Oscillator, electronic apparatus, and moving object

Patent metadata

Field	Value
Publication number	US-2016285463-A1
Application number	US-201615075563-A
Country	US
Kind code	A1
Filing date	Mar 21, 2016
Priority date	Mar 27, 2015
Publication date	Sep 29, 2016
Grant date	—

Abstract

An oscillator includes a resonator element; and a semiconductor device including an oscillation circuit which outputs an oscillation signal by oscillating the resonator element, a temperature compensation circuit which compensates for temperature characteristics of a frequency of the oscillation signal, and a first surface in which a terminal that is electrically connected to the resonator element is disposed. The semiconductor device overlaps the resonator element in a planar view. Frequency deviation of the oscillation signal, which is compensated for by the temperature compensation circuit, is greater than or equal to −150 ppb and smaller than or equal to +150 ppb in a temperature range from −5° C. to +85° C.

First claim

What is claimed is:

1 . An oscillator comprising:
a resonator element; and a semiconductor device including an oscillation circuit which outputs an oscillation signal by oscillating the resonator element, a temperature compensation circuit which compensates for temperature characteristics of a frequency of the oscillation signal, and a first surface in which a terminal that is electrically connected to the resonator element is disposed, wherein the semiconductor device overlaps the resonator element in a planar view, and wherein frequency deviation of the oscillation signal which is compensated for by the temperature compensation circuit is greater than or equal to −150 ppb and smaller than or equal to +150 ppb in a temperature range from −5° C. to +85° C.

2 . The oscillator according to claim 1 , wherein the frequency deviation is greater than or equal to −150 ppb and smaller than or equal to +150 ppb in a temperature range from −40° C. to +85° C.

3 . The oscillator according to claim 1 , wherein deviation of a resonance frequency of the resonator element with respect to an approximation equation which is higher than or equal to a third order of frequency temperature characteristics of the resonator element is greater than or equal to −150 ppb and smaller than or equal to +150 ppb.

4 . The oscillator according to claim 1 , further comprising:
a first container which contains the resonator element, wherein the semiconductor device includes a surface, which is bonded to the first container through an adhesive member, on a side opposite to the first surface.

5 . The oscillator according to claim 2 , further comprising:
a first container which contains the resonator element, wherein the semiconductor device includes a surface, which is bonded to the first container through an adhesive member, on a side opposite to the first surface.

6 . The oscillator according to claim 3 , further comprising:
a first container which contains the resonator element, wherein the semiconductor device includes a surface, which is bonded to the first container through an adhesive member, on a side opposite to the first surface.

7 . The oscillator according to claim 4 ,
wherein the first container includes a base, and a first lid of a metal which covers the resonator element, together with the base, and wherein the semiconductor device is bonded to the first lid.

8 . The oscillator according to claim 5 ,
wherein the first container includes a base, and a first lid of a metal which covers the resonator element, together with the base, and wherein the semiconductor device is bonded to the first lid.

9 . The oscillator according to claim 6 ,
wherein the first container includes a base, and a first lid of a metal which covers the resonator element, together with the base, and wherein the semiconductor device is bonded to the first lid.

10 . An oscillator comprising:
a resonator element; a semiconductor device including an oscillation circuit which outputs an oscillation signal by oscillating the resonator element, a temperature compensation circuit which compensates for temperature characteristics of a frequency of the oscillation signal, and a first surface in which a terminal that is electrically connected to the resonator element is disposed; a first container which contains the resonator element and includes a first lid of a metal which overlaps the resonator element in a planar view; and a second container which contains the first container and the semiconductor device, wherein the first container is disposed such that a surface on aside opposite to the first lid side faces an inner surface of the second container, wherein the semiconductor device having a surface on a side opposite to the first surface is bonded to the first lid through an adhesive member so as to overlap the resonator element in a planar view, and wherein frequency deviation of the oscillation signal which is compensated for by the temperature compensation circuit is greater than or equal to −150 ppb and smaller than or equal to +150 ppb in a temperature range from −5° C. to +85° C.

11 . The oscillator according to claim 10 , wherein the frequency deviation is greater than or equal to −150 ppb and smaller than or equal to +150 ppb in a temperature range from −40° C. to +85° C.

12 . The oscillator according to claim 10 , wherein deviation of a resonance frequency of the resonator element with respect to an approximation equation which is higher than or equal to a third order of frequency temperature characteristics of the resonator element is greater than or equal to −150 ppb and smaller than or equal to +150 ppb.

13 . The oscillator according to claim 10 ,
wherein the second container includes a second lid which overlaps the first container and the semiconductor device in a planar view, wherein the inner surface includes a surface on which wires are disposed, and a surface on which the second lid is exposed, and wherein the first container is disposed on a surface on which the wires are disposed.

14 . The oscillator according to claim 11 ,
wherein the second container includes a second lid which overlaps the first container and the semiconductor device in a planar view, wherein the inner surface includes a surface on which wires are disposed, and a surface on which the second lid is exposed, and wherein the first container is disposed on a surface on which the wires are disposed.

15 . An electronic apparatus, comprising:
the oscillator according to claim 1 .

16 . An electronic apparatus, comprising:
the oscillator according to claim 10 .

17 . An electronic apparatus, comprising:
the oscillator according to claim 13 .

18 . A moving object, comprising:
the oscillator according to claim 1 .

19 . A moving object, comprising:
the oscillator according to claim 10 .

20 . A moving object, comprising:
the oscillator according to claim 13 .

Assignees

• Seiko Epson Corp

Inventors

• Owaki Takuya
• Kanno Hideyuki

Classifications

• H03L1/04 Primary

  Constructional details for maintaining temperature constant · CPC title

• H03H9/10

  Mounting in enclosures {(constructional combinations of enclosure with electromechanical and other electronic elements H03H9/0538)} · CPC title

• H03B5/04 Primary

  Modifications of generator to compensate for variations in physical values, e.g. power supply, load, temperature · CPC title

• H03L1/026

  by using a memory for digitally storing correction values (H03L1/025 takes precedence) · CPC title

• H03L1/022

  by indirect stabilisation, i.e. by generating an electrical correction signal which is a function of the temperature (H03L1/021 takes precedence) · CPC title