Polishing composition

Patent metadata

Field	Value
Publication number	US-2016288289-A1
Application number	US-201415022376-A
Country	US
Kind code	A1
Filing date	Aug 11, 2014
Priority date	Sep 20, 2013
Publication date	Oct 6, 2016
Grant date	—

Abstract

The present invention is the invention of a polishing composition comprising a silica in which a functional group satisfying at least one of condition (1) and condition (2) described below is fixed on the surface, and a pH-adjusting agent; condition (1): the functional group has an amino group; and condition (2): the functional group has a halogeno group, and the polishing composition of the invention can sufficiently control a polishing rate of a Si-containing material.

First claim

1 . A polishing composition comprising:
a silica in which a functional group satisfying at least one of condition (1) and condition (2) below is fixed on a surface thereof:
condition (1): the functional group has an amino group; and,
condition (2): the functional group has a halogeno group; and,
a pH-adjusting agent.

2 . The polishing composition according to claim 1 , wherein
when the condition (2) is satisfied, the halogeno group comprises at least one selected from the group consisting of a fluoro group, a chloro group, a bromo group, and an iodo group.

3 . The polishing composition according to claim 1 , wherein the polishing composition is used for polishing a polishing object having a layer comprising a Si-containing material.

4 . The polishing composition according to claim 3 , wherein the Si-containing material comprises at least one selected from the group consisting of monocrystalline silicon, polycrystalline silicon, silicon oxide, and silicon nitride.

5 . The polishing composition according to claim 1 , wherein
when the condition (1) is satisfied, the polishing composition is used for polishing a polishing object having a layer comprising a noble metal.

6 . The polishing composition according to claim 5 , wherein the noble metal comprises at least one selected from the group consisting of gold, silver, platinum, palladium, rhodium, ruthenium, iridium, and osmium.

7 . A polishing method comprising:
a step of polishing a material to be polished having a polishing object by using the polishing composition according to claim 1 .

8 . A method for producing a substrate, the method comprising:
a step of polishing by using the polishing method according to claim 7 .

9 . A method for producing a polishing composition, the method comprising mixing
a silica in which a functional group satisfying at least one of condition (1) and condition (2) below is fixed on a surface thereof:
condition (1): the functional group has an amino group; and,
condition (2): the functional group has a halogeno group,
with a pH-adjusting agent.

Assignees

• Fujimi Inc

Inventors

• Suzuki Shota
• Izawa Yoshihiro

Classifications

• H10P95/062

  involving a dielectric removal step · CPC title

• H10P52/403

  of conductive or resistive materials · CPC title

• B24B37/044 Primary

  characterised by the composition of the lapping agent · CPC title

• C09K3/1436

  Composite particles, e.g. coated particles · CPC title

• C09G1/02 Primary

  containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title