Ceramic electronic device, powder material, paste material, and manufacturing method of ceramic electronic device
US-12073996-B2 · Aug 27, 2024 · US
US2016284889A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016284889-A1 |
| Application number | US-201414442633-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 20, 2014 |
| Priority date | Mar 29, 2013 |
| Publication date | Sep 29, 2016 |
| Grant date | — |
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A conductive paste for a solar cell element front surface electrode that is used to form a front surface electrode of a solar cell element that is provided with a semiconductor substrate, an antireflective film disposed in a first region on one main surface of the semiconductor substrate, and a front surface electrode disposed in a second region on the one main surface of the semiconductor substrate. The conductive paste contains a conductive powder, a mixed glass frit, and an organic vehicle in which the mixed glass frit contains, in the form of mixture, a tellurium-based glass frit containing tellurium, tungsten, and bismuth as essential components and a lead-bismuth-based glass frit that contains lead and bismuth as essential components and that substantially does not contain tellurium.
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1 . A conductive paste for a solar cell element front surface electrode that is used to form a front surface electrode of a solar cell element that is provided with a semiconductor substrate, an antireflective film disposed in a first region on one main surface of the semiconductor substrate, and a front surface electrode disposed in a second region on the one main surface of the semiconductor substrate, characterized in that the conductive paste comprises a conductive powder, a mixed glass frit, and an organic vehicle in which the mixed glass frit contains, in the form of mixture, a tellurium-based glass frit containing tellurium, tungsten, and bismuth as essential components and a lead-bismuth-based glass frit that contains lead and bismuth as essential components and that substantially does not contain tellurium. 2 . The conductive paste for a solar cell element front surface electrode according to claim 1 , wherein a softening point of the tellurium-based glass frit is 10 to 100° C. lower than a softening point of the lead-bismuth-based glass frit. 3 . The conductive paste for a solar cell element front surface electrode according to claim 1 , wherein the mixed glass frit contains the tellurium-based glass frit and the lead-bismuth-based glass frit at a blending ratio of 4:6 to 8:2 as a mass ratio. 4 . The conductive paste for a solar cell element front surface electrode according to claim 1 , wherein the tellurium-based glass frit is a glass frit which contains, as the oxide, 30 to 80 mol % of tellurium, 10 to 50 mol % of tungsten, and 5 to 25 mol % of bismuth. 5 . The conductive paste for a solar cell element front surface electrode according to claim 1 , wherein the lead-bismuth-based glass frit is a glass frit which contains, as the oxide, 30 to 70 mol % of lead, 10 to 40 mol % of bismuth, not more than 30 mol % of zinc (including 0 mol %), and 5 to 30 mol % of silicon or a glass frit which contains, as the oxide, 30 to 70 mol % of lead, 10 to 40 mol % of bismuth, not more than 30 mol % of zinc (including 0 mol %), and 1 to 25 mol % of boron. 6 . The conductive paste for a solar cell element front surface electrode according to claim 1 , wherein the mixed glass frit further contains a lead-tellurium-based glass frit containing lead and tellurium as essential components. 7 . The conductive paste for a solar cell element front surface electrode according to claim 1 , wherein the conductive paste further contains at least one selected from the group consisting of tin, tin(II) oxide, and tin(IV) oxide as an additive. 8 . A method for manufacturing a solar cell element which comprises a semiconductor substrate, an antireflective film disposed in a first region on one main surface of the semiconductor substrate, and a front surface electrode disposed in a second region on the one main surface of the semiconductor substrate, the method comprising: a first step of forming the antireflective film on the one main surface of the semiconductor substrate; a second step of printing, on the antireflective film, a conductive paste comprising a conductive powder, a mixed glass frit, and an organic vehicle in which, the mixed glass frit contains, in the form of mixture, a tellurium-based glass frit containing tellurium, tungsten, and bismuth as essential components and a lead-bismuth-based glass frit that contains lead and bismuth as essential components and that substantially does not contain tellurium; and a third step of disposing the antireflective film in the first region of the semiconductor substrate and forming the front surface electrode in the second region of the semiconductor substrate, by firing the conductive paste and removing the antireflective film located under the conductive paste. 9 . The method for manufacturing a solar cell element according to claim 8 , wherein a softening point of the tellurium-based glass frit is 10 to 100° C. lower than a softening point of the lead-bismuth-based glass frit. 10 . The method for manufacturing a solar cell element according to claim 8 , wherein the mixed glass frit contains the tellurium-based glass frit and the lead-bismuth-based glass frit at a blending ratio of 4:6 to 8:2 as a mass ratio. 11 . The method for manufacturing a solar cell element according to claim 8 , wherein the tellurium-based glass frit is a glass frit which contains, as the oxide, 30 to 80 mol % of tellurium, 10 to 50 mol % of tungsten, and 5 to 25 mol % of bismuth. 12 . The method for manufacturing a solar cell element according to claim 8 , wherein the lead-bismuth-based glass frit is a glass frit which contains, as the oxide, 30 to 70 mol % of lead, 10 to 40 mol % of bismuth, not more than 30 mol % of zinc (including 0 mol %), and 5 to 30 mol % of silicon or a glass frit which contains, as the oxide, 30 to 70 mol % of lead, 10 to 40 mol % of bismuth, not more than 30 mol % of zinc (including 0 mol %), and 1 to 25 mol % of boron. 13 . The method for manufacturing a solar cell element according to claim 8 , wherein the mixed glass frit further contains a lead-tellurium-based glass frit containing lead and tellurium as essential components. 14 . The method for manufacturing a solar cell element according to claim 8 , wherein the conductive paste further contains at least one selected from the group consisting of tin, tin(II) oxide, and tin(IV) oxide as an additive.
the conductive material comprising metals or alloys · CPC title
containing lead · CPC title
containing free metals · CPC title
the conductive material comprising metals or alloys · CPC title
containing two or more distinct frits having different compositions · CPC title
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