Priming Material for Substrate Coating

US2016276151A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2016276151-A1
Application numberUS-201514791877-A
CountryUS
Kind codeA1
Filing dateJul 6, 2015
Priority dateMar 16, 2015
Publication dateSep 22, 2016
Grant date

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A coating technique and a priming material are provided. In an exemplary embodiment, the coating technique includes receiving a substrate and identifying a material of the substrate upon which a layer is to be formed. A priming material is dispensed on the material of the substrate, and a film-forming material is applied to the priming material. The priming material includes a molecule containing a first group based on an attribute of the substrate material and a second group based on an attribute of the film-forming material. Suitable attributes of the substrate material and the film-forming material include water affinity and degree of polarity and the first and second groups may be selected to have a water affinity or degree of polarity that corresponds to that of the substrate material and the film-forming material, respectively.

First claim

Opening claim text (preview).

1 . A method of circuit device fabrication, the method comprising: receiving a substrate; identifying a material of the substrate upon which a layer is to be formed; dispensing a priming material on the material of the substrate; and applying a film-forming material to the priming material, wherein the priming material includes a molecule containing a first group based on an attribute of the material and a second group based on an attribute of the film-forming material. 2 . The method of claim 1 , wherein the first group is configured to have a water affinity that corresponds to a water affinity of the material of the substrate, and wherein the second group is configured to have a water affinity that corresponds to a water affinity of the film-forming material. 3 . The method of claim 1 , wherein the first group is configured to have a degree of polarity that corresponds to a degree of polarity of the material of the substrate, and wherein the second group is configured to have a degree of polarity that corresponds to a degree of polarity of the film-forming material. 4 . The method of claim 1 , wherein at least one of the first group and the second group includes at least one of: a hydroxyl group, an amine group, an amide group, a thiol group, an ester, carboxylic acid, an anhydride group, silane, an epoxy group, a ketone, a cyano group, an isocyzno group, or an imide group. 5 . The method of claim 1 , wherein at least one of the first group and the second group includes at least one of: an alkyl group, a phenyl group, a biphenyl group, a benzyl group, an ether group, a cycloalkyl group, or an aromatic ring. 6 . The method of claim 1 , wherein a first one of the first group and the second group includes at least one of: a hydroxyl group, an amine group, an amide group, a thiol group, an ester, carboxylic acid, an anhydride group, silane, an epoxy group, a ketone, a cyano group, an isocyzno group, or an imide group, and wherein a second one of the first group and the second group includes at least one of: an alkyl group, a phenyl group, a biphenyl group, a benzyl group, an ether group, a cycloalkyl group, or an aromatic ring. 7 . The method of claim 1 , wherein the molecule of the priming material further includes a linking structure joining the first group and the second group, and wherein the linking structure includes at least one of: an alkyl structure, an aryl structure, a heteroaryl structure, or a heterocycloalkyl structure. 8 . The method of claim 1 , wherein the dispensing of the priming material includes rotating the substrate to distribute the priming material on the material of the substrate. 9 . A method of film formation, the method comprising: receiving a substrate having a material at a top surface of the substrate; selecting a priming material for application using a coating technique based on a property of the material of the substrate; applying the selected priming material to the material of the substrate; applying a film-forming material to the priming material; and evaporating the priming material and the film-forming material to leave a component of the film-forming material. 10 . The method of claim 9 , wherein the applying of the priming material includes rotating the substrate to disperse the priming material radially on the substrate, and wherein the applying of the film-forming material includes rotating the substrate to disperse the film-forming material radially on the substrate. 11 . The method of claim 9 , wherein the priming material includes a molecular group configured based on a water affinity of the material of the substrate. 12 . The method of claim 9 , wherein the priming material includes a molecule having at least one of: a hydroxyl group, an amine group, an amide group, a thiol group, an ester, carboxylic acid, an anhydride group, silane, an epoxy group, a ketone, a cyano group, an isocyzno group, or an imide group based on the property of the material. 13 . The method of claim 9 , wherein the priming material includes a molecule having at least one of: an alkyl group, a phenyl group, a biphenyl group, a benzyl group, an ether group, a cycloalkyl group, or an aromatic ring based on the property of the material. 14 . The method of claim 9 further comprising selecting the priming material further based on a property of the film-forming material such that the priming material includes a molecule having a first molecular group based on the property of the material of the substrate and a second molecular group based on the property of the film-forming material. 15 . A coating primer comprising: a molecule having a first molecular group associated with a substrate material and a second molecular group associated with a film-forming material to be applied on the coating primer. 16 . The coating primer of claim 15 , wherein the first molecular group has at least one of: a water affinity or a polarity corresponding to at least one of: a water affinity of the substrate material or a polarity of the substrate material. 17 . The coating primer of claim 16 , wherein the second molecular group has at least one of: a water affinity or a polarity corresponding to at least one of: a water affinity of the film-forming material or a polarity of the film-forming material. 18 . The coating primer of claim 15 , wherein the first molecular group and the second molecular group each include at least one of: a hydroxyl group, an amine group, an amide group, a thiol group, an ester, carboxylic acid, an anhydride group, silane, an epoxy group, a ketone, a cyano group, an isocyzno group, or an imide group. 19 . The coating primer of claim 15 , wherein the first molecular group and the second molecular group each include at least one of: an alkyl group, a phenyl group, a biphenyl group, a benzyl group, an ether group, a cycloalkyl group, or an aromatic ring. 20 . The coating primer of claim 15 , wherein the molecule further includes a linking structure linking the first molecular group and the second molecular group, and wherein the linking structure includes at least one of an alkyl structure, an aryl structure, a heteroaryl structure, or a heterocycloalkyl structure.

Assignees

Inventors

Classifications

  • Liquid deposition, e.g. spin-coating, sol-gel techniques or spray coating · CPC title

  • carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

  • of masks comprising organic materials · CPC title

  • Apparatus for applying a liquid, a resin, an ink or the like · CPC title

  • Finishing the coated layer, e.g. drying, baking, soaking · CPC title

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What does patent US2016276151A1 cover?
A coating technique and a priming material are provided. In an exemplary embodiment, the coating technique includes receiving a substrate and identifying a material of the substrate upon which a layer is to be formed. A priming material is dispensed on the material of the substrate, and a film-forming material is applied to the priming material. The priming material includes a molecule containi…
Who is the assignee on this patent?
Taiwan Semiconductor Mfg Co Ltd
What technology area does this patent fall under?
Primary CPC classification C09D5/002. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Sep 22 2016 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).