Led lighting assemblies with thermal overmolding

Patent metadata

Field	Value
Publication number	US-2016270207-A1
Application number	US-201615164054-A
Country	US
Kind code	A1
Filing date	May 25, 2016
Priority date	Nov 29, 2005
Publication date	Sep 15, 2016
Grant date	—

Abstract

One or more light emitting diode diodes (LEDs) are attached to a printed circuit board. The attached LEDs are connectable with a power source via circuitry of the printed circuit board. An overmolding material is insert molded an over at least portions of the printed circuit board proximate to the LEDs to form a free standing high thermal conductivity material overmolding that covers at least portions of the printed circuit board proximate to the LEDs. The free standing high thermal conductivity material has a melting temperature greater than about 100° C. and has a thermal conductivity greater than or about 1 W/m·K. In some embodiments, the free standing high thermal conductivity material is a thermoplastic material.

First claim

1 - 32 . (canceled)

33 . A lighting assembly, comprising:
a printed circuit board; one or more light emitting diode (LED) disposed on the printed circuit board; conductors electrically connected to the printed circuit board; one or more light-transmissive cover disposed over the one or more LED; an overmolding encapsulating a portion of the cover and the printed circuit board over at least portions of the printed circuit board proximate the one or more LED; and wherein the overmolding does not cover at least a light output aperture of the LED and a portion of the cover overlying the LED.

34 . The lighting assembly as set forth in claim 33 , wherein the one or more light-transmissive cover each encloses one LED.

35 . The lighting assembly as set forth in claim 33 , further comprising at least one insulation displacement connector displacing a conductor insulation and electrically connecting the conductor to the printed circuit board.

36 . The lighting assembly of claim 33 , wherein said conductors comprise a plurality of flexible electrical conductors including insulation surrounding the conductors, the conductors being electrically and mechanically connected to the printed circuit board.

37 . A lighting assembly, comprising:
a printed circuit board; one or more light emitting diodes (LEDs) disposed on the printed circuit board; a plurality of flexible electrical conductors including insulation surrounding the conductors, the conductors being electrically and mechanically connected to the printed circuit board; a light-transmissive cover disposed over the one or more LEDS, said cover having a base region; and an overmolding encapsulating a portion of the printed circuit board and contacting the light-transmissive cover only at the base region thereof.

38 . A flexible lighting strip comprising at least two lighting assemblies, each lighting assembly comprised of a rectangular printed circuit board including opposed long sides and opposed short sides, at least one light emitting diode (LED) disposed on a face of the printed circuit board, a light transmissive cover disposed over said at least one LED and an overmolding encapsulating at least a portion of the printed circuit board, at least one flexible elongated conductor connecting the at least two lighting assemblies wherein said conductor is oriented at least generally parallel to the opposed long sides of each printed circuit board throughout the extent to which the conductor is adjacent each printed circuit board.

39 . The flexible lighting strip of claim 38 as installed in a channel letter and including at least one bend in the elongated conductor, said bend comprising at least about 90° and occurring between adjacent lighting assemblies.

40 . The flexible lighting strip of claim 38 wherein the bend comprises about 90°.

41 . The flexible lighting strip of claim 38 further including a light-transmissive cover encompassing the at least one LED.

42 . The flexible lighting strip of claim 41 wherein each lighting assembly is comprised of multiple LEDs, said cover encompassing the multiple LEDs.

43 . The flexible lighting strip of claim 41 wherein said cover includes an optical coating.

Assignees

• Nall Jeffrey
• Mrakovich Matthew
• Ge Lighting Solutions Llc

Inventors

• Nall Jeffrey
• Mrakovich Matthew

Classifications

• H05K2201/0209

  Inorganic, non-metallic particles · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• H05K1/0209

  External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings · CPC title

• F21V3/02

  characterised by the shape · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title