Upper dome temperature closed loop control

Patent metadata

Field	Value
Publication number	US-2016282886-A1
Application number	US-201514722327-A
Country	US
Kind code	A1
Filing date	May 27, 2015
Priority date	Mar 27, 2015
Publication date	Sep 29, 2016
Grant date	—

Abstract

A method and apparatus for controlling the temperature in a processing chamber for semiconductor processing is disclosed herein. In one embodiment, a processing chamber for semiconductor processing is provided. The processing chamber includes a chamber body and a temperature control system. The temperature control system includes a temperature sensor configured to measure a temperature in an upper dome of the processing chamber, a blower, and a controller configured to control the temperature control system. The temperature control system is configured to carry out the method provided herein for controlling the temperature in a processing chamber.

First claim

What is claimed is:

1 . A processing chamber for semiconductor processing, the processing chamber comprising:
a chamber body comprising:
an upper dome;
a lower dome, the upper dome and the lower dome defining an interior volume of the processing chamber; and
a temperature control system comprising:
a temperature sensor to measure a temperature of the upper dome;
a blower; and
a controller in communication with the blower and the temperature sensor.

2 . The processing chamber of claim 1 , wherein the temperature sensor is a pyrometer.

3 . The processing chamber of claim 1 , wherein the temperature sensor uses light having a wavelength between 1.5 um to 6 um to measure the temperature of the upper dome.

4 . The processing chamber of claim 1 , wherein the controller is a PID controller.

5 . The processing chamber of claim 4 , wherein the PID controller is set to a desired temperature set point such that a film will not form on the upper dome during processing.

6 . The processing chamber of claim 1 , wherein the controller comprises:
an input coupled to the temperature sensor; and an output coupled to the blower.

7 . The processing chamber of claim 1 , wherein the blower is operable to provide a cool gas flow to the upper dome.

8 . The processing chamber of claim 1 , wherein the temperature sensor is operable to transmit a measured temperature of the upper dome to the controller.

9 . A temperature control system for a processing chamber for semiconductor processing, the temperature control system comprising:
a temperature sensor to measure a temperature of a process-exposed component of the processing chamber; a blower to direct a cooling gas flow toward the process-exposed component; and a controller in communication with the blower and the temperature sensor.

10 . The temperature control system of claim 9 , wherein the temperature sensor is a pyrometer.

11 . The temperature control system of claim 9 , wherein the temperature sensor uses light having a wavelength between 1.5 μm to 6 μm to measure the temperature of the upper dome.

12 . The temperature control system of claim 9 , wherein the controller is a PID controller.

13 . The temperature control system of claim 12 , wherein the PID controller is set to a desired temperature set point such that a film will not form on the upper dome during processing.

14 . The temperature control system of claim 9 , wherein the controller comprises:
an input coupled to the temperature sensor; and an output coupled to the blower.

15 . The temperature control system of claim 9 , wherein the blower directs cooling gas toward an upper dome of the processing chamber.

16 . The temperature control system of claim 9 , wherein the temperature sensor is operable to transmit a measured temperature of the upper dome to the controller.

17 . A method for controlling the temperature in a processing chamber for semiconductor processing, the method comprising:
measuring a temperature of an upper dome of the processing chamber using a temperature sensor; transmitting the measured temperature from the temperature sensor to a PID controller; calculating a controller output based on the measured temperature; operating a blower based on the controller output to control the temperature of the upper dome.

18 . The method of claim 17 , wherein measuring a temperature of an upper dome of the processing chamber using a temperature sensor comprises:
measuring the temperature of the upper dome of the processing chamber using light having a wavelength between 1.6 μm to 6 μm.

19 . The method of claim 17 , further comprising:
setting the PID controller to a desired temperature set point.

20 . The method of claim 19 , wherein calculating a controller output based on the measured temperature comprises:
comparing the measured temperature to the desired temperature set point.

Assignees

• Applied Materials Inc

Inventors

• Leighton Jamie Stuart
• CABALLERO Carlos
• Kitamura Shin
• Ackerman Thomas
• Auzenne Mark
• VINIT Vivek

Classifications

• G05D23/27

  with sensing element responsive to radiation · CPC title

• G05D23/1919 Primary

  characterised by the type of controller · CPC title

• G05D23/1917 Primary

  using digital means · CPC title

• H10P72/0431 Primary

  Apparatus for thermal treatment · CPC title

• G05B11/42

  for obtaining a characteristic which is both proportional and time-dependent, e.g. P. I., P. I. D. · CPC title