Infrared sensor and infrared sensor array

Patent metadata

Field	Value
Publication number	US-2016290870-A1
Application number	US-201514840320-A
Country	US
Kind code	A1
Filing date	Aug 31, 2015
Priority date	Mar 31, 2015
Publication date	Oct 6, 2016
Grant date	—

Abstract

An infrared sensor for detecting infrared light rays of a specific wavelength is disclosed. The infrared sensor includes a package and an infrared detecting element formed on the package. The infrared detecting element includes a thermal detector and an absorber formed on the thermal detector to absorb infrared light rays of a specific wavelength. The infrared light rays of the specific wavelength are detected by the conversion of the infrared light rays into heat. A cap formed on the package is provided to cover the infrared detecting element. The cap includes a body having a front and rear surfaces, through which the infrared light rays transmit and a shielding film formed on at least one of the front and rear surfaces of the body to define a window. The infrared light rays are reflected on the shielding film except for the window. Every one of the infrared light rays passing through the window of the cap impinge on the absorber.

First claim

What is claimed is:

1 . An infrared sensor for detecting infrared light rays of a specific wavelength, the infrared sensor comprising:
a) a package; b) an infrared detecting element formed on the package, the infrared detecting element comprising:
a thermal detector; and
an absorber formed on the thermal detector which is configured to absorb infrared light rays of a specific wavelength, wherein the infrared light rays of the specific wavelength are detected by the conversion of the infrared light rays into heat; and
c) a cap formed on the package to cover the infrared detecting element, the cap comprising:
a body having a front and rear surfaces, through which the infrared light rays transmit; and
a shielding film, with a window formed therein, provided on at least one of the front and rear surfaces of the body, wherein the infrared light rays are reflected on the shielding film other than the portion of the window, wherein
every one of the infrared light rays passing through the window of the cap impinges on the absorber.

2 . An infrared sensor for detecting infrared light rays of a specific wavelength, the infrared sensor comprising:
a) a package; b) an infrared detecting element formed on the package, the infrared detecting element comprising:
a thermal detector; and
an absorber formed on the thermal detector which is configured to absorb infrared light rays of a specific wavelength, wherein the infrared light rays of the specific wavelength are detected by the conversion of the infrared light rays into heat;
c) a shielding structure, with a window formed therein, covering the infrared detecting element, wherein the infrared light rays pass through the window; and d) a cap formed on the package to cover the shielding structure, wherein every one of the infrared light rays passing through the window of the shielding structure impinges on the absorber.

3 . An infrared sensor according to claim 1 , wherein the absorber has a periodical structure thereon for generating plasmon resonance of infrared light rays of the specific wavelength so that the infrared light rays of the specific wavelength is selectively absorbed by the absorber.

4 . An infrared sensor according to claim 1 , wherein the absorber is a metal film having concave portions or convex portions aligned periodically.

5 . An infrared sensor according to claim 1 , wherein the absorber has a MIM structure including a metal film, a dielectric film thereon and periodical metal patterns thereon.

6 . An infrared sensor according to claim 1 , wherein the cap is formed with a recess to present a portion thinner than the other portions, and the infrared light rays passing through the recess impinges on the absorber.

7 . An infrared sensor array in which the infrared sensors according to claim 1 are arranged in a matrix format.

8 . An infrared sensor according to claim 2 , wherein the shielding structure is formed on the bottom portion of the package or on the infrared detecting element.

9 . An infrared sensor according to claim 2 , wherein the absorber has a periodical structure thereon for generating plasmon resonance of infrared light rays of the specific wavelength so that the infrared light rays of the specific wavelength is selectively absorbed by the absorber.

10 . An infrared sensor according to claim 2 , wherein the absorber is a metal film having concave portions or convex portions aligned periodically.

11 . An infrared sensor according to claim 2 , wherein the absorber has a MIM structure including a metal film, a dielectric film thereon and periodical metal patterns thereon.

12 . An infrared sensor according to claim 2 , wherein the cap is formed with a recess to present a portion thinner than the other portions, and the infrared light rays passing through the recess impinges on the absorber.

13 . An infrared sensor array in which the infrared sensors according to claim 2 are arranged in a matrix format.

Assignees

• Mitsubishi Electric Corp

Inventors

• Sugino Takaki

Classifications

• G01J5/045

  Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements (getter arrangements per se H10W76/48, H10P36/03) · CPC title

• G01J5/06

  Arrangements for eliminating effects of disturbing radiation; Arrangements for compensating changes in sensitivity (for adjusting of solid angle of collected radiation G01J5/07; means for wavelength selection G01J5/0801) · CPC title

• G01J5/0875

  Windows; Arrangements for fastening thereof · CPC title

• G01J5/0831

  Masks; Aperture plates; Spatial light modulators · CPC title

• G01J5/20

  using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices · CPC title