Thermal spreader having inter-metal diffusion barrier layer

Patent metadata

Field	Value
Publication number	US-2016276242-A1
Application number	US-201514664310-A
Country	US
Kind code	A1
Filing date	Mar 20, 2015
Priority date	Mar 20, 2015
Publication date	Sep 22, 2016
Grant date	—

Abstract

A heat spreader provided having: as ceramic substrate; and metallization layer structure disposed on at least one surface of the substrate. The metallization layer structure includes: a thick film layer disposed on the at least one surface of the substrate; a diffusion barrier layer on, and in direct contact with the thick film layer; and as heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer. The diffusion barrier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer. The metallization layer structure is disposed on a plurality of sides of the substrate.

First claim

What is claimed is:

1 . A heat spreader, comprising:
a substrate; a metallization layer structure disposed on at least one surface of the substrate, comprising:
a thick film layer disposed on the at least one surface of the substrate;
diffusion barrier layer on, and in direct contact with the thick film layer;
a heat conducting layer disposed on, and in direct contact with, the diffusion barrier layer,
wherein the diffusion hairier layer inhibits material in the thick film layer and material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer.

2 . The heat spreader recited in claim 1 wherein the thick film layer comprises silver and wherein the diffusion barrier layer inhibits silver in the thick film layer and the material in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer.

3 . The heat spreader recited in claim 1 wherein the heat conductive layer comprises copper and wherein the diffusion barrier layer inhibits material in the thick film layer and the copper in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer.

4 . The heat spreader recited in claim 3 wherein the thick film layer comprises silver and wherein the diffusion barrier layer inhibits silver in the thick film layer and the copper in the heat conducting layer from diffusing between the thick film layer and the heat conductive layer.

5 . The heat spreader recited in claim 1 wherein the metallization layer structure is disposed on a plurality of sides of the substrate.

6 . The heat spreader recited in claim 5 wherein the at least one surface is a horizontal surface and another surface is at least one vertical side of the substrate.

7 . The heat spreader recited in claim 5 wherein the metallization layer structure is disposed on top and bottom surface of the substrate.

8 . The heat spreader recited in claim 5 wherein the metallization layer structure is disposed on a plurality of sides of the substrate.

9 . The heat spreader recited in claim 6 wherein the metallization layer structure is disposed on a plurality of the vertical sides of the substrate.

10 . The heat spreader recited in claim 7 wherein the metallization layer structure is disposed on at least one vertical side of the substrate.

11 . The heat spreader recited in claim 7 wherein the metallization layer structure is disposed on a plurality of vertical sides of the substrate.

12 . The heat spreader recited in claim 1 wherein the substrate is a ceramic substrate.

13 . The heat spreader recited in claim 2 wherein the substrate is a ceramic substrate.

14 . The heat spreader recited in claim 3 wherein the substrate is a ceramic substrate beryllium oxide.

15 . The heat spreader recited in claim 4 wherein the substrate is a ceramic substrate beryllium oxide.

16 . The heat spreader recited in claim 5 wherein the substrate is a ceramic substrate beryllium oxide.

17 . The heat spreader recited in claim 12 wherein the ceramic substrate is beryllium oxide.

18 . The heat spreader recited in claim 13 wherein the ceramic substrate is beryllium oxide.

19 . The heat spreader recited in claim 14 wherein the ceramic substrate is beryllium oxide.

20 . The heat spreader recited in claim 15 wherein the ceramic substrate is beryllium oxide.

Assignees

• Raytheon Co

Inventors

• Trulli Susan C

Classifications

• H10W40/259

  Ceramics or glasses (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/255

  having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates · CPC title

• H10W40/25 Primary

  characterised by their materials · CPC title

• H10W40/00 Primary

  Arrangements for thermal protection or thermal control (integrated devices comprising arrangements for thermal protection H10D89/60) · CPC title

• F28F21/085

  from copper or copper alloys · CPC title