defining a transfer chamber; a substrate handling robot disposed in the transfer chamber; a LED array, comprising a plurality of LEDs, disposed in the transfer chamber, wherein the LED array is disposed between a top surface of the transfer chamber housing and the substrate handling robot; and a controller in communication with the substrate handling robot and the LED array, such that the controller controls movement of the substrate handling robot and controls illumination of the LEDs in the LED array based on a path of a substrate traveling through the transfer chamber via the substrate handling robot.

10 . The substrate handling and heating system of claim 9 , wherein the LED array comprises a plurality of zones, wherein each zone can be independently controlled by the controller.

11 . The substrate handling and heating system of claim 10 , wherein the controller illuminates zones disposed above the substrate and turns off zones not disposed above the substrate as the substrate moves along the path.

12 . The substrate handling and heating system of claim 10 , wherein each zone comprises one LED.

13 . The substrate handling and heating system of claim 10 , wherein each zone comprises a plurality of LEDs.

14 . The substrate handling and heating system of claim 9 , wherein the LEDs emit light at a wavelength between 0.4 and 1.0 μm.

15 . A substrate handling and heating system, comprising:
a transfer chamber housing, defining a transfer chamber; a substrate handling robot disposed in the transfer chamber; a LED array, comprising a plurality of LEDs, disposed in the transfer chamber, wherein the LED array is disposed between a top surface of the transfer chamber housing and the substrate handling robot; a substrate handling controller in communication with the substrate handling robot, such that the substrate handling controller controls movement of the substrate handling robot; and a LED array controller in communication with the LED array, such that the LED array controller controls illumination of the LEDs in the LED array based on a path of a substrate traveling through the transfer chamber via the substrate handling robot.

16 . The substrate handling and heating system of claim 15 , wherein the substrate handling robot comprises one or more encoders to provide information about a position of an arm of the substrate handling robot, and the LED array controller receives the information from the one or more encoders.

17 . The substrate handling and heating system of claim 15 , wherein the substrate handling controller provides information to the LED array controller about a position of an arm of the substrate handling robot.

18 . The substrate handling and heating system of claim 15 , wherein the substrate handling controller provides information to the LED array controller about movement of an arm of the substrate handling robot.

19 . The substrate handling and heating system of claim 15 , wherein the LED array controller illuminates zones disposed above the substrate and turns off zones not disposed above the substrate as the substrate moves along the path.

20 . The substrate handling and heating system of claim 15 , wherein the LEDs emit light at a wavelength between 0.4 and 1.0 μm.

Assignees

• Varian Semiconductor Equipment Ass Inc

Inventors

• Schaller Jason M
• Evans Morgan D
• Moradian Ala
• Vopat Robert Brent
• Blahnik David
• Weaver William T

Classifications

• H10P72/0464

  characterised by the construction of the transfer chamber · CPC title

• H10P72/0452

  characterised by the layout of the process chambers · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• F27D2003/0051

  comprising means to pick up the charge and put it down · CPC title

• F27B5/14

  Arrangements of heating devices · CPC title