3d model recognition apparatus and method

US2016284122A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016284122-A1
Application numberUS-201514670000-A
CountryUS
Kind codeA1
Filing dateMar 26, 2015
Priority dateMar 26, 2015
Publication dateSep 29, 2016
Grant date

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

In embodiments, apparatuses, methods and storage media (transitory and non-transitory) are described that receive a first 3D model of a 3D object, and determine a second 3D model to replace the first 3D model, wherein the second 3D model is a fuller representation of the 3D object than the first 3D model. In embodiments, the second 3D model may be manipulated, metadata corresponding to a material property of the 3D object may be provided, 3D models of component parts of the 3D object may be provided, or the second 3D model may be used to construct an object with a 3D printer. Other embodiments may be described and/or claimed.

First claim

Opening claim text (preview).

What is claimed is: 1 . A computing device comprising: one or more processors; and a three dimensional (3D) modeling module operated by the one or more processors to: receive a first 3D model of a 3D object; and determine a second 3D model to replace the first 3D model, wherein the second 3D model is a fuller representation of the 3D object than the first 3D model. 2 . The computing device of claim 1 , wherein the 3D modeling module is to determine the second 3D model based at least in part on rotating and scaling at least one of the first 3D model or the second 3D model. 3 . The computing device of claim 1 , wherein the 3D modeling module is to determine the second 3D model based at least in part on a machine learning algorithm. 4 . The computing device of claim 1 , further comprising a componentization module operated by the one or more processors to: determine 3D models of component parts associated with the second 3D model. 5 . The computing device of claim 1 , wherein the second 3D model includes metadata corresponding to a material property of the 3D object. 6 . The computing device of claim 1 , further comprising a database update module operated by the one or more processors to: receive an altered 3D model based at least in part on the second 3D model; and update a database based at least in part on the altered 3D model. 7 . The computing device of claim 6 , wherein the altered 3D model includes at least one different geometry primitive than the second 3D model. 8 . A computing device comprising: one or more processors; a camera; a display; an extraction module operated by the one or more processors to: receive a two dimensional (2D) image of a 3D object taken by the camera; and extract a first three dimensional (3D) model based at least in part on the 2D image; an object module operated by the one or more processors to: send the first 3D model to another computing device; and receive a second 3D model from the other computing device; and a display module operated by the one or more processors to display the second 3D model on the display, wherein the second 3D model is a fuller representation of the 3D object than the first 3D model. 9 . The computing device of claim 8 , wherein the object module is also operated by the one or more processors to receive 3D models of component parts associated with the second 3D model, and wherein the display module is also operated by the one or more processors to display the 3D models of component parts. 10 . The computing device of claim 8 , further comprising a manipulation module operated by the one or more processors to manipulate the second 3D model to generate an altered 3D model. 11 . The computing device of claim 8 , further comprising a printing module operated by the one or more processors to send a command to a 3D printer based at least in part on the second 3D model. 12 . A computer implemented method comprising: receiving a first 3D model of a three dimensional (3D) object at a computing device; and determining, by the computing device, a second 3D model to replace the first 3D model, wherein the second 3D model is a fuller representation of the 3D object than the first 3D model. 13 . The computer implemented method of claim 12 , wherein determining the second 3D model includes rotating and scaling at least one of the first 3D model or the second 3D model. 14 . The computer implemented method of claim 12 , wherein determining the second 3D model is based at least in part on a machine learning algorithm. 15 . The computer implemented method of claim 12 , further comprising determining, by the computing device, material characteristics associated with the second 3D model. 16 . The computer implemented method of claim 12 , further comprising determining, by the computing device, 3D models of component parts associated with the second 3D model. 17 . The computer implemented method of claim 12 , further comprising: receiving, by the computing device, an altered 3D model based at least in part on the second 3D model; and updating, by the computing device, a database based at least in part on the altered 3D model. 18 . The computer implemented method of claim 17 , wherein the altered 3D model includes at least one different geometry primitive than the second 3D model. 19 . At least one non-transitory computer-readable medium comprising instructions stored thereon that, in response to execution of the instructions by one or more processors of a computing device, cause the computing device to: receive a first 3D model of a three dimensional (3D) object; and determine a second 3D model to replace the first 3D model, wherein the second 3D model is a fuller representation of the 3D object than the first 3D model. 20 . The at least one non-transitory computer-readable medium of claim 19 , wherein the computing device is caused to determine the second 3D model based at least in part on rotating and scaling at least one of the first 3D model or the second 3D model. 21 . The at least one non-transitory computer-readable medium of claim 19 , wherein the computing device is caused to determine the second 3D model based at least in part on a machine learning algorithm. 22 . The at least one non-transitory computer-readable medium of claim 19 , wherein the computing device is also caused to determine material characteristics associated with the second 3D model. 23 . The at least one non-transitory computer-readable medium of claim 19 , wherein the computing device is also caused to: determine 3D models of component parts associated with the second 3D model. 24 . The at least one non-transitory computer-readable medium of claim 19 , wherein the computing device is further caused to: receive an altered 3D model based at least in part on the second 3D model; and update a database based at least in part on the altered 3D model. 25 . The at least one non-transitory computer-readable medium of claim 24 , wherein the altered 3D model includes at least one different geometry primitive than the second 3D model.

Assignees

Inventors

Classifications

  • Surface or curve machining, making three-dimensional [3D] objects, e.g. desktop manufacturing · CPC title

  • 3-D printing, layer of powder, add drops of binder in layer, new powder · CPC title

  • Manipulating three-dimensional [3D] models or images for computer graphics · CPC title

  • Physics · mapped topic

  • G06T17/20Primary

    Finite element generation, e.g. wire-frame surface description, {tesselation} · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US2016284122A1 cover?
In embodiments, apparatuses, methods and storage media (transitory and non-transitory) are described that receive a first 3D model of a 3D object, and determine a second 3D model to replace the first 3D model, wherein the second 3D model is a fuller representation of the 3D object than the first 3D model. In embodiments, the second 3D model may be manipulated, metadata corresponding to a materi…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification G05B19/4099. Mapped technology areas include Physics.
When was this patent published?
Publication date Thu Sep 29 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).