Compositions for preparing electrically conductive composites, composites prepared therefrom, and electronic devices including the same

Patent metadata

Field	Value
Publication number	US-2016293290-A1
Application number	US-201615047790-A
Country	US
Kind code	A1
Filing date	Feb 19, 2016
Priority date	Mar 30, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

A composition for preparing an electrically conductive composite includes, based on the total weight of the composition:
about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler. Also composites prepared therefrom and an electronic device including the same.

First claim

What is claimed is:

1 . A composition for an electrically conductive composite, comprising, based on a total weight of the composition:
about 37 weight percent to about 84 weight percent of an epoxy; about 0.001 weight percent to about 22 weight percent of an electrically conductive filler; and about 15 weight percent to about 45 weight percent of a thermoplastic resin, wherein the thermoplastic resin is a liquid at about 25° C., is miscible with the epoxy, and forms a domain upon heat curing that is phase-separated from the epoxy and the electrically conductive inorganic filler.

2 . The composition of claim 1 , wherein the epoxy comprises an epoxy resin having two or more epoxy groups per molecule, and
wherein the epoxy resin is one or more selected from a glycidylether of bisphenol A, bisphenol F, dihydroxyphenyl diphenylsulfone, dihydroxybenzophenone, dihydroxydiphenyl, a novolac epoxy resin, and a glycidyl functional group reactive product of one or more selected from m-aminophenol, p-aminophenol, m-phenylene diamine, p-phenylene diamine, 2,4-toluylene diamine, 2,6-toluylene diamine, 3,4-toluylene diamine, 3,3′-diaminodiphenyl methane, and 4,4′-diaminodiphenyl methane.

3 . The composition of claim 2 , wherein the epoxy resin comprises one or more selected from a diglycidyl ether of bisphenol A; a diglycidyl ether of bisphenol F; O,N, N-triglycidyl-para-aminophenol; O,N, N-triglycidyl-meta-aminophenol, and N,N,N′,N′-tetraglycidyl diaminodiphenyl methane.

4 . The composition of claim 1 , wherein the electrically conductive filler comprises one or more selected from carbon nanotubes, boron nitride nanotubes, carbon black, graphene, graphite, a conductive metal filament, a conductive metal nanowire, and a conductive metal oxide particulate.

5 . The composition of claim 1 , wherein the electrically conductive filler does not comprise a functional group which is capable of a condensation reaction with the thermoplastic resin on a surface of the electrically conductive filler.

6 . The composition of claim 1 , wherein the thermoplastic resin comprises a diene copolymer comprising a carboxyl group at a terminal end thereof and comprises a nitrile group on the main chain.

7 . The composition of claim 1 , wherein the electrically conductive filler is carbon nanotubes having a carboxyl group on the surface thereof, and wherein the thermoplastic resin is a butadiene-acrylonitrile copolymer having a carboxyl group at the terminal end thereof.

8 . The composition of claim 1 , wherein the heating is performed at a temperature of greater than or equal to about 50° C. and less than or equal to about 150° C.

9 . The composition of claim 1 , wherein the composition comprises about 20 weight percent to about 40 weight percent of the thermoplastic resin and about 0.004 weight percent to about 1 weight percent of the electrically conductive filler, based on the total weight of the composition.

10 . The composition of claim 1 , wherein the domain has a largest diameter of less than or equal to about 50 micrometers.

11 . A conductive polymer composite comprising a cured product of the composition of claim 1 .

12 . The electrically conductive composite of claim 11 , wherein the electrically conductive composite comprises a first domain consisting of the thermoplastic resin and a second domain comprising the epoxy and the electrically conductive filler.

13 . The electrically conductive composite of claim 11 , wherein the electrically conductive composite has an electrical conductivity of less than or equal to about 0.01 Siemens per meter.

14 . An electronic device comprising the composite of claim 11 .

Assignees

• Samsung Electronics Co Ltd

Inventors

• Mizusaki Soichiro
• Lee Sang Eui
• Chang Won Suk
• Han In Taek

Classifications

• B82Y30/00

  Nanotechnology for materials or surface science, e.g. nanocomposites · CPC title

• Y10S977/752

  Multi-walled · CPC title

• Y10S977/932

  for electronic or optoelectronic application · CPC title

• H01B1/24 Primary

  the conductive material comprising carbon-silicon compounds, carbon or silicon · CPC title