Probe head, probe card assembly using the same, and manufacturing method thereof

Patent metadata

Field	Value
Publication number	US-2016274147-A1
Application number	US-201514658572-A
Country	US
Kind code	A1
Filing date	Mar 16, 2015
Priority date	Mar 16, 2015
Publication date	Sep 22, 2016
Grant date	—

Abstract

A probe head includes a first substrate, a second substrate, a spacer, at least one probe, and an insulating material. The first substrate has at least one first through hole. The second substrate has at least one second through hole. The spacer is disposed between the first substrate and the second substrate. The spacer, the first substrate, and the second substrate together form a cavity. The probe is disposed in the cavity and protrudes from the first through hole and the second through hole. The insulating material is on the probe and at least partially disposed in the first through hole.

First claim

What is claimed is:

1 . A probe head comprising:
a first substrate having at least one first through hole; a second substrate having at least one second through hole; a spacer disposed between the first substrate and the second substrate, wherein the spacer, the first substrate, and the second substrate together form a cavity; at least one probe disposed in the cavity and protruding from the first through hole and the second through hole; and an insulating material disposed on the probe and at least partially disposed in the first through hole.

2 . The probe head of claim 1 , wherein the insulating material is further at least partially disposed in the second through hole.

3 . The probe head of claim 1 , wherein the probe has a testing terminal and a connecting terminal opposite to each other, the insulating material exposes the testing terminal and the connecting terminal.

4 . The probe head of claim 1 , further comprising:
an insulating layer disposed at a side of the first substrate facing the spacer.

5 . The probe head of claim 1 , further comprising:
an insulating layer disposed at a side of the first substrate opposite to the spacer.

6 . The probe head of claim 1 , wherein a plurality of the first through holes are arranged along one column, and a plurality of the second through holes are arranged along two columns, a projection of the first through holes on the second substrate are disposed between the two columns of the second through holes.

7 . The probe head of claim 6 , wherein a pitch of adjacent two of the first through holes is shorter than a pitch of adjacent two of the second through holes.

8 . The probe head of claim 6 , wherein a pitch of adjacent two of the second through holes is substantially twice the distance of a pitch of adjacent two of the first through holes.

9 . The probe head of claim 6 , wherein the probe has a testing terminal and a connecting terminal opposite to each other, the testing terminal protrudes from one of the first through holes, and the connecting terminal protrudes from one of the second through holes.

10 . The probe head of claim 1 , wherein the insulating material is made of polyamide-imides.

11 . A probe card assembly comprising:
a circuit board; a probe head comprising:
a first substrate having at least one first through hole;
a second substrate having at least one second through hole;
a spacer disposed between the first substrate and the second substrate, wherein the spacer, the first substrate, and the second substrate together define a cavity;
at least one probe disposed in the cavity and extending from the first through hole and the second through hole; and
an insulating material at least covering a portion of the probe disposed in the first through hole; and
a space transformer disposed between the circuit board and the probe head to electrically interconnect the probe and the circuit board.

12 . The probe card assembly of claim 11 , wherein the insulating material further covers another portion of the probe disposed in the second through hole.

13 . The probe card assembly of claim 11 , further comprising:
a jig configured to connect the space transformer to the circuit board.

14 . A method for manufacturing a probe head comprising:
forming an insulating material around a probe; disposing a spacer on a first substrate; disposing the probe in an opening of the spacer, and the probe protruding from a first through hole of the first substrate, such that at least a portion of the insulating material is disposed in the first through hole; and disposing a second substrate on the spacer, such that the probe further protrudes from a second through hole of the second substrate.

15 . The method of claim 14 , further comprising:
disposing another portion of the insulating material in the second through hole.

16 . The method of claim 14 , wherein the insulating material is coated on the probe.

17 . The method of claim 14 , further comprising:
forming an insulating layer at a side of the first substrate facing the spacer.

18 . The method of claim 14 , further comprising:
forming an insulating layer at a side of the first substrate opposite to the spacer.

19 . The method of claim 14 , further comprising:
arranging a plurality of the first through holes along one column; and arranging a plurality of the second through holes along two columns, such that a projection of the first through holes on the second substrate are disposed between the two columns of the second through holes.

20 . The method of claim 14 , wherein the insulating material is made of polyamide-imides.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Hsu Ming-Cheng
• Liao Wen-Feng
• Su Wen-Tsai
• Huang Yuan-Pin

Classifications

• G01R31/2601

  Apparatus or methods therefor (G01R31/2607, G01R31/2642 take precedence) · CPC title

• G01R3/00 Primary

  Apparatus or processes specially adapted for the manufacture {or maintenance} of measuring instruments {, e.g. of probe tips} · CPC title

• G01R1/067 Primary

  Measuring probes · CPC title

• G01R1/07357

  with flexible bodies, e.g. buckling beams · CPC title

• G01R1/07378

  using an intermediate adapter, e.g. space transformers (G01R1/07371 takes precedence) · CPC title