Manufacturing method of flat-plate heat pipe

US2016288276A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016288276-A1
Application numberUS-201514676826-A
CountryUS
Kind codeA1
Filing dateApr 2, 2015
Priority dateApr 2, 2015
Publication dateOct 6, 2016
Grant date

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  1. Title

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  2. Abstract

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  4. Key dates

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  5. First independent claim

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Abstract

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A manufacturing method of flat-plate heat pipe includes steps of: providing a first board body, a second board body and a capillary structure; selectively affixing the capillary structure to the first board body or the second board body; overlapping and mating the first and second board bodies with each other and sealing the open peripheries of the first and second board bodies to form a flat tubular main body with a reserved air-sucking and water-filling section; and vacuuming the flat tubular main body and filling working fluid into the flat tubular main body and sealing the air-sucking and water-filling section. By means of the manufacturing method of the flat-plate heat pipe, the flat-plate heat pipe can be formed with a thin thickness. After the flat-plate heat pipe is thinned, the flat-plate heat pipe still has a complete vapor passage.

First claim

Opening claim text (preview).

What is claimed is: 1 . A manufacturing method of flat-plate heat pipe, comprising steps of: providing a first board body, a second board body and a capillary structure; selectively affixing the capillary structure to the first board body or the second board body; overlapping and mating the first and second board bodies with each other and sealing the open peripheries of the first and second board bodies to form a flat tubular main body with a reserved air-sucking and water-filling section; and vacuuming the flat tubular main body and filling working fluid into the flat tubular main body and sealing the air-sucking and water-filling section. 2 . The manufacturing method of flat-plate heat pipe as claimed in claim 1 , wherein the first and second board bodies are made of copper material. 3 . The manufacturing method of flat-plate heat pipe as claimed in claim 1 , further comprising a step of disposing multiple channels on one side of the second board body opposite to the first board body after the step of selectively affixing the capillary structure to the first board body or the second board body. 4 . The manufacturing method of flat-plate heat pipe as claimed in claim 3 , wherein the channels transversely and longitudinally intersect each other, the channels being formed by means of etching, mechanical processing or discharging processing. 5 . The manufacturing method of flat-plate heat pipe as claimed in claim 1 , wherein the capillary structure is selected from a group consisting of sintered powder body, mesh body, fiber body and a combination of sintered powder body, mesh body and fiber body. 6 . The manufacturing method of flat-plate heat pipe as claimed in claim 1 , wherein the open peripheries of the first and second board bodies are sealed by means of diffusion bonding, ultrasonic welding or spot welding. 7 . The manufacturing method of flat-plate heat pipe as claimed in claim 1 , wherein the capillary structure is selectively affixed to the first board body or the second board body by means of diffusion bonding, ultrasonic welding or spot welding. 8 . The manufacturing method of flat-plate heat pipe as claimed in claim 1 , wherein the flat tubular main body has a pair of capillary structures, the capillary structures being disposed between the first and second board bodies, the capillary structures and the first and second board bodies together defining at least one vapor passage.

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What does patent US2016288276A1 cover?
A manufacturing method of flat-plate heat pipe includes steps of: providing a first board body, a second board body and a capillary structure; selectively affixing the capillary structure to the first board body or the second board body; overlapping and mating the first and second board bodies with each other and sealing the open peripheries of the first and second board bodies to form a flat t…
Who is the assignee on this patent?
Asia Vital Components Co Ltd
What technology area does this patent fall under?
Primary CPC classification B23P15/26. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Thu Oct 06 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).