Coil component

Patent metadata

Field	Value
Publication number	US-2016293318-A1
Application number	US-201614989104-A
Country	US
Kind code	A1
Filing date	Jan 6, 2016
Priority date	Apr 1, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

A coil component includes a core member and coil conductors. The core member has an insulation layer in which a cavity having a stepped profile is provided in a central portion thereof, and a composite magnetic layer filling the cavity. The coil conductors are provided in the insulation layer. The stepped profile of the cavity increases a filling area or volume of the composite magnetic layer, such that common mode impedance may be improved by an increase in inductance under the same magnetic permeability condition.

First claim

What is claimed is:

1 . A coil component comprising:
a core member including an insulation layer in which a cavity having a stepped profile is provided in a central portion thereof, and a composite magnetic layer filling the cavity; and coil conductors provided in the insulation layer.

2 . The coil component of claim 1 , wherein the insulation layer is formed of a negative photoresist.

3 . The coil component of claim 1 , wherein the insulation layer is formed of a material cured by exposure to light.

4 . The coil component of claim 1 , wherein a width of the cavity is increased in a stepwise manner from a lower portion thereof toward an upper portion thereof.

5 . The coil component of claim 1 , wherein the insulation layer includes a stack of a plurality of insulation sublayers, the cavity is delimited by a plurality of side wall portions of the plurality of sublayers and step portions disposed between the side wall portions of sublayers adjacent to each other, and
the side wall portion of each sublayer slopes at an angle of 90° or less with respect to a lower surface of the sublayer.

6 . The coil component of claim 1 , wherein the coil conductors include a primary coil and a secondary coil electromagnetically coupled to each other.

7 . The coil component of claim 6 , wherein the primary coil and the secondary coil are disposed on different planes.

8 . The coil component of claim 6 , wherein the insulation layer includes a stack of a plurality of insulation sublayers, and the primary coil and the secondary coil are disposed in different respective sublayers of the plurality of sublayers.

9 . The coil component of claim 6 , wherein the primary coil and the secondary coil are disposed on the same plane.

10 . The coil component of claim 6 , wherein the insulation layer includes a stack of a plurality of insulation sublayers, and the primary coil and the secondary coil are disposed in a same sublayer of the plurality of sublayers.

11 . The coil component of claim 1 , wherein the coil conductor is formed of a plating pattern.

12 . The coil component of claim 1 , wherein:
the coil conductors include a plurality of primary coils and a plurality of secondary coils electromagnetically coupled to each other, and the coil component further comprises a first via connecting the primary coils to each other and a second via connecting the secondary coils to each other in the insulation layer.

13 . The coil component of claim 1 , further comprising a cover member formed on opposing surfaces of the core member.

14 . The coil component of claim 1 , further comprising four external terminals formed on side surfaces of the core member and electrically connected to respective ends of the coil conductors.

15 . A coil component comprising:
a core member comprising a stack of insulating sublayers each having coil conductors disposed therein; and upper and lower cover members respectively disposed above and below the core member in a stacking direction of the insulating sublayers, wherein each insulating sublayer has a hole disposed in a center of the coil conductor, and wherein areas of the holes disposed in respective insulating sublayers increase in the stacking direction of the insulating sublayers from the lower cover member to the upper cover member.

16 . The coil component of claim 15 , wherein the hole of each respective insulating sublayer is delimited by a wall portion, and the wall portion is non-orthogonal to upper or lower surfaces of the respective insulating sublayer.

17 . The coil component of claim 15 , further comprising:
a composite magnetic layer filling the holes disposed in each insulating sublayer of the stack of insulating sublayers, wherein the composite magnetic layer and the upper and lower cover members each include a magnetic powder mixed with a polymer resin.

18 . The coil component of claim 15 , wherein each respective insulating sublayer of the stack of insulating sublayers comprises a plurality of coil conductors contacting a lower surface of the respective insulating sublayer, and insulation provided between the coil conductors of the respective insulating sublayer and between the coil conductors and an upper surface of the respective insulating sublayer.

19 . The coil component of claim 15 , wherein:
each respective insulating sublayer of the stack of insulating sublayers comprises a plurality of coil conductors, the coil conductors of different insulating sublayers of the coil component are electrically connected to form a primary coil and a secondary coil, and the coil conductors of each respective insulating sublayer are electrically connected to form a same one of the primary coil and the secondary coil.

20 . The coil component of claim 15 , wherein:
each respective insulating sublayer of the stack of insulating sublayers comprises first and second coil conductors, the coil conductors of different insulating sublayers of the coil component are electrically connected to form a primary coil and a secondary coil, and the first coil conductors of the insulating sublayers are electrically connected to form the primary coil, and the second coil conductors of the insulating sublayers are electrically connected to form the secondary coil.

Assignees

• Samsung Electro Mech

Inventors

• Yang Ju Hwan
• Lim Jong Bong

Classifications

• H01F27/2804 Primary

  Printed windings · CPC title

• H01F27/292

  Surface mounted devices · CPC title

• H01F2027/2809

  on stacked layers · CPC title

• H01F27/24 Primary

  Magnetic cores · CPC title

• H01F2017/0093

  Common mode choke coil · CPC title