Upper electrode, edge ring, and plasma processing apparatus

Patent metadata

Field	Value
Publication number	US-2016284522-A1
Application number	US-201514800938-A
Country	US
Kind code	A1
Filing date	Jul 16, 2015
Priority date	Mar 25, 2015
Publication date	Sep 29, 2016
Grant date	—

Abstract

According to one embodiment, an upper electrode to be arranged opposite to a lower electrode and serving as a shower head in a plasma processing apparatus of a parallel-plate type is provided. The upper electrode includes a concave portion provided on an outer peripheral side of a processing object opposing region configured to face a mounting region for a processing object to be placed on the lower electrode.

First claim

What is claimed is:

1 . An upper electrode to be arranged opposite to a lower electrode and serving as a shower head in a plasma processing apparatus of a parallel-plate type, comprising:
a concave portion provided on an outer peripheral side of a processing object opposing region configured to face a mounting region for a processing object to be placed on the lower electrode.

2 . The upper electrode according to claim 1 , further comprising a convex portion provided on an outer peripheral side of the concave portion and configured to protrude toward the lower electrode more than the processing object opposing region.

3 . The upper electrode according to claim 1 , wherein the concave portion has a Rogowski shape.

4 . The upper electrode according to claim 1 , further comprising gas passages in the processing object opposing region, the gas passages penetrating the upper electrode in a thickness direction.

5 . An edge ring to be arranged around a processing object support member serving as a lower electrode in a plasma processing apparatus of a parallel-plate type,
wherein, in a region of at least a processing object support member side of a surface facing an upper electrode of the plasma processing apparatus, a distance from the upper electrode to the surface increases in a direction from an inner peripheral side of the region toward an outer peripheral side of the region.

6 . The edge ring according to claim 5 , further comprising a concave portion provided on the surface facing the upper electrode.

7 . The edge ring according to claim 6 , wherein the concave portion has a Rogowski shape.

8 . The edge ring according to claim 5 , wherein, in an exposed surface to be exposed to the upper electrode, a distance from the upper electrode to the exposed surface increased in the direction from the inner peripheral side toward the outer peripheral side.

9 . The edge ring according to claim 5 , further comprising a reverse surface on a reverse side relative to the surface facing the upper electrode, the reverse surface being in parallel with a processing object support surface of the processing object support member and flat.

10 . A plasma processing apparatus of a parallel-plate type, comprising:
a chamber; a processing object support member serving as a lower electrode and configured to hold a processing object in the chamber; and an upper electrode arranged opposite to the processing object support member and serving as a shower head in the chamber; wherein an edge ring is arranged around the processing object support member, and the upper electrode includes a first concave portion provided on an outer peripheral side of a processing object opposing region that faces a mounting region for the processing object of the processing object support member.

11 . The plasma processing apparatus according to claim 10 , wherein the upper electrode includes a convex portion provided on an outer peripheral side of the first concave portion and protruding toward the lower electrode more than the processing object opposing region.

12 . The plasma processing apparatus according to claim 10 , wherein the first concave portion has a Rogowski shape.

13 . The plasma processing apparatus according to claim 10 , wherein a surface of the edge ring facing the upper electrode is in parallel with a processing object support surface of the processing object support member.

14 . The plasma processing apparatus according to claim 10 , wherein the first concave portion is provided at a position that faces a region where the edge ring is arranged.

15 . The plasma processing apparatus according to claim 10 , wherein, in a region of at least a processing object support member side of a surface of the edge ring facing the upper electrode, a distance from the upper electrode to the surface of the edge ring increases in a direction from an inner peripheral side of the region toward an outer peripheral side of the region.

16 . The plasma processing apparatus according to claim 15 , wherein the edge ring includes a second concave portion provided on the surface facing the upper electrode.

17 . The plasma processing apparatus according to claim 16 , wherein the second concave portion of the edge ring has a Rogowski shape.

18 . The plasma processing apparatus according to claim 15 , wherein, in an exposed surface of the edge ring to be exposed to the upper electrode, a distance from the upper electrode to the exposed surface is increased in the direction from the inner peripheral side toward the outer peripheral side.

19 . The plasma processing apparatus according to claim 10 , wherein a thickness of the edge ring is reduced in a direction from an inner peripheral side toward an outer peripheral side.

20 . The plasma processing apparatus according to claim 10 , wherein the upper electrode includes gas passages in the processing object opposing region, the gas passages penetrating the upper electrode in a thickness direction.

Assignees

• Toshiba Kk

Inventors

• Eto Hideo
• Abe Masanori
• Saito Makoto

Classifications

• C23C16/50

  using electric discharges {(generation and control of plasma in discharge tubes for surface treatment H01J37/32, H01J37/34)} · CPC title

• C23C16/45565

  Shower nozzles · CPC title

• H01J37/3244

  Gas supply means · CPC title

• C23C16/458 Primary

  characterised by the method used for supporting substrates in the reaction chamber · CPC title

• H01J37/32532 Primary

  Electrodes · CPC title