uLED LIGHT-EMITTING AND DISPLAY DEVICE WITHOUT ELECTRICAL CONTACT, EXTERNAL CARRIER INJECTION AND MASS TRANSFER AND PREPARATION METHOD THEREOF
US-2024297282-A1 · Sep 5, 2024 · US
US2016284931A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016284931-A1 |
| Application number | US-201415034919-A |
| Country | US |
| Kind code | A1 |
| Filing date | Nov 13, 2014 |
| Priority date | Nov 19, 2013 |
| Publication date | Sep 29, 2016 |
| Grant date | — |
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A radiation-emitting semiconductor device includes a semiconductor body with a semiconductor layer sequence, wherein the semiconductor layer sequence has an active region that generates radiation having a peak wavelength in the near-infrared spectral range and an absorptive region, and the absorption region at least partially absorbs a shortwave radiation component having a cut-off wavelength shorter than the peak wavelength.
Opening claim text (preview).
1 - 14 . (canceled) 15 . A radiation-emitting semiconductor device comprising a semiconductor body with a semiconductor layer sequence, wherein the semiconductor layer sequence has an active region that generates radiation having a peak wavelength in the near-infrared spectral range and an absorption region, and the absorption region at least partially absorbs a shortwave radiation component having a cut-off wavelength shorter than the peak wavelength. 16 . The radiation-emitting semiconductor device according to claim 15 , wherein the absorption region has an absorption coefficient for radiation having the cut-off wavelength of at least 5000/cm. 17 . The radiation-emitting semiconductor device according to claim 15 , wherein the cut-off wavelength is shorter than or equal to 820 nm. 18 . The radiation-emitting semiconductor device according to claim 15 , wherein the absorption region has at least one layer, the doping concentration of which is at most half a level of a doping concentration of a semiconductor material arranged between the absorption region and the active region. 19 . The radiation-emitting semiconductor device according to claim 15 , wherein the absorption region is nominally undoped. 20 . The radiation-emitting semiconductor device according to claim 15 , wherein the semiconductor device has a first contact and a second contact that externally electrically contact the semiconductor device and the absorption region is arranged outside a current path extending through the active region between the first contact and the second contact. 21 . The radiation-emitting semiconductor device according to claim 20 , wherein the absorption region has at least one cutout in which a semiconductor layer arranged between the absorption region and the active region is adjacent the first contact or the second contact. 22 . The radiation-emitting semiconductor device according to claim 15 , wherein the semiconductor device has a first contact and a second contact that electrically contact the semiconductor device and the absorption region is arranged in a current path extending through the active region between the first contact and the second contact. 23 . The radiation-emitting semiconductor device according to claim 15 , wherein the active region contains Al x In y Ga 1-x-y As with 0≦x≦1, 0≦y≦1 and x+y≦1. 24 . The radiation-emitting semiconductor device according to claim 15 , wherein the absorption region contains Al x Ga 1-x As with 0.01≦x≦0.1. 25 . The radiation-emitting semiconductor device according to claim 15 , wherein the absorption region contains Al x Ga 1-x As with 0.03≦x≦0.07. 26 . The radiation-emitting semiconductor device according to claim 15 , wherein the absorption region has a quantum structure with at least one quantum layer. 27 . The radiation-emitting semiconductor device according to claim 15 , wherein the absorption region is arranged between the active region and a radiation exit face of the semiconductor body. 28 . The radiation-emitting semiconductor device according to claim 15 , wherein the semiconductor device is a thin-film semiconductor chip in which the semiconductor body is fastened by a materially bonded connection to a carrier and is remote from a growth substrate for the semiconductor layer sequence of the semiconductor body. 29 . A radiation-emitting semiconductor device comprising a semiconductor body with a semiconductor layer sequence, wherein the semiconductor layer sequence has an active region that generates radiation having a peak wavelength in the near-infrared spectral range and an absorption region, the absorption region at least partially absorbs a shortwave radiation component having a cut-off wavelength which is shorter than the peak wavelength, the absorption region is nominally undoped, and the semiconductor device has a first contact and a second contact that externally electrically contact the semiconductor device and the absorption region is arranged outside a current path extending through the active region between the first contact and the second contact.
Wavelength conversion means · CPC title
within the light-emitting regions, e.g. having quantum confinement structures · CPC title
Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title
Reflecting means · CPC title
Optical field-shaping means, e.g. lenses · CPC title
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