Forming a housing assembly

Patent metadata

Field	Value
Publication number	US-2016279864-A1
Application number	US-201615172114-A
Country	US
Kind code	A1
Filing date	Jun 2, 2016
Priority date	Jan 21, 2011
Publication date	Sep 29, 2016
Grant date	—

Abstract

In some examples, a method of forming a housing assembly comprises affixing a support frame onto a first panel cover of the housing assembly, wherein the support frame includes an integrated pattern of channel cavities, positioning a second panel cover of the housing assembly adjacent the support frame, and flowing a bonding material through a plurality of openings of the second panel cover and into the channel cavities of the integrated pattern of the support frame so as to form a secure bond between the first panel cover, the support frame, and the second panel cover of the housing assembly.

First claim

What is claimed is:

1 . A method of forming a housing assembly for an electronic device, the method comprising:
performing a first assembly process comprising:
inserting an outer panel cover into a molding tool;
affixing a support frame onto the outer panel cover using the molding tool, wherein the support frame includes an integrated pattern of channel cavities; and
performing a second assembly process comprising:
positioning, using the molding tool, an inner panel cover adjacent the support frame; and
flowing a bonding material through a plurality of openings of the inner panel cover and into the channel cavities of the integrated pattern of the support frame so as to form a secure bond between the outer panel cover, the support frame, and the inner panel cover.

2 . The method of claim 1 , wherein positioning the inner panel cover adjacent to the support frame comprises:
aligning the plurality of openings of the inner panel cover with the integrated pattern of channel cavities included in the support frame.

3 . The method of claim 2 , wherein the channel cavities comprise first channel cavities running along a first direction, and second channel cavities running along a second, different direction, and wherein aligning the plurality of openings of the inner panel cover with the integrated pattern of channel cavities comprises aligning the plurality of openings of the inner panel cover with respective intersections of the first channel cavities and the second channel cavities.

4 . The method of claim 3 , wherein the first direction is orthogonal to the second direction.

5 . The method of claim 1 , wherein affixing the support frame onto the outer panel cover comprises:
pressing a cavity side of the molding tool against a first core side of the molding tool, wherein the cavity side includes the outer panel cover and the first core side includes the support frame.

6 . The method of claim 5 , wherein the second assembly process further comprises:
rotating the cavity side of the molding tool to face and align with a second core side of the molding tool, wherein the second core side includes the inner panel cover.

7 . The method of claim 6 , wherein the second assembly process further comprises:
pressing the cavity side of the molding tool against the second core side of the molding tool so as to position the inner panel cover, the outer panel cover, and the support frame in contact with each other.

8 . The method of claim 1 , wherein the inner panel cover and the outer panel cover are formed of a metal or glass material.

9 . The method of claim 1 , wherein the support frame is formed of a polymer material.

10 . A method of forming a housing assembly for an electronic device, the method comprising:
affixing a support frame onto a first panel cover, wherein the support frame includes an integrated pattern of channel cavities; positioning a second panel cover adjacent the support frame; and flowing a bonding material through a plurality of openings of the second panel cover and into the channel cavities of the integrated pattern of the support frame so as to form a secure bond between the first panel cover, the support frame, and the second panel cover.

11 . The method of claim 10 , wherein positioning the second panel cover adjacent to the support frame comprises:
aligning the plurality of openings of the second panel cover with the integrated pattern of channel cavities included in the support frame.

12 . The method of claim 11 , wherein the channel cavities comprise first channel cavities running along a first direction, and second channel cavities running along a second, different direction, and wherein aligning the plurality of openings of the inner panel cover with the integrated pattern of channel cavities comprises aligning the plurality of openings of the inner panel cover with respective intersections of the first channel cavities and the second channel cavities.

13 . The method of claim 12 , wherein the first direction is orthogonal to the second direction.

14 . The method of claim 10 , wherein the first panel cover is positioned adjacent a first side of the support frame, and the second panel cover is positioned adjacent a second, opposite side of the support frame.

15 . A method of forming an electronic device, the method comprising:
forming a housing assembly, comprising:
affixing a support frame onto a first panel cover of the housing assembly, wherein the support frame includes an integrated pattern of channel cavities;
positioning a second panel cover of the housing assembly adjacent the support frame; and
flowing a bonding material through a plurality of openings of the second panel cover and into the channel cavities of the integrated pattern of the support frame so as to form a secure bond between the first panel cover, the support frame, and the second panel cover of the housing assembly; and
attaching the housing assembly to a display panel.

16 . The method of claim 15 , wherein positioning the second panel cover adjacent to the support frame comprises:
aligning the plurality of openings of the second panel cover with the integrated pattern of channel cavities included in the support frame.

17 . The method of claim 16 , wherein the channel cavities comprise first channel cavities running along a first direction, and second channel cavities running along a second, different direction, and wherein aligning the plurality of openings of the inner panel cover with the integrated pattern of channel cavities comprises aligning the plurality of openings of the inner panel cover with respective intersections of the first channel cavities and the second channel cavities.

18 . The method of claim 17 , wherein the first direction is orthogonal to the second direction.

Assignees

• Hewlett Packard Development Co Lp

Inventors

• Senatori Mark David

Classifications

• Y10T428/24339

  Keyed · CPC title

• G06F1/1633

  Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626 · CPC title

• G06F1/1656 Primary

  Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories (mounting of accessories to a computer display G06F1/1607; display hoods G06F1/1603; cooling arrangements for portable computers G06F1/203) · CPC title

• G06F1/1637

  Details related to the display arrangement, including those related to the mounting of the display in the housing · CPC title

• B29L2031/3481

  Housings or casings incorporating or embedding electric or electronic elements · CPC title