Wire-harness-less insert assembly mechanism

Patent metadata

Field	Value
Publication number	US-2016290064-A1
Application number	US-201315037599-A
Country	US
Kind code	A1
Filing date	Dec 18, 2013
Priority date	Dec 18, 2013
Publication date	Oct 6, 2016
Grant date	—

Abstract

A method and apparatus for electronically coupling electronics in downhole tools without a harness is described. The apparatus includes one or more electronics boards, which may be disposed around a tool insert and electronically coupled using a backplane. The backplane may comprise one or more backplane segments, and each of the segments may comprise two printed circuit boards communicatively coupled to each other. The two printed circuit boards may be on opposite sides of a base metal ring and may be coupled to each other via connectors in a cavity of the base metal ring. Dampers may be placed between the base metal ring and each of the printed circuit boards. The printed circuit boards my optionally include an identification chip for storing information concerning the electronics boards coupled to the backplane. Additionally or alternatively, the printed circuit boards may optionally include active device chips that dynamically route signals based on which electronics boards are coupled to the backplane.

First claim

What is claimed is:

1 . A downhole tool assembly, comprising:
a first electronics module and a second electronics module, wherein said first electronics module is communicatively coupled to said second electronics module via a backplane.

2 . The downhole tool assembly of claim 1 , wherein said backplane comprises a first printed circuit board and a second printed circuit board communicatively coupled to each other.

3 . The downhole tool assembly of claim 2 , further comprising a base metal ring disposed between said first printed circuited board and said second printed circuit board.

4 . The downhole tool assembly of claim 3 , wherein said first printed circuit board is communicatively coupled to said second printed circuit board via connector holes in said base metal ring.

5 . The downhole tool assembly of claim 4 , further comprising a damper between said base metal ring and one of said first printed circuit board and said second printed circuit board.

6 . The downhole tool assembly of claim 1 , wherein said backplane is comprised of a plurality of backplane segments.

7 . The downhole tool assembly of claim 6 , wherein at least one of said backplane segments includes an identification chip.

8 . The downhole tool assembly of claim 6 , wherein at least one of said backplane segments includes an active device chip.

9 . The downhole tool assembly of claim 1 , wherein said backplane is disposed proximate to a tool insert having one of the following cross sections: three faces, four faces, six faces, and circular.

10 . A downhole tool assembly, comprising:
a tool insert; a backplane coupled to said tool insert comprising a first printed circuit board and a second printed circuit board, wherein
said first printed circuit board comprises a first printed circuit board segment and a second printed circuit board segment, wherein said first printed circuit board segment is communicatively coupled to said second printed circuit board segment via a first same-side connector;
said second printed circuit board comprises a third printed circuit board segment and a fourth printed circuit board segment, wherein said third printed circuit board segment is communicatively coupled to said fourth printed circuit board segment via a second same-side connector;

a base metal ring disposed between said first printed circuit board and said second printed circuit board, wherein said first printed circuit board is communicatively coupled to said second printed circuit board through a connector hole in said base metal ring using an opposite-side connector; a first damper disposed between said first printed circuit board and said base metal ring; a second damper disposed between said base metal ring and said second printed circuit board; and a first electronics module communicatively coupled to a second electronics module via said backplane.

11 . A method for wire-harness-less assembly, comprising:
coupling a backplane to a tool insert; providing connectors on said backplane for communicatively coupling said backplane to a first electronics module and a second electronics module.

12 . The method of claim 11 , wherein said backplane comprises a first printed circuit board and a second printed circuit board.

13 . The method of claim 12 , wherein said first printed circuit board is communicatively coupled to said second printed circuit board through connector holes in a base metal ring.

14 . The method of claim 12 , wherein said first printed circuit board and said second printed circuit board comprise a plurality of backplane segments.

15 . The method of claim 11 , further comprising providing an identification chip on said backplane.

16 . The method of claim 11 , further comprising providing an active device chip on said backplane.

17 . A method for wire-harness-less assembly, comprising:
mounting a first electronics module and a second electronics module on a tool insert; communicatively coupling said first electronics module and said second electronics module to a backplane.

18 . The method of claim 17 , further comprising
mounting a third electronics module on said tool insert; communicatively coupling said third electronics module to said backplane; and dynamically routing communicative signals to said third electronics module from at least one of said first electronics module and said second electronics module.

19 . The method of claim 18 , wherein dynamically routing communicative signals further comprises using information stored on an active device chip located on said backplane.

20 . The method of claim 17 , further comprising accessing information stored on an identification chip, wherein said identification chip is located on said backplane.

Assignees

• Halliburton Energy Services Inc

Inventors

• Navarro Rex Dael
• Perez Philbert Pasco
• Ong Shijie
• Wong Williem

Classifications

• E21B47/125 Primary

  using earth as an electrical conductor (by electromagnetic energy E21B47/13) · CPC title

• H01R12/722

  coupling devices mounted on the edge of the printed circuits · CPC title

• E21B23/00

  Apparatus for displacing, setting, locking, releasing or removing tools, packers or the like in boreholes or wells (setting of casings, screens or liners E21B43/10) · CPC title

• E21B47/024

  of devices in the borehole (determining slope or direction of the borehole E21B47/022) · CPC title

• E21B17/003

  with electrically conducting or insulating means (E21B17/028 and E21B17/023 take precedence) · CPC title