Wet processing apparatus

Patent metadata

Field	Value
Publication number	US-2016293401-A1
Application number	US-201415037886-A
Country	US
Kind code	A1
Filing date	Dec 1, 2014
Priority date	Dec 2, 2013
Publication date	Oct 6, 2016
Grant date	—

Abstract

A wafer cleaner and a method therefor that efficiently cleans a wafer with a little amount of a cleaning liquid and efficiently performs a heating wet cleaning processing. The present invention includes a stage where a wafer is placed, a rotary driving unit that rotates the stage in a circumferential direction, a liquid discharge nozzle disposed facing the wafer placed on the stage and supplies a cleaning liquid on the wafer placed on the stage, and a control unit that causes the liquid discharge nozzle to supply a space between the wafer placed on the stage and the liquid discharge nozzle with a predetermined amount of the cleaning liquid to fill the space. The present invention also includes a lamp disposed on a position facing the wafer placed on the stage to heat at least an interface portion of the wafer and a cleaning liquid.

First claim

1 . A wet processing apparatus that cleans an object to be cleaned with a cleaning agent while rotating the object to be cleaned, the wet processing apparatus comprising:
a stage for placing the object to be cleaned; a rotary driving unit that rotates the stage in a circumferential direction; a supply nozzle disposed facing the object to be cleaned placed on the stage, the supply nozzle supplying the cleaning agent onto the object to be cleaned placed on the stage; and a control unit that causes the supply nozzle to supply a space with a predetermined amount of the cleaning agent, the space being over approximately entire the object to be cleaned placed on the stage, the space being between the supply nozzle and the object to be cleaned, the predetermined amount of the cleaning agent filling the space.

2 . The wet processing apparatus according to claim 1 , wherein
the control unit rotates the stage in a state where the cleaning agent fills the space between the object to be cleaned placed on the stage and the supply nozzle.

3 . The wet processing apparatus according to claim 2 , wherein
the control unit causes the rotary driving unit to rotate the stage with a speed where the cleaning agent filling between the object to be cleaned and the supply nozzle is held on the space between the object to be cleaned and the supply nozzle.

4 . The wet processing apparatus according to claim 1 , wherein
the supply nozzle has an adjustable distance from the object to be cleaned placed on the stage, the control unit adjusts the supply nozzle such that the space between the supply nozzle and the object to be cleaned on the stage has a predetermined distance where the cleaning agent fills the space.

5 . The wet processing apparatus according to claim 1 , wherein
the object to be cleaned is a wafer that has a plate shape in a predetermined size, the cleaning agent is a cleaning liquid, and the control unit causes the supply nozzle to supply a predetermined amount of the cleaning liquid held by a surface tension on a space between the wafer and the supply nozzle.

6 . A wet processing method, comprising:
a placing step of placing an object to be cleaned on a stage; a supplying step of supplying a predetermined amount of a cleaning agent to a space over approximately entire the object to be cleaned placed on the stage, the space being between a supply nozzle and the object to be cleaned, the supply nozzle being disposed facing the object to be cleaned, the cleaning agent filling the space, and a cleaning step of cleaning the object to be cleaned with the cleaning agent while rotating the stage.

7 . The wet processing method according to claim 6 , wherein
the cleaning step rotates the stage with a speed where the cleaning agent is held on the space between the object to be cleaned and the supply nozzle.

8 . The wet processing method according to claim 6 , wherein
the cleaning step rotates the stage with a speed where the cleaning agent does not spill down from the space between the object to be cleaned and the supply nozzle.

9 . The wet processing method according to claim 6 , wherein
after the supplying step relatively moves the supply nozzle and the stage to adjust the distance between the supply nozzle and the object to be cleaned placed on the stage to a predetermined distance such that the cleaning agent fills the space between the supply nozzle and the object to be cleaned, the supplying step supplies the cleaning agent to the space.

10 . The wet processing method according to claim 6 , wherein
the object to be cleaned is a wafer that has a plate shape in a predetermined size, the cleaning agent is a cleaning liquid, and the supplying step supplies a predetermined amount of the cleaning liquid held by a surface tension on a space between the wafer and the supply nozzle.

11 . A wet processing apparatus that supplies a processing liquid to process an object to be processed while heating the object to be processed, the wet processing apparatus comprising:
a stage for placing the object to be processed; a supply portion that supplies the processing liquid to the object to be processed placed on the stage; a heating portion disposed on a position facing the object to be processed placed on the stage to heat at least an interface portion of the object to be processed and the processing liquid.

12 . The wet processing apparatus according to claim 11 , wherein
the heating portion is disposed on an opposite side of the object to be processed placed on the stage across the stage to heat the interface portion of the object to be processed and the processing liquid via the object to be processed.

13 . The wet processing apparatus according to claim 11 , wherein
the heating portion includes a light-emitting portion and a condensing portion that collects a light emitted by the light-emitting portion to guide to the interface portion of the object to be processed and the processing liquid.

14 . The wet processing apparatus according to claim 13 , wherein
the condensing portion includes a reflector that collects the light emitted by the light-emitting portion, and a lens portion that guides the light collected by the reflector to the interface portion of the object to be processed and the processing liquid.

15 . The wet processing apparatus according to claim 14 , wherein
the stage is constituted of a plurality of pin materials that hold a peripheral edge of the object to be processed, and integrally disposed with the lens portion while the lens portion is disposed among the plurality of the pin materials.

16 . The wet processing apparatus according to claim 11 , wherein
the object to be processed is a wafer that has a plate shape in a predetermined size, and the processing liquid is a cleaning liquid to clean the wafer.

17 . A wet processing method, comprising:
a placing step of placing an object to be processed on a stage; a supplying step of supplying a processing liquid to the object to be processed placed on the stage; and a processing step of heating at least an interface portion of the object to be processed and the processing liquid from a position facing the object to be processed in a state where the supplying step is supplying the processing liquid.

18 . The wet processing method according to claim 17 , wherein
the processing step heats the interface portion of the object to be processed and the processing liquid from an opposite side of the object to be processed across the stage via the object to be processed.

Assignees

• Nat Inst Advanced Ind Science & Tech

Inventors

• Hara Shiro
• Khumpuang Sommawan
• Ikeda Shinichi
• Goto Akihiro
• Amano Hiroshi

Classifications

• H10P70/15 Primary

  by wet cleaning only (H10P70/52 takes precedence) · CPC title

• H10P72/7618

  characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating carrousel · CPC title

• H10P72/0436

  mainly by radiation · CPC title

• H10P72/0424

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0414 Primary

  using mainly spraying means, e.g. nozzles · CPC title