Feedthrough device especially for a medical implant system and production method

Patent metadata

Field	Value
Publication number	US-2016287882-A1
Application number	US-201415036392-A
Country	US
Kind code	A1
Filing date	Nov 12, 2014
Priority date	Nov 14, 2013
Publication date	Oct 6, 2016
Grant date	—

Abstract

The invention relates to a feedthrough device especially for a medical implant system, comprising: a flexible substrate locally comprising at least one means for stiffening the substrate, said at least one stiffening means having a through-opening; and at least one hermetic feedthrough comprising an electrical connection element, said feedthrough being hermetically joined to a stiffening means, such that said electrical connection element passes through the through-opening.

First claim

1 . A feedthrough device especially for a medical implant system comprising:
a generally flexible substrate locally comprising at least one means for stiffening the substrate, said at least one stiffening means having a through-opening; and at least one hermetic feedthrough comprising an electrical connection element, said feedthrough being hermetically assembled to a stiffening means such that said elctrical connection element passes through the through-opening.

2 . The feedthrough device according to claim 1 , wherein said substrate includes a metal sheet.

3 . The feedthrough device according to claim 1 , wherein said at least one stiffening means includes a protruding portion with respect to the surface of the substrate.

4 . The feedthrough device according to claim 3 , wherein the protruding portion is a bulge or an over-thickness.

5 . The feedthrough device according to claim 1 , comprising at least one brazing joint between a feedthrough and a stiffening means.

6 . The feedthrough device according to claim 5 , wherein said at least one brazing joint has a three-dimensional structure.

7 . The feedthrough device according to claim 5 , wherein the feedthrough has a shape of a T, a second brazing joint being present between an outgrowth and the substrate.

8 . A method for manufacturing a feedthrough device according to claim 1 , comprising:
(a) producing a generally flexible substrate with at least one stiffening means and at least one through-opening in said at least one stiffening means, (b) providing at least one hermetic feedthrough including an electric connection element, and (c) hermetically assembling a feedthrough to said at least one stiffening means, so that the electrical connection element of said feedthrough partly passes into said through-opening.

9 . The method according to claim 8 , wherein the step (a) includes producing at least one protruding portion with respect to the substrate.

10 . The method according to claim 9 , wherein the step (a) includes a local deformation of the substrate in order to form at least one bulge.

11 . The method according to claim 9 , wherein the step (a) includes providing material for locally forming at least one over-thickness.

12 . The method according to claim 9 , wherein the step (a) includes removing material in at least two areas of a substrate in order to form at least one over-thickness between these areas.

13 . The method according to claim 8 , wherein step (c) is achieved by at least one brazing joint.

14 . The method according to claim 8 , comprising, after step (c), depositing a polymeric material, in said at least one through-opening.

15 . The method according to claim 13 , comprising, between step (b) and step (c), positioning of a ceramic ring against said at least one stiffening means and on the substrate holder side.

16 . A hermetic casing including a feedthrough device according to claim 1 and a lid hermetically sealed to the feedthrough device, for encapsulating a medical device.

Assignees

• Commissariat Energie Atomique

Inventors

• Karst Nicolas
• Emieux Fabrice
• Perraud Simon

Classifications

• H10W76/157

  having interconnections parallel to the insulating or insulated base · CPC title

• A61N1/3754 Primary

  Feedthroughs · CPC title

• H02G15/013

  Sealing means for cable inlets (inlets for cables filled with, or surrounded by, gas or oil H02G15/32) · CPC title